Abstract: The invention relates to an LED package for UV light comprising an optoelectronic device which, in particular as a volume emitter, is designed to emit light in the ultraviolet spectrum during operation. The component is arranged on a carrier with two contact pads for electrical contacting. Furthermore, a frame surrounding the component and arranged on the carrier is provided with a gas-impermeable outlet region lying in a main radiation direction, so that a hermetically sealed cavity comprising an inner region of the carrier is formed, the side walls of the frame facing the optoelectronic device being bevelled and opening towards the main radiation direction. An ESD protection element arranged outside the inner area on the carrier is electrically connected to at least one of the two contact pads.

Abstract: The invention relates to an LED package for UV light comprising an optoelectronic device which, in particular as a volume emitter, is designed to emit light in the ultraviolet spectrum during operation. The component is arranged on a carrier with two contact pads for electrical contacting. Furthermore, a frame surrounding the component and arranged on the carrier is provided with a gas-impermeable outlet region lying in a main radiation direction, so that a hermetically sealed cavity comprising an inner region of the carrier is formed, the side walls of the frame facing the optoelectronic device being beveled and opening towards the main radiation direction. An ESD protection element arranged outside the inner area on the carrier is electrically connected to at least one of the two contact pads.

Abstract: A method for producing optoelectronic semiconductor components may include applying optoelectronic semiconductor chips for generating radiation to a carrier, producing a potting around the semiconductor chips with a potting top side facing away from the carrier such that the semiconductor chips remain free of a reflective potting material. The potting has trenches between the semiconductor chips, and the trenches are arranged at a distance from the semiconductor chips; the trenches do not touch the semiconductor chips. The method may further include filling the trenches with a supporting material to form at least one supporting body and leaving the potting alongside the trenches free of the supporting material.

Abstract: An electronic semiconductor component with a housing structure and a cavity introduced into the housing structure is specified. The cavity comprises a base surface. Furthermore, the electronic semiconductor component comprises an auxiliary layer arranged on the base surface of the cavity and a marking penetrating the auxiliary layer at least as far as the base surface of the cavity. The marking comprises an optical contrast that depends on both an optical property of the housing structure and an optical property of the auxiliary layer. Furthermore, a method for producing an electronic semiconductor component is given.

Abstract: A radiation-emitting component is specified with—a carrier which has a top surface a radiation-emitting semiconductor chip arranged on the top surface of the carrier and configured to generate primary electromagnetic radiation, a first reflector layer arranged above a top surface of the semiconductor chip, and a cover body arranged between the first reflector layer and the radiation-emitting semiconductor chip, wherein a side surface of the cover body is inclined to the top surface of the carrier. Furthermore, a method for producing such a radiation-emitting component is specified.

Abstract: An electronic semiconductor component with a housing structure and a cavity introduced into the housing structure is specified. The cavity comprises a base surface. Furthermore, the electronic semiconductor component comprises an auxiliary layer arranged on the base surface of the cavity and a marking penetrating the auxiliary layer at least as far as the base surface of the cavity. The marking comprises an optical contrast that depends on both an optical property of the housing structure and an optical property of the auxiliary layer. Furthermore, a method for producing an electronic semiconductor component is given.

Abstract: The invention relates to an optoelectronic semiconductor component (20) comprising a carrier comprising an integrated circuit, an optoelectronic semiconductor chip (22) which is arranged on the carrier (21), a molded body which surrounds the carrier at least in places in lateral directions and which covers the carrier in places on a side facing away from the optoelectronic semiconductor chip, and at least two through-connections which extend from an underside of the semiconductor component facing away from the optoelectronic semiconductor chip through the molded body to the carrier, and which comprise an electrically conductive material, the integrated circuit being provided for actuating and/or controlling the optoelectronic semiconductor chip. The invention also relates to a method of manufacturing an optoelectronic semiconductor component.

Abstract: The invention relates to an optoelectronic component having: a carrier; an optoelectronic semiconductor chip; an insulation layer, which has an electrically insulating material; and a first contact layer, which has an electrically conductive material. According to the invention, the insulation layer is arranged on the carrier and has a cavity; the semiconductor chip is arranged in the cavity; the first contact layer is arranged between the semiconductor chip and the carrier and between the insulation layer and the carrier; and the first contact layer has at least one interruption, such that the carrier is free of the first contact layer at least in some parts in the region of the cavity.

Abstract: A method for producing optoelectronic semiconductor components may include applying optoelectronic semiconductor chips for generating radiation to a carrier, producing a potting around the semiconductor chips with a potting top side facing away from the carrier such that the semiconductor chips remain free of a reflective potting material. The potting has trenches between the semiconductor chips, and the trenches are arranged at a distance from the semiconductor chips; the trenches do not touch the semiconductor chips. The method may further include filling the trenches with a supporting material to form at least one supporting body and leaving the potting alongside the trenches free of the supporting material.

Abstract: A linear encoder that includes a housing having: an elongated hollow profile section including a first face end and a second face end; a cap disposed on the first face end; and a seal which is disposed in sealing fashion between the hollow profile section and the cap, wherein the seal includes an electrically conductive connecting element. The linear encoder further includes a scale made of electrically nonconductive material, wherein the scale is disposed inside the housing and the scale includes a measuring graduation that is scannable by a scanning unit, which is movable in a measurement direction relative to the housing. The linear encoder includes a shunt made of electrically conductive material, wherein the shunt is mounted on the scale and extends in the measurement direction and wherein the electrically conductive connecting element is configured so as to establish an electrical connection between the shunt and at least one of the hollow profile section and the cap.

Abstract: An optical sensor (10) for fitting to a washing machine or dishwasher is proposed, comprising: a housing (16), an arrangement, which is housed in the housing, of optical components, the optical components comprising a controllable light emitter (26) and a first and a second light receiver (28, 30), and an electronic analysis and control unit (36) which is connected to the light emitter (26) and the two light receivers (28, 30), the first light receiver (28) being arranged at the end of a first light measurement path (54) which starts at the light emitter (26) and runs on a portion outside the housing (16), and the second light receiver (30) being arranged at the end of a second light measurement path (56) which starts at the light emitter (26), and when the sensor is fitted to the machine as specified, the first light measurement path running on a portion through a washing space (14) of the machine, and is the second light measurement path running completely outside this washing space, the analysis and contro

Abstract: An optical sensor (10) for fitting to a washing machine or dishwasher is proposed, comprising: a housing (16), an arrangement, which is housed in the housing, of optical components, the optical components comprising a controllable light emitter (26) and a first and a second light receiver (28, 30), and an electronic analysis and control unit (36) which is connected to the light emitter (26) and the two light receivers (28, 30), the first light receiver (28) being arranged at the end of a first light measurement path (54) which starts at the light emitter (26) and runs on a portion outside the housing (16), and the second light receiver (30) being arranged at the end of a second light measurement path (56) which starts at the light emitter (26), and when the sensor is fitted to the machine as specified, the first light measurement path running on a portion through a washing space (14) of the machine, and is the second light measurement path running completely outside this washing space, the analysis and contro

Abstract: A linear encoder that includes a housing having: an elongated hollow profile section including a first face end and a second face end; a cap disposed on the first face end; and a seal which is disposed in sealing fashion between the hollow profile section and the cap, wherein the seal includes an electrically conductive connecting element. The linear encoder further includes a scale made of electrically nonconductive material, wherein the scale is disposed inside the housing and the scale includes a measuring graduation that is scannable by a scanning unit, which is movable in a measurement direction relative to the housing. The linear encoder includes a shunt made of electrically conductive material, wherein the shunt is mounted on the scale and extends in the measurement direction and wherein the electrically conductive connecting element is configured so as to establish an electrical connection between the shunt and at least one of the hollow profile section and the cap.