Abstract: In a method for producing a laser diode, a number of laser diodes are produced on a wafer. The wafer is broken down into wafer pieces, each wafer piece having a plurality of laser diodes being arranged side by side. One wafer piece is inserted into a first mount that includes a first covering element overlapping a front face of the wafer piece and shadowing a bottom area of the front face of the wafer piece. A minor layer is deposited on an unshadowed upper area of the wafer piece's front face. The wafer piece is inserted into a second mount, which includes a second covering element that shadows the minor layer of the upper area of the front face. An electrically conductive contact layer is deposited on an unshadowed bottom area of the wafer piece's front face. The wafer piece is subsequently broken down into individual laser diodes.

Abstract: Laser diode apparatus, comprising a carrier (1) having a carrier top (11), a laser diode chip (4) arranged on the carrier top (11) emitting, during operation, electromagnetic radiation through a radiating face (5), which radiating face (5) runs perpendicularly to the carrier top (11), and at least one optical element (6) to deflect at least some of the electromagnetic radiation radiated by the laser diode chip (4) perpendicularly to the carrier top (11). By the use of a plurality of laser diode chips having wavelengths that differ very slightly from one another, speckles can be reduced. By means of a retarder plate (8) between the laser diode chip and the optical element it is possible to influence the polarization. A polarization cube enables the deflected light beam bundles to fully cover one another as differently polarized light beam bundles.

Abstract: A method for producing a laser device having a laser configured in order to emit a laser beam, a lens (31) which is positionally adjusted with respect to the laser, and a lens holder having at least two parts (2a, b, c) then following one another in a propagation direction (3) of the laser beam, of which at least two lens holder parts (2a, b, c) each have an end side oriented obliquely with respect to the propagation direction (3) and can be brought into a multiplicity of relative positions with respect to one another, respectively, with their end sides oriented obliquely with respect to the propagation direction (3) bearing on one another, wherein the length of the lens holder (1) in the propagation direction (3) is adjusted by selecting one of the relative positions.

Abstract: Laser diode apparatus, comprising a carrier (1) having a carrier top (11), a laser diode chip (4) arranged on the carrier top (11) emitting, during operation, electromagnetic radiation through a radiating face (5), which radiating face (5) runs perpendicularly to the carrier top (11), and at least one optical element (6) to deflect at least some of the electromagnetic radiation radiated by the laser diode chip (4) perpendicularly to the carrier top (11). By the use of a plurality of laser diode chips having wavelengths that differ very slightly from one another, speckles can be reduced. By means of a retarder plate (8) between the laser diode chip and the optical element it is possible to influence the polarisation. A polarisation cube enables the deflected light beam bundles to fully cover one another as differently polarised light beam bundles.

Abstract: In a method for producing a laser diode, a number of laser diodes are produced on a wafer. The wafer is broken down into wafer pieces, each wafer piece having a plurality of laser diodes being arranged side by side. One wafer piece is inserted into a first mount that includes a first covering element overlapping a front face of the wafer piece and shadowing a bottom area of the front face of the wafer piece. A minor layer is deposited on an unshadowed upper area of the wafer piece's front face. The wafer piece is inserted into a second mount, which includes a second covering element that shadows the minor layer of the upper area of the front face. An electrically conductive contact layer is deposited on an unshadowed bottom area of the wafer piece's front face. The wafer piece is subsequently broken down into individual laser diodes.

Abstract: A method for producing a laser device having a laser configured in order to emit a laser beam, a lens (31) which is positionally adjusted with respect to the laser, and a lens holder having at least two parts (2a, b, c) then following one another in a propagation direction (3) of the laser beam, of which at least two lens holder parts (2a, h, c) each have an end side oriented obliquely with respect to the propagation direction (3) and can be brought into a multiplicity of relative positions with respect to one another, respectively, with their end sides oriented obliquely with respect to the propagation direction (3) bearing on one another, wherein the length of the lens holder (1) in the propagation direction (3) is adjusted by selecting one of the relative positions.