Patents by Inventor Andreas Winden

Andreas Winden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12683522
    Abstract: A microelectromechanical actuator structure including a microelectromechanical chip having a chip frame and a drive structure. The drive structure includes a first drive unit and a second drive unit. The first drive unit includes a first substrate and a first electrode structure. The first substrate has a first doping. The first electrode structure has a doping inverse to the first doping. The second drive unit includes a second substrate having a second doping and a second electrode structure having a doping inverse to the second doping. A pn junction is therefore formed between the substrates and the second electrode structures. The first electrode structure includes at least two first electrodes. The second electrode structure includes at least one second electrode. The first electrodes are arranged flat next to one another in a first electrode plane. The second electrode is arranged flat in a second electrode plane.
    Type: Grant
    Filed: June 5, 2024
    Date of Patent: July 14, 2026
    Assignee: ROBERT BOSCH GMBH
    Inventors: Andreas Winden, Anton Melnikov, Ardeshir Moeinian, Peter Engelhart
  • Publication number: 20260172758
    Abstract: A microelectromechanical loudspeaker. The loudspeaker includes: a housing structure; a displacement plate, which is mounted in the housing structure such that it can be deflected along a deflection direction; and an actuator structure, which is connected to the displacement plate for deflecting the displacement plate along the deflection direction, wherein the actuator structure includes at least two actuator planes which are resiliently connected to one another and disposed one above the other in the deflection direction, wherein, on facing plane surfaces, the actuator planes include electrode units, and wherein the electrode units can be activated to move the actuator planes relative to one another along the deflection direction and the displacement plate can be deflected along the deflection direction via the movement of the actuator planes.
    Type: Application
    Filed: November 6, 2023
    Publication date: June 18, 2026
    Inventors: Andreas Winden, Peter Engelhart, Stefan Pinter
  • Publication number: 20250320112
    Abstract: A MEMS device. The MEMS device includes at least one movably mounted element, which performs a useful movement along a useful direction relative to a further element of the MEMS device. The movable element is for interaction with a fluid, such as a gas or a liquid. The movable element includes first and second portions. The further includes further first and second portions. The first portion has a first gap distance from the further first portion in a disturbance direction of the movable element. The second portion has a second gap distance from the further second portion in the disturbance direction of the movable element. A movement of the movably mounted element along the disturbance direction is caused by an external load, such as an external impact. The first gap distance is smaller than the second gap distance. The first portion and the further first portion form a contact region between the movable element and the further element.
    Type: Application
    Filed: March 25, 2025
    Publication date: October 16, 2025
    Inventors: Anton Melnikov, Alexander Sorger, Andreas Winden, Jens Schindele, Maximilian Sommer, Peter Engelhart
  • Publication number: 20250171298
    Abstract: A method for producing a microelectromechanical component having a diaphragm. A substrate with a substrate surface and a buried horizontal etch stop structure is provided. Starting from a front side of the substrate, a vertical etch stop structure, extending substantially perpendicularly to the substrate surface is introduced, which predefines a lateral diaphragm contour of the diaphragm. To expose the diaphragm, a substrate recess is etched starting from a rear side of the substrate to the horizontal etch stop structure and the vertical etch stop structure. A microelectromechanical component with a substrate and a diaphragm, is also provided. A lateral diaphragm contour of the diaphragm is delimited by a vertical trench structure. Starting from a rear side of the substrate that faces away from the diaphragm, a substrate recess runs through the substrate and merges laterally into the vertical trench structure at least in a bottom region facing the diaphragm.
    Type: Application
    Filed: November 15, 2024
    Publication date: May 29, 2025
    Inventors: Andreas Winden, Gregor Schuermann
  • Publication number: 20250083948
    Abstract: A microelectromechanical loudspeaker. The loudspeaker includes a substrate, a housing arranged on the substrate, and a cavity delimited by the housing and the substrate. The loudspeaker includes a translation device, which is arranged in the cavity so as to be movable and deflectable in a specified movement direction parallel to the substrate surface and includes an arrangement of a plurality of movable fin structures, which are arranged next to one another in the movement direction and divide the cavity into a plurality of portions fluidically separated from one another, and a support structure connecting the movable fin structures to one another, and a drive device designed to deflect the translation device in the movement direction, including a plurality of drive units each including least one actuator electrode mechanically connected to the translation device and at least one stator electrode mechanically connected to the housing and/or the substrate.
    Type: Application
    Filed: August 27, 2024
    Publication date: March 13, 2025
    Inventors: Andreas Winden, Bernhard Gehl, Daniel Maier, Peter Engelhart
  • Publication number: 20240429836
    Abstract: A microelectromechanical actuator structure including a microelectromechanical chip having a chip frame and a drive structure. The drive structure includes a first drive unit and a second drive unit. The first drive unit includes a first substrate and a first electrode structure. The first substrate has a first doping. The first electrode structure has a doping inverse to the first doping. The second drive unit includes a second substrate having a second doping and a second electrode structure having a doping inverse to the second doping. A pn junction is therefore formed between the substrates and the second electrode structures. The first electrode structure includes at least two first electrodes. The second electrode structure includes at least one second electrode. The first electrodes are arranged flat next to one another in a first electrode plane. The second electrode is arranged flat in a second electrode plane.
    Type: Application
    Filed: June 5, 2024
    Publication date: December 26, 2024
    Inventors: Andreas Winden, Anton Melnikov, Ardeshir Moeinian, Peter Engelhart