Abstract: An assembly includes a semiconductor component and a temperature sensor unit for measuring a temperature of the semiconductor component, wherein the semiconductor component comprises a recess, wherein the temperature sensor unit comprises a housing element and a temperature sensor element, wherein the housing element comprises a first housing section and a second housing section, wherein the second housing section protrudes from the first housing section, wherein the temperature sensor element is at least partially located in the second housing section, the second housing section projecting from the first housing section, the temperature sensor element being arranged at least partially in the second housing section, the second housing section being arranged in the recess of the semiconductor component, and a switch arrangement having at least one such assembly and at least one further semiconductor component.

Abstract: A half-bridge switch arrangement has a plurality of parallel-connected half-bridges, each half-bridge having a first semiconductor switching element and a second semiconductor switching element, has a first busbar, to which a first terminal of each of the first semiconductor switching elements is electrically connected, a second busbar, to which a second terminal of each of the first semiconductor switching elements and a first terminal of each of the second semiconductor switching elements are electrically connected, and has a third busbar, to which a second terminal of each of the second semiconductor switching elements is electrically connected. The first and second busbars are toothed and the semiconductor switching elements are arranged on the teeth, the teeth being arranged alternately. The third busbar is arranged above the semiconductor switching elements, and a heat sink is arranged below the first and second busbars.