Abstract: A device for electrical interconnection of cells of a battery pack through cell connectors, and a battery pack having the device and the cell connectors are provided. A plurality of cell connectors for connection of at least two cell poles are fitted on a mounting plate, electrically isolated from one another. Each cell connector has at least one flexible bracket which extends away from a connection area. The flexible brackets are coupled to the connection area through a resilient structure having a meandering shape.

Abstract: A device for electrical interconnection of cells (12) of a battery pack (11) by means of cell connectors (15) and a battery pack (11) having such cell connectors (15) are distinguished as being convenient for assembly and functionally reliable in that at least one mounting plate (16), which can be latched on the battery pack (11) in a mounting frame (17), is fitted with cell connectors (15) which are electrically isolated from one another, on the basis of the geometric requirement of cell poles (13) to be interconnected to one another, which cell connectors (15) each have flexible brackets (19) for their apex areas (23) to make elastic contact with the end surfaces (26) of cell poles (13). The brackets (19), which are supported by one flank in the form of a flexible spring on the mounting plate (16), are part of a stamped grid, which also comprises conductor tracks (32) which are integrally connected thereto, for example for connection of a battery management means.

Abstract: In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired.

Abstract: The invention relates to a method for repairing components that consist of a superalloy. The method comprises the following steps: a solder material is applied to the repair site; the repair site with the applied solder material is heated until the latter melts; and the melted solder material is left to solidify. A powder blend, whose average composition corresponds to the component alloy constitutes the solder material, the blend comprising at least one elementary powder of the component alloy as one powder type and/or a pre-alloy of the component alloy.

Abstract: The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.

Abstract: The invention relates to a method for repairing components that consist of superalloys, in particular for repairing components that consist of a superalloy with an aligned microstructure in such a way that the repaired site likewise has an aligned microstructure. The method comprises the following steps: a solder material is applied to the repair site; the repair site with the applied solder material is heated until the latter melts; and the melted solder material is left to solidify. The solder material is an alloy with the same alloy components as the component alloy. At least the fraction of one alloy component in the solder material composition is modified in relation to the fraction of that alloy component in the component alloy composition, in such a way that the melting temperature of the solder material is reduced in relation to the melting temperature of the component alloy.

Abstract: In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired.

Abstract: The invention relates to a method for repairing components that consist of superalloys, in particular for repairing components that consist of a superalloy with an aligned microstructure in such a way that the repaired site likewise has an aligned microstructure. The method comprises the following steps: a solder material is applied to the repair site; the repair site with the applied solder material is heated until the latter melts; and the melted solder material is left to solidify. The solder material is an alloy with the same alloy components as the component alloy. At least the fraction of one alloy component in the solder material composition is modified in relation to the fraction of that alloy component in the component alloy composition, in such a way that the melting temperature of the solder material is reduced in relation to the melting temperature of the component alloy.

Abstract: The invention relates to a method for repairing components that consist of a superalloy. The method comprises the following steps: a solder material is applied to the repair site; the repair site with the applied solder material is heated until the latter melts; and the melted solder material is left to solidify. A powder blend, whose average composition corresponds to the component alloy constitutes the solder material, the blend comprising at least one elementary powder of the component alloy as one powder type and/or a pre-alloy of the component alloy.

Abstract: The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.

Abstract: A high-temperature component made of a nickel super-alloy has the following composition in wt %: 11-13% of Cr, 3-5% of W, 0.5-2.5% of Mo, 3-5% of Al, 3-5% of Ti, 3-7% of Ta, 1-5% of Re and a remainder of nickel.

Abstract: A high-temperature component made of a nickel super-alloy has the following composition in wt %: 11–13% of Cr, 3–5% of W, 0.5–2.5% of Mo, 3–5% of Al, 3–5% of Ti, 3–7% of Ta, 1–5% of Re and a remainder formed of nickel. A corresponding component which is also provided is formed of an alloy having a composition essentially similar to that mentioned above, but with the rhenium proportion replaced with 0.1–5 wt % of ruthenium.

Abstract: A high-temperature component made of a nickel super-alloy has the following composition in wt %: 11-13% of Cr, 3-5% of W, 0.5-2.5% of Mo, 3-5% of Al, 3-5% of Ti, 3-7% of Ta, 1-5% of Re and a remainder formed of nickel. A corresponding component which is also provided is formed of an alloy having a composition essentially similar to that mentioned above, but with the rhenium proportion replaced with 0.1-5 wt % of ruthenium.