Abstract: An automated test system for testing singulated electronic components comprises a handler, comprising a plurality of handler pickers and/or spinner pickers, the handler pickers and/or spinner pickers being adapted to each pickup one electronic component, at least one processing station for processing one of the electronic components, a first carrier, a second carrier, and a test unit, for testing singulated electronic components located on a carrier. When the second plurality of electronic components on the second carrier are tested in the test unit while the second plurality of electronic components rest on the second carrier, simultaneously the first carrier is loaded with the first plurality of electronic components by the plurality of handler pickers and/or spinner pickers and/or unloaded from the first plurality of electronic components by the plurality of handler pickers and/or spinner pickers.

Abstract: An integrated testing and handler mechanism includes an input/output module including: an input section, an output section, a turret that includes a plurality of pickup heads, and a shuttle configured to move the carrier from the component loading location to a test module transfer location; and a test module including: a test head comprising an array of a plurality of test sockets, a plunger configured to plunge the components held by the carrier into the test sockets when the carrier is located on the plunger, and a rotary table that includes a plurality of grippers that rotate around the rotary table, the rotary table being configured to (i) transfer a carrier between the test module transfer location and an input/output module transfer location, (ii) rotate the carrier between the input/output module transfer location and a plunger transfer location, and (iii) transfer the carrier between the plunger transfer location and plunger.

Abstract: According to the present invention there is provided a method of handling devices comprising the steps of, receiving a tray on which devices to be tested are supported, into a flipping station; positioning the tray under a boat, so that the devices which are supported on the tray are sandwiched between the tray and a surface of the boat which can support devices, to form a first stack; flipping the first stack, so that the tray is positioned over the boat, to cause the devices to fall, under the influence of gravity, away from the tray to become supported on the surface of the boat, thereby transferring the devices from the tray to the surface of the boat; moving the boat to a testing station and testing the devices on the boat; receiving the boat of tested devices into the flipping station; positioning a tray over the boat, so that the devices which are supported on the surface of the boat are sandwiched between the surface of the boat and tray to form a second stack; flipping the second stack so that the bo

Abstract: According to the invention, there is provided a boat which comprises, a surface on which a plurality of electronic components can be supported, the surface having a plurality holes defined therein through which a vacuum can be passed to hold components on the surface; and a first vacuum inlet which is in fluid communication with the plurality of holes, wherein the first vacuum inlet can be fluidly connected to a first vacuum generating means so that the first vacuum generating means can provide a vacuum at the plurality of holes; a second vacuum inlet which is in fluid communication with the same plurality of holes with which the first vacuum inlet is in fluid communication with, wherein the second vacuum inlet can be fluidly connected to a second vacuum generating means so that the second vacuum generating means can provide a vacuum at the plurality of holes.

Abstract: An integrated testing and handler mechanism includes an input/output module including: an input section, an output section, a turret that includes a plurality of pickup heads, and a shuttle configured to move the carrier from the component loading location to a test module transfer location; and a test module including: a test head comprising an array of a plurality of test sockets, a plunger configured to plunge the components held by the carrier into the test sockets when the carrier is located on the plunger, and a rotary table that includes a plurality of grippers that rotate around the rotary table, the rotary table being configured to (i) transfer a carrier between the test module transfer location and an input/output module transfer location, (ii) rotate the carrier between the input/output module transfer location and a plunger transfer location, and (iii) transfer the carrier between the plunger transfer location and plunger.

Abstract: According to the present invention there is provided a method of handling devices comprising the steps of, receiving a tray on which devices to be tested are supported, into a flipping station; positioning the tray under a boat, so that the devices which are supported on the tray are sandwiched between the tray and a surface of the boat which can support devices, to form a first stack; flipping the first stack, so that the tray is positioned over the boat, to cause the devices to fall, under the influence of gravity, away from the tray to become supported on the surface of the boat, thereby transferring the devices from the tray to the surface of the boat; moving the boat to a testing station and testing the devices on the boat; receiving the boat of tested devices into the flipping station; positioning a tray over the boat, so that the devices which are supported on the surface of the boat are sandwiched between the surface of the boat and tray to form a second stack; flipping the second stack so that the bo

Abstract: According to the invention, there is provided a boat which comprises, a surface on which a plurality of electronic components can be supported, the surface having a plurality holes defined therein through which a vacuum can be passed to hold components on the surface; and a first vacuum inlet which is in fluid communication with the plurality of holes, wherein the first vacuum inlet can be fluidly connected to a first vacuum generating means so that the first vacuum generating means can provide a vacuum at the plurality of holes; a second vacuum inlet which is in fluid communication with the same plurality of holes with which the first vacuum inlet is in fluid communication with, wherein the second vacuum inlet can be fluidly connected to a second vacuum generating means so that the second vacuum generating means can provide a vacuum at the plurality of holes.

Abstract: An integrated testing and handler mechanism includes an input/output module including: an input section, an output section, a turret that includes a plurality of pickup heads, and a shuttle configured to move the carrier from the component loading location to a test module transfer location; and a test module including: a test head comprising an array of a plurality of test sockets, a plunger configured to plunge the components held by the carrier into the test sockets when the carrier is located on the plunger, and a rotary table that includes a plurality of grippers that rotate around the rotary table, the rotary table being configured to (i) transfer a carrier between the test module transfer location and an input/output module transfer location, (ii) rotate the carrier between the input/output module transfer location and a plunger transfer location, and (iii) transfer the carrier between the plunger transfer location and plunger.

Abstract: A handler for electronic components, in particular IC's, comprising a feed unit for plungers with a pneumatic cylinder unit that can be displaced and that is coupled to a pneumatic cylinder displacement unit, which moves said cylinder unit back and forth in the axial direction of the plungers.

Abstract: The invention relates to a handler for electronic components, in particular IC's, having a plurality of circulating carriages (10) that are guided along their circulating track by means of a stationary, annular guide device (9) consisting of at least one circulating guide rail. Retaining units (12) are provided on the circulating carriages (10), said units retaining the components (43) to be tested.

Abstract: A plunger for holding and moving electrical components in particular IC's to and from a contacting device connected to a test bed, comprises a head piece with a fluid distribution chamber through which temperature-controlled fluid flows. A suction head is arranged such that the temperature-controlled fluid flows around the suction head and is diverted along the suction head to the component.

Abstract: A handler for electronic components, in particular IC's, for controlling the temperature of the components and supplying and removing said components to and from a test device has circulating units that can be moved along a circulating track. Each unit has at least one retaining unit for retaining a component. In addition, the circulating units have temperature-control chambers containing components that are retained by the retaining units, so that the temperature of the components can be controlled during transport from the charging station to the test station.

Abstract: A handler for electronic components, in particular IC's, for controlling the temperature of the components and supplying and removing said components to and from a test device has circulating units that can be moved along a circulating track. Each unit has at least one retaining unit for retaining a component. In addition, the circulating units have temperature-control chambers containing components that are retained by the retaining units, so that the temperature of the components can be controlled during transport from the charging station to the test station.

Abstract: A plunger for holding and moving electrical components in particular IC's to and from a contacting device connected to a test bed, comprises a head piece with a fluid distribution chamber through which temperature-controlled fluid flows. A suction head is arranged such that the temperature-controlled fluid flows around the suction head and is diverted along the suction head to the component.

Abstract: The invention relates to a handler for electronic components, in particular IC's, having a plurality of circulating carriages (10) that are guided along their circulating track by means of a stationary, annular guide device (9) consisting of at least one circulating guide rail. Retaining units (12) are provided on the circulating carriages (10), said units retaining the components (43) to be tested.

Abstract: The invention relates to a tempering chamber for tempering electronic components, in particular, IC's, with a circulating device (15) with a number of carrier elements (18) running in a circle and two support devices arranged on opposite sides of the carrier elements (18) are provided within a housing (14), wherein the carrier elements (18) are mounted on said support elements such that the alignment of the carrier elements (18) is unaltered on circulation.

Abstract: A handler for electronic components, in particular IC's, comprising a feed unit for plungers with a pneumatic cylinder unit that can be displaced and that is coupled to a pneumatic cylinder displacement unit, which moves said cylinder unit back and forth in the axial direction of the plungers.