Patents by Inventor Andreas Stolzenberg

Andreas Stolzenberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7665861
    Abstract: An LED module for illumination systems is provided that can be installed in and connected to an illumination system in a simple way both electrically and mechanically, and that ensures the greatest possible flexibility with reference to its possible uses. The LED module has a plurality of light-emitting diodes (2) arranged on a carrier plate (1), the carrier plate (1) being provided with at least one electrical connecting device (12) for electrically connecting the LED module, and with a fastening device (5) for fastening the LED module in an illumination system.
    Type: Grant
    Filed: July 9, 2002
    Date of Patent: February 23, 2010
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Simon Blümel, Christian Hacker, Andreas Stolzenberg
  • Patent number: 7655879
    Abstract: A method for producing permanent integral connections of oxide-dispersed metallic materials by welding. The materials or components to be connected are overlapped to form an overlapping region in a joining region of the overlapping region. The materials or components are heated below the melting temperatures of the materials and are welded to at least partially form a diffusion bond by a welding method. A noble metal foil may be between the components to be connected. The diffusion bond is heated subsequently to a temperature below the melting temperature of the materials or components and the bond is mechanically recompacted by hammering.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: February 2, 2010
    Assignee: Schott AG
    Inventors: Jorg Witte, Manfred Borens, Franz-Peter Eckes, Stefen Bauer, Helmut Schoppe, Andreas Stolzenberg, Stefan Friedrich Melchior, Robert Ruehl
  • Patent number: 7553550
    Abstract: A method for producing permanent integral connections of oxide-dispersed metallic materials by welding. The materials or components to be connected are overlapped to form an overlapping region in a joining region of the overlapping region. The materials or components are heated below the melting temperatures of the materials and are welded to at least partially form a diffusion bond by a welding method. A noble metal foil may be between the components to be connected. The diffusion bond is heated subsequently to a temperature below the melting temperature of the materials or components and the bond is mechanically recompacted by hammering.
    Type: Grant
    Filed: February 23, 2006
    Date of Patent: June 30, 2009
    Assignee: Schott AG
    Inventors: Jorg Witte, Manfred Borens, Franz-Peter Eckes, Stefen Bauer, Helmut Schoppe, Andreas Stolzenberg, Stefan Friedrich Melchior, Robert Ruehl
  • Publication number: 20060201998
    Abstract: A method for producing permanent integral connections of oxide-dispersed metallic materials by welding. The materials or components to be connected are overlapped to form an overlapping region in a joining region of the overlapping region. The materials or components are heated below the melting temperatures of the materials and are welded to at least partially form a diffusion bond by a welding method. A noble metal foil may be between the components to be connected. The diffusion bond is heated subsequently to a temperature below the melting temperature of the materials or components and the bond is mechanically recompacted by hammering.
    Type: Application
    Filed: May 12, 2006
    Publication date: September 14, 2006
    Inventors: Jorg Witte, Manfred Borens, Franz-Peter Eckes, Stefan Bauer, Helmut Schoppe, Andreas Stolzenberg, Stefan Melchior, Robert Ruehl
  • Publication number: 20060138094
    Abstract: A method for producing permanent integral connections of oxide-dispersed metallic materials by welding. The materials or components to be connected are overlapped to form an overlapping region in a joining region of the overlapping region. The materials or components are heated below the melting temperatures of the materials and are welded to at least partially form a diffusion bond by a welding method. A noble metal foil may be between the components to be connected. The diffusion bond is heated subsequently to a temperature below the melting temperature of the materials or components and the bond is mechanically recompacted by hammering.
    Type: Application
    Filed: February 23, 2006
    Publication date: June 29, 2006
    Inventors: Jorg Witte, Manfred Borens, Franz-Peter Eckes, Stefan Bauer, Helmut Schoppe, Andreas Stolzenberg, Stefan Melchior, Robert Ruehl
  • Patent number: 7038160
    Abstract: A method for producing permanent integral connections of oxide-dispersed metallic materials by welding. The materials or components to be connected are overlapped to form an overlapping region in a joining region of the overlapping region. The materials or components are heated below the melting temperatures of the materials and are welded to at least partially form a diffusion bond by a welding method. A noble metal foil may be between the components to be connected. The diffusion bond is heated subsequently to a temperature below the melting temperature of the materials or components and the bond is mechanically recompacted by hammering.
    Type: Grant
    Filed: August 18, 2003
    Date of Patent: May 2, 2006
    Assignee: Schott Glas
    Inventors: Jorq Witte, Manfred Borens, Franz-Peter Eckes, Stefan Bauer, Helmut Schoppe, Andreas Stolzenberg, Stefan Freidrich Melchior, Robert Ruehl
  • Publication number: 20040240229
    Abstract: An LED module for illumination systems is provided that can be installed in and connected to an illumination system in a simple way both electrically and mechanically, and that ensures the greatest possible flexibility with reference to its possible uses. The LED module has a plurality of light-emitting diodes (2) arranged on a carrier plate (1), the carrier plate (1) being provided with at least one electrical connecting device (12) for electrically connecting the LED module, and with a fastening device (5) for fastening the LED module in an illumination system.
    Type: Application
    Filed: June 28, 2004
    Publication date: December 2, 2004
    Applicant: Osram Opto Semiconductors GmbH
    Inventors: Simon Blumel, Christian Hacker, Andreas Stolzenberg
  • Publication number: 20040035855
    Abstract: A method for producing permanent integral connections of oxide-dispersed metallic materials by welding. The materials or components to be connected are overlapped to form an overlapping region in a joining region of the overlapping region. The materials or components are heated below the melting temperatures of the materials and are welded to at least partially form a diffusion bond by a welding method. A noble metal foil may be between the components to be connected. The diffusion bond is heated subsequently to a temperature below the melting temperature of the materials or components and the bond is mechanically recompacted by hammering.
    Type: Application
    Filed: August 18, 2003
    Publication date: February 26, 2004
    Applicant: SCHOTT GLAS
    Inventors: Jorg Witte, Manfred Borens, Franz-Peter Eckes, Stefan Bauer, Helmut Schoppe, Andreas Stolzenberg, Stefan Freidrich Melchior, Robert Ruehl