Abstract: A multi-junction solar cell having at least three p-n junctions is proposed, which comprises a rear-side subcell comprising GaSb, which has at least one p-n junction, and a front-side subcell which has at least two p-n junctions and which is characterised in that the rear-side subcell has a ?2%, in particular >4%, larger lattice constant than the front-side subcell and the two subcells are connected to each other via an optically transparent and electrically conductive wafer-bond connection. The multi-junction solar cell achieves a high absorption up to the band gap energy of the lowermost GaSb-comprising subcell and a photoelectric voltage which is increased relative to multi-junction solar cells from the state of the art. Furthermore, methods for the production of the multi-junction solar cell according to the invention are presented and uses of the multi-junction solar cell according to the invention are indicated.

Abstract: The present disclosure relates to a method for manufacturing a multi-junction solar cell device comprising the steps of: providing a first engineered substrate; providing a second substrate; forming at least one first solar cell layer on the first engineered substrate to obtain a first wafer structure; forming at least one second solar cell layer on the second substrate to obtain a second wafer structure; bonding the first wafer structure to the second wafer structure; detaching the first engineered substrate; removing the second substrate; and bonding a third substrate to the at least one first solar cell layer.

Abstract: The present disclosure relates to a method for manufacturing a multi-junction solar cell device comprising the steps of: providing a first substrate, providing a second substrate having a lower surface and an upper surface, forming at least one first solar cell layer on the first substrate to obtain a first wafer structure, forming at least one second solar cell layer on the upper surface of the second substrate to obtain a second wafer structure, and bonding the first wafer structure to the second wafer structure, wherein the at least one first solar cell layer is bonded to the lower surface of the second substrate and removing the first substrate.