Abstract: A circuit arrangement for a mobile radio device includes a first transmission path for a first communication system with TDD duplex operation and a second transmission path for a second communication system with FDD duplex operation. The first transmission path contains a first transmission filter and the second transmission path contains a first duplexer. The first and second communication systems use transmission frequency bands that are arranged within the same octave. A transmitted signal from the first communication system can be routed switchably and thus either via the first or the second transmission path.

Abstract: A front end module includes an antenna path and a diplexer that is connected to the antenna path, to a first signal path, to a second signal path, and to a third signal path. The first signal path is for transmitting transceiver signals in at least two first frequency bands that are assigned to different transmission systems. The second signal path is for transmitting transceiver signals in at least two second frequency bands that are assigned to different transmission systems. The third signal path is for transmitting reception signals in a third frequency band.

Abstract: A band-stop filter is proposed which is constructed on a multilayered substrate and consists of a parallel circuit comprising a bandpass filter and a high-pass filter. The two filters are at least partly realized in the form of LC-elements integrated into the substrate. Further circuit components can be arranged as discrete components on the substrate. In the filter branch having the bandpass filter, an electroacoustic resonator is arranged in a transverse branch to ground. By means of the filter, a wide stop band is obtained, while the passband or passbands can comprise a plurality of radio bands.

Abstract: A band-stop filter is proposed which is constructed on a multilayered substrate and consists of a parallel circuit comprising a bandpass filter and a high-pass filter. The two filters are at least partly realized in the form of LC-elements integrated into the substrate. Further circuit components can be arranged as discrete components on the substrate. In the filter branch having the bandpass filter, an electroacoustic resonator is arranged in a transverse branch to ground. By means of the filter, a wide stop band is obtained, while the passband or passbands can comprise a plurality of radio bands.

Abstract: Circuitry includes a terminal for a high-frequency signal, at least two signal lines, a switching unit for connecting the terminal to a signal line, and a primary protection device for protecting against electrostatic discharges. The primary protection device is between the terminal and the switching unit. The primary protection device includes a first element that diverts voltages having a pulse height greater than 200V relative to a reference potential.

Abstract: An electrical component includes a first signal path and a second signal path electrically connected to a common signal path. The electrical component also includes a first filter in the first signal path and a second filter in the second signal path. The electrical component also includes a first matching circuit comprising a shunt arm to ground. The first matching circuit is electrically connected to the first signal path, the second signal path, and the common signal path.

Abstract: For simpler and more rapid testing of a front-end module, additional linked operating states are provided in the switch and/or its decoder and allow a plurality of paths to be enabled in parallel, in order in this way to test these paths with a smaller number of test routines in a test set, in particular a network analyzer.

Abstract: A circuit arrangement for a mobile radio device includes a first transmission path for a first communication system with TDD duplex operation and a second transmission path for a second communication system with FDD duplex operation. The first transmission path contains a first transmission filter and the second transmission path contains a first duplexer. The first and second communication systems use transmission frequency bands that are arranged within the same octave. A transmitted signal from the first communication system can be routed switchably and thus either via the first or the second transmission path.

Abstract: The invention relates to an electrical circuit that includes a first signal path having differential partial paths. An interface circuit arranged in the first signal path suppresses the common-mode signals in a blocking region of the signal path, but essentially does not influence differential signal parts.

Abstract: An electronic component includes a multi-layer substrate having an upper side and under side, and at least one integrated impedance converter. The electronic component also includes at least one chip component having external contacts. The at least one chip component is disposed on the upper side of the multi-layer substrate, and is electrically connected to the at least one integrated impedance converter.

Abstract: A front end module includes an antenna path and a diplexer that is connected to the antenna path, to a first signal path, to a second signal path, and to a third signal path. The first signal path is for transmitting transceiver signals in at least two first frequency bands that are assigned to different transmission systems. The second signal path is for transmitting transceiver signals in at least two second frequency bands that are assigned to different transmission systems. The third signal path is for transmitting reception signals in a third frequency band.

Abstract: A band-stop filter is proposed which is constructed on a multilayered substrate and consists of a parallel circuit comprising a bandpass filter and a high-pass filter. The two filters are at least partly realized in the form of LC-elements integrated into the substrate. Further circuit components can be arranged as discrete components on the substrate. In the filter branch having the bandpass filter, an electroacoustic resonator is arranged in a transverse branch to ground. By means of the filter, a wide stop band is obtained, while the passband or passbands can comprise a plurality of radio bands.

Abstract: The invention relates to an electrical circuit that includes a first signal path having differential partial paths. An interface circuit arranged in the first signal path suppresses the common-mode signals in a blocking region of the signal path, but essentially does not influence differential signal parts.

Abstract: A network for electrical matching of an electrical component is disclosed. The network includes n first conductor plane and a second conductor plane separated by a ceramic intermediate layer. The network also includes a transformation line formed in or on a substrate and having a predetermined electrical length. The transformation line includes a first part having a bent-over configuration and a second part having a bent-over configuration. The first part is disposed in a first plane and the second part is disposed in a second plane. The second part is electrically connected to the first part by an interlayer contact to the ceramic intermediate layer.

Abstract: An electrical component is described with a first signal path (TX, RX1) and a second signal path (RX, RX2) that are connected to a common signal path (ANT, RX12). In the first signal path a first filter (F1) is arranged, and in the second signal path a second filter (F2) is arranged. The component comprises a first matching circuit (MA1) that comprises a shunt arm to ground. In the shunt arm, an inductor (L) is arranged, which is connected to the first signal path, the second signal path, and the common signal path. The component comprises a carrier substrate (SU) on which the filters (F1, F2), which are preferably implemented as chips, are mounted. The inductor (L) is integrated in the carrier substrate (SU).

Abstract: For electrical matching of an electrical component, a network with a transformation line is proposed which is realized in or on a substrate, preferably a ceramic substrate. The network has a prescribed electrical length for achieving a desired phase shift, and comprises at least two electrical conductors (LE) each of which has a bent-over configuration (e.g. Greek fret pattern) comprising straight segments joined [sic] at right angles, in a respective conductor plane for the given conductor (LE), and which conductors (LE) are interconnected. Mutually parallel conductor segments disposed in different conductor planes partially overlap and are thereby mutually capacitively coupled, with the capacitive coupling being adjustable by adjusting of individual overlap areas, so as to achieve the prescribed electrical length and prescribed impedance of the transformation line.

Abstract: A circuit arrangement is described having a terminal (1) for a high-frequency signal, having at least two additional signal leads (21a, 21b, 21c, 22a, 22b), having a switching unit (3) for connecting the terminal (1) to a signal lead (21a, 21b, 21c, 22a, 22b), having a primary protection device (41) against electrostatic discharges, which is connected between the terminal (1) and the switching unit (3), the protection device (41) containing a first voltage limitation element (51), which diverts voltage pulses that exceed a switching voltage of 200 V to a reference potential (7). The use of a gallium arsenide double diode makes it possible to attain the advantage of a low insertion loss coupled with a low switching voltage.

Abstract: The invention provides a highly-integrated electronic component that consists of at least one chip component (CB), especially a filter operating with acoustic waves, and a multi-layer substrate, wherein the multi-layer substrate comprises integrated circuit elements for impedance transformation (IW) and additional integrated circuit elements, and serves as carrier substrate for chip components and discrete circuit elements (SE) disposed on their upper side. The component according to the invention makes it possible to implement multiple signal processing functions in one compact component, wherein especially the impedance of a chip component disposed on the multi-layer substrate is to be changed from a characteristic value to another predetermined value.