Patents by Inventor Andreas Rebmann

Andreas Rebmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and chip module
    Patent number: 7355125
    Abstract: The present invention relates to computer hardware design and in particular to a printed circuit board comprising wiring dedicated to supply electric board components such as integrated circuits with at least three different reference planes. In order to provide a printed circuit board having an improved signal return path for basically all relevant signal layers at transitions between card, connector, module and chip while still holding the cross-section structure simple, it is proposed to establish a layer structure wherein a) a split voltage plane is located adjacent to one side of one of said reference planes and comprises conducting portions for all of said at least three different voltage levels in respective plane parts, and b) a signal layer being located adjacent to said reference planes.
    Type: Grant
    Filed: November 17, 2005
    Date of Patent: April 8, 2008
    Assignee: International Business Machines Corporation
    Inventors: Wiren D. Becker, Bruce J. Chamberlin, Roland Frech, Andreas Huber, George Katopis, Erich Klink, Andreas Rebmann, Thomas-Michael Winkel
  • Printed circuit board and chip module
    Publication number: 20070109726
    Abstract: The present invention relates to computer hardware design and in particular to a printed circuit board comprising wiring dedicated to supply electric board components such as integrated circuits with at least three different reference planes. In order to provide a printed circuit board having an improved signal return path for basically all relevant signal layers at transitions between card, connector, module and chip while still holding the cross-section structure simple, it is proposed to establish a layer structure wherein a) a split voltage plane is located adjacent to one side of one of said reference planes and comprises conducting portions for all of said at least three different voltage levels in respective plane parts, and b) a signal layer being located adjacent to said reference planes.
    Type: Application
    Filed: November 17, 2005
    Publication date: May 17, 2007
    Applicant: International Business Machines Corporation
    Inventors: Wiren Becker, Bruce Chamberlin, Roland Frech, Andreas Huber, George Katopis, Erich Klink, Andreas Rebmann, Thomas-Michael Winkel