Patents by Inventor ANDREAS R. PACHL

ANDREAS R. PACHL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package for debugging and related fabrication methods
    Patent number: 9548263
    Abstract: Electronic device packages and related fabrication methods are provided. An exemplary electronic device includes a semiconductor die having debug circuitry fabricated thereon, a framing structure including an interior portion having the semiconductor die mounted thereto, and a conductive element providing an electrical connection between the interior portion and a contact pad on the semiconductor die that corresponds or is otherwise coupled to an interface of the debug circuitry.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: January 17, 2017
    Assignee: NXP USA, Inc.
    Inventors: Damon Peter Broderick, Dirk Heisswolf, Andreas R. Pachl
  • SEMICONDUCTOR DEVICE PACKAGE FOR DEBUGGING AND RELATED FABRICATION METHODS
    Publication number: 20160372405
    Abstract: Electronic device packages and related fabrication methods are provided. An exemplary electronic device includes a semiconductor die having debug circuitry fabricated thereon, a framing structure including an interior portion having the semiconductor die mounted thereto, and a conductive element providing an electrical connection between the interior portion and a contact pad on the semiconductor die that corresponds or is otherwise coupled to an interface of the debug circuitry.
    Type: Application
    Filed: June 16, 2015
    Publication date: December 22, 2016
    Inventors: DAMON PETER BRODERICK, DIRK HEISSWOLF, ANDREAS R. PACHL