Abstract: A method for producing a main body (33) of an optical element for semiconductor lithography includes: —producing a blank (32), —introducing at least one fluid channel (36.x) into the blank (32), then —producing the main body (33) by shaping the blank (32) onto a mold (42). Furthermore, the disclosure describes a main body (33) of an optical element that includes at least one fluid channel (36.x), the fluid channel (36.x) being embodied such that the distance between the fluid channel (36.x) and the surface (40) of the main body (33) provided for an optically active area (41) varies by less than 1 mm, preferably less than 0.1 mm and particularly preferably less than 0.02 mm.

Abstract: A method for polishing a workpiece in the production of an optical element, in particular for microlithography, wherein a relative movement takes place between a polishing tool (300) and a workpiece surface (110, 120, 210) being machined. A polishing tool surface (215, 315) of the polishing tool (300) is formed by a viscoelastic polishing medium (303), wherein the polishing tool surface has an average diameter which is less than 50% of the average diameter of the workpiece surface being machined. The polishing tool surface during polishing is guided by an overrun distance beyond at least one edge (110a, 110b, 120a, 120b, 210a, 210b) delimiting the workpiece surface being machined, wherein the average diameter of the polishing tool surface is at least twice the overrun distance.

Abstract: A method for polishing a workpiece in the production of an optical element, in particular for microlithography, wherein a relative movement takes place between a polishing tool (300) and a workpiece surface (110, 120, 210) being machined. A polishing tool surface (215, 315) of the polishing tool (300) is formed by a viscoelastic polishing medium (303), wherein the polishing tool surface has an average diameter which is less than 50% of the average diameter of the workpiece surface being machined. The polishing tool surface during polishing is guided by an overrun distance beyond at least one edge (110a, 110b, 120a, 120b, 210a, 210b) delimiting the workpiece surface being machined, wherein the average diameter of the polishing tool surface is at least twice the overrun distance.

Abstract: A subunit of a battery module (2), comprising a first receiving element (3) and a second receiving element (4) which are connected to each other, forming at least one first receiving space (7) and at least one second receiving space (8), wherein the first receiving space (7) and the second receiving space (8) are separated from each other, and at least one battery cell stack (5) or at least one battery cell (6) is arranged in the first receiving space (7), and the second receiving space (8) is configured for receiving a temperature-control fluid (9).

Abstract: A subunit of a battery module (2), comprising a first receiving element (3) and a second receiving element (4) which are connected to each other, forming at least one first receiving space (7) and at least one second receiving space (8), wherein the first receiving space (7) and the second receiving space (8) are separated from each other, and at least one battery cell stack (5) or at least one battery cell (6) is arranged in the first receiving space (7), and the second receiving space (8) is configured for receiving a temperature-control fluid (9).