Patents by Inventor Andreas Wick

Andreas Wick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140020864
    Abstract: A homogenisation device which is in particular suitable to homogenise a temperature distribution in a fluid stream exiting a heat exchanger comprises a body with a fluid flow passage extending there through. The homogenisation device further includes a flow control device which is disposed in the fluid flow passage and which is configured to induce a swirl in an outer layer of a fluid stream flowing through the fluid flow passage, while the flow characteristics of a core layer of the fluid stream remain substantially unaffected by the flow control device.
    Type: Application
    Filed: July 10, 2013
    Publication date: January 23, 2014
    Inventor: Andreas WICK
  • Patent number: 8407032
    Abstract: A system and method for assessing thermal comfort in an enclosure is disclosed. In one embodiment, a method includes performing a numerical analysis on a calibration enclosure including a thermal manikin in a uniform thermal environment to obtain a surface heat transfer coefficient (hcal) for each body part of the thermal manikin. The method also includes performing a numerical analysis on an enclosure including one or more thermal manikins in a non-uniform thermal environment to obtain a total heat flux (q?T) for each body part of the one or more thermal manikins. The method further includes computing an equivalent temperature (teq) of each body part of the one or more thermal manikins using the obtained associated hcal, the obtained associated q?T, and an associated surface temperature of the body part. Furthermore, the method includes evaluating thermal comfort in the enclosure based on each computed teq.
    Type: Grant
    Filed: June 10, 2010
    Date of Patent: March 26, 2013
    Assignee: Airbus Engineering Centre India
    Inventors: Punit Tiwari, Madhusudhana Reddy, Andreas Wick
  • Publication number: 20110015908
    Abstract: A system and method for assessing thermal comfort in an enclosure is disclosed. In one embodiment, a method includes performing a numerical analysis on a calibration enclosure including a thermal manikin in a uniform thermal environment to obtain a surface heat transfer coefficient (hcal) for each body part of the thermal manikin. The method also includes performing a numerical analysis on an enclosure including one or more thermal manikins in a non-uniform thermal environment to obtain a total heat flux (q?T) for each body part of the one or more thermal manikins. The method further includes computing an equivalent temperature (teq) of each body part of the one or more thermal manikins using the obtained associated hcal, the obtained associated q?T, and an associated surface temperature of the body part. Furthermore, the method includes evaluating thermal comfort in the enclosure based on each computed teq.
    Type: Application
    Filed: June 10, 2010
    Publication date: January 20, 2011
    Inventors: Punit TIWARI, Madhusudhana REDDY, Andreas WICK