Abstract: A projection exposure apparatus for semiconductor lithography, comprising at least one optical element. At least one actuator for deforming an optically effective surface of the optical element is arranged on a back side of the optical element. The actuator is configured to exert compressive or tensile forces on the optical element perpendicular to the optically effective surface. The at least one actuator is in a cutout in a main body of the optical element. A method for fixing an actuator in a cutout in a main body of an optical element, which method comprises: providing the actuator and at least one radial clamping element; inserting the actuator and the radial clamping element into the cutout, wherein the radial clamping element is arranged between the actuator and an inner surface of the cutout; and bracing the clamping element for the purpose of fixing the actuator.

Abstract: An optical module comprises an optical element and a stiffening body. The optical element comprises an optical effective surface. The optical element is connected to the stiffening body by way of a connection element. The connection element comprises a decoupling region which mechanically decouples the stiffening body and the optical element parallel to the optical effective surface.

Abstract: A projection lens comprises an optical module. A semiconductor microlithographic projection exposure apparatus comprises a projection lens comprising such an optical module. The optical module can comprise: an optical element comprising a first segment and a second segment; a stiffening body; a connection element connecting the optical element and the stiffening body; and a lateral decoupling element between the first segment and the stiffening body.

Abstract: An optical assembly for semiconductor lithography comprises an optical element and an actuator for deforming the optical element. The actuator is constructed from at least three sections, which include at least first and second group of sections that are controllable in each case via a controller are present. The first group serves for coarse actuation, and the second group serves for fine actuation. The controller is configured to control the groups independently of one another and the sections of a group jointly. The controller is furthermore configured to variably set the number of sections controlled jointly per group. Furthermore, the disclosure relates to a projection exposure apparatus equipped with the assembly, and to a method for controlling the optical assembly.

Abstract: An adaptive mirror for a microlithographic projection exposure apparatus comprises: a mirror substrate; an optical effective surface; a reflective layer system for reflecting electromagnetic radiation incident on the optical effective surface; an actuator layer for producing a locally variable deformation of the optical effective surface; and a mediator layer between the actuator layer and the reflective layer system. The mediator layer comprises an elastic mechanical mediator layer. The elastic mechanical mediator layer can be 0.1 mm and 50 mm thick and can have a modulus of elasticity of between 10 GPa and 300 GPa. A microlithographic projection exposure apparatus comprises such an adaptive mirror.

Abstract: An optical system, such as in a microlithographic projection exposure apparatus, comprising at least one optical element and a heating device for heating the optical element. The heating device comprises a plurality of heating segments to which electric current can be applied in order to generate heat. A continuous thermally induced deformation profile of the optical active surface having a deformation amplitude of at least 1? can be adjusted by the heating segments so that the integral of the Fourier decomposition over at least one decadic spatial wavelength range is less than 10 m?.

Abstract: A projection exposure apparatus comprises an optical element. The optical element comprises a main body and an actuator for deforming an optically effective surface formed on the main body. The actuator is in a recess in the rear side of the main body.

Abstract: A mirror device, such as for a microlithographic projection exposure system, comprises a mirror, a sensor unit and a control unit. The mirror comprises a mirror body and a reflective surface provided on the mirror body. The sensor unit comprises a sensor element and a signal path extending to the control unit to transmit a measurement signal representing the temperature of the sensor element to the control unit. The sensor element is provided in the substrate of the mirror body. The sensor element comprises a plurality of electrical conductor paths integrated in the substrate of the mirror body. The conductor paths form a plurality of crossing points electrically conductively connecting the conductor paths to one another.

Abstract: A mirror device, for example for a microlithographic projection exposure system, comprises a mirror, a sensor unit and a control unit. The mirror comprises a mirror body and a reflective surface provided on the mirror body. The sensor unit is designed to detect infrared radiation given off by the mirror body in order to derive a temperature measurement value therefrom and to send the temperature measurement value to the control unit. The mirror comprises a target with an increased emissivity for infrared radiation. The disclosure also relates to a method for measuring the temperature of a mirror.

Abstract: An optical assembly of a projection exposure apparatus for semiconductor lithography comprises an optical element and an actuator for deforming the optical element. The actuator is subjected to a bias voltage by a controller that is present. A projection exposure apparatus for semiconductor lithography comprises an optical assembly. A method for operating an actuator for deforming an optical element for semiconductor lithography comprises subjecting the actuator to a bias voltage by a controller.

Abstract: An optical element for a projection exposure apparatus for semiconductor lithography comprises a main body and at least two actuators connected to the main body. The actuators are designed for deforming an optical effective surface of the optical element. The at least two actuators are ring actuators. A corresponding apparatus comprises such an optical element.

Abstract: An actuator for semiconductor lithography comprises an actuator element, a compensation element and a connection element. The actuator element has a first coefficient of thermal expansion and a connection site at its first end for the active adjustment of an optical element along at least one adjustment axis. The compensation element has a second coefficient of thermal expansion. The sign of the second coefficient of thermal expansion corresponds to the sign of the first coefficient of thermal expansion. The compensation element is oriented coaxially in relation to the adjustment axis. The compensation element has a coupling site held stationary in space or stationary in relation to the optical element. The connection element connects the actuator element and the compensation element at positions located remote from the connection site and from the coupling site. A deformation mirror includes a mirror substrate and an actuator.

Abstract: A projection exposure apparatus comprises an optical element. The optical element comprises a main body and an actuator for deforming an optically effective surface formed on the main body. The actuator is in a recess in the rear side of the main body.

Abstract: An optical assembly for semiconductor lithography comprises an optical element and an actuator for deforming the optical element. The actuator is constructed from at least three sections, which include at least first and second group of sections that are controllable in each case via a controller are present. The first group serves for coarse actuation, and the second group serves for fine actuation. The controller is configured to control the groups independently of one another and the sections of a group jointly. The controller is furthermore configured to variably set the number of sections controlled jointly per group. Furthermore, the disclosure relates to a projection exposure apparatus equipped with the assembly, and to a method for controlling the optical assembly.

Abstract: An optical assembly of a projection exposure apparatus for semiconductor lithography comprises an optical element and an actuator for deforming the optical element. The actuator is subjected to a bias voltage by a controller that is present. A projection exposure apparatus for semiconductor lithography comprises an optical assembly. A method for operating an actuator for deforming an optical element for semiconductor lithography comprises subjecting the actuator to a bias voltage by a controller.