Abstract: A method is provided for carrying out a sound test for detecting and/or analyzing material faults and/or mounting faults of at least one component, in which the component is excited, by striking, to experience vibrations which generate soundwaves, after which the generated soundwaves are detected and conclusions are drawn about material faults and/or mounting faults on the basis of the detected soundwaves, wherein the striking of the component and the detection of the vibrations are carried out using an endoscope device. In addition, embodiments of the present invention relates to an endoscope device which is configured to carry out the method.