Abstract: A method of producing a composition in powder form involves the following steps (a) to (c): (a) providing highly dispersed silica particles, hydrophobic silica particles, and a cationic surfactant; (b) forming primary hydrophobic silica particles carrying the cationic surfactant on their surface and/or agglomerates of these primary particles; and (c) mixing the highly dispersed silica particles with the product obtained in step (b), thereby obtaining the composition in powder form; and a composition in powder form obtainable by the method.

Abstract: Thus, the present invention provides a composition in powder form comprising highly dispersed silica particles, polymethylsiloxane particles, and a cationic surfactant, wherein at least 25% by weight of the cationic surfactant is present in primary polymethylsiloxane particles carrying the cationic surfactant on their surface and/or in agglomerates of these primary particles.

Abstract: A method and a device (4) for testing an integrated circuit (DUT) uses a stress signal and surface monitoring. A stress signal generator (5) is connected to the integrated circuit (DUT) to apply the stress signal (v(t)) to the integrated circuit. A failure is observed in real time by monitoring the surface (6) of the integrated circuit (DUT) during a monitoring time window (&Dgr;T) by an emission microscope (10) having a controllable shutter (15). The time window has a predetermined relation with respect to the duration of the stress signal.