Abstract: A semiconductor package is manufactured by providing a semiconductor die with a terminal at a first side of the die, providing a material coupled to the die at an opposing second side of the die and embedding the die in a molding compound so that the die is covered by the molding compound on all sides except the first side. The molding compound is thinned at a side of the molding compound adjacent the second side of the die, to expose the material at the second side of the die without exposing the second side of the die. An electrical connection is formed to the terminal at the first side of the die. In the case of a transistor die, the terminal can be a source terminal and the transistor die can be attached source-down to a metal block such as a die paddle of a lead frame.

Abstract: A semiconductor package is manufactured by providing a semiconductor die with a terminal at a first side of the die, providing a material coupled to the die at an opposing second side of the die and embedding the die in a molding compound so that the die is covered by the molding compound on all sides except the first side. The molding compound is thinned at a side of the molding compound adjacent the second side of the die, to expose the material at the second side of the die without exposing the second side of the die. An electrical connection is formed to the terminal at the first side of the die. In the case of a transistor die, the terminal can be a source terminal and the transistor die can be attached source-down to a metal block such as a die paddle of a lead frame.

Abstract: A device (4) comprises a container (40) for a liquid coolant (41) that is disposed between the axis (1) and the surface (30) facing the axis to co-rotate with the surface. The device is further provided with an atomizer nozzle (42) of the container, facing the surface, from which the coolant is discharged during rotation of the container due to the centrifugal force (F) acting upon the coolant of the container in the form of an atomized jet (43) that strikes the surface. The device cools a surface of an electronic device (3) that runs hot, the electronic device supplying the X-ray source of a computer tomograph with power and rotating about the axis of the gantry (2) of the tomograph.

Abstract: The invention relates to a semiconductor component with enhanced avalanche ruggedness. At the nominal current of this semiconductor component, in the event of an avalanche the voltage applied between two electrodes is 6 % or more above the static reverse voltage at the same temperature.

Abstract: A device (4) comprises a container (40) for a liquid coolant (41) that is disposed between the axis (1) and the surface (30) facing the axis to co-rotate with the surface. The device is further provided with an atomizer nozzle (42) of the container, facing the surface, from which the coolant is discharged during rotation of the container due to the centrifugal force (F) acting upon the coolant of the container in the form of an atomized jet (43) that strikes the surface. The device cools a surface of an electronic device (3) that runs hot, the electronic device supplying the X-ray source of a computer tomograph with power and rotating about the axis of the gantry (2) of the tomograph.

Abstract: The invention relates to a semiconductor component with enhanced avalanche resistance. At the nominal current of this semiconductor component, in the event of an avalanche the voltage applied between two electrodes is 6% or more above the static reverse voltage at the same temperature.