Patents by Inventor Andreas Siebert

Andreas Siebert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND DEVICE FOR THERMALLY COUPLING A HEAT SINK TO A COMPONENT
    Publication number: 20130120939
    Abstract: A heat sink is thermally coupled to a component with a thermal filler and an intermediate layer applied between the heat sink and the component. The intermediate layer is formed with apertures and the heat sink is pressed against the component with a given force in order for the thermal filler to penetrate the apertures of the intermediate layer.
    Type: Application
    Filed: May 21, 2010
    Publication date: May 16, 2013
    Applicant: NOKIA SIEMENS NETWORKS OY
    Inventors: Stefan Voss, Andreas Siebert