Patents by Inventor Andreea Boca

Andreea Boca has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11081609
    Abstract: A semiconductor structure including a bonding layer connecting a first semiconductor wafer layer to a second semiconductor wafer layer, the bonding layer including an electrically conductive carbonaceous component and a binder component.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: August 3, 2021
    Assignee: The Boeing Company
    Inventors: Andreea Boca, Daniel C. Law, Joseph Charles Boisvert, Nasser H. Karam
  • Publication number: 20150171253
    Abstract: A semiconductor structure including a bonding layer connecting a first semiconductor wafer layer to a second semiconductor wafer layer, the bonding layer including an electrically conductive carbonaceous component and a binder component.
    Type: Application
    Filed: February 23, 2015
    Publication date: June 18, 2015
    Inventors: Andreea Boca, Daniel C. Law, Joseph Charles Boisvert, Nasser H. Karam
  • Patent number: 8993879
    Abstract: A semiconductor structure including a bonding layer connecting a first semiconductor wafer layer to a second semiconductor wafer layer, the bonding layer including an electrically conductive carbonaceous component and a binder component.
    Type: Grant
    Filed: June 14, 2010
    Date of Patent: March 31, 2015
    Assignee: The Boeing Company
    Inventors: Andreea Boca, Daniel C. Law, Joseph Charles Boisvert, Nasser H. Karam
  • Publication number: 20140102529
    Abstract: A solar cell interconnect assembly and a method for manufacturing the same are provided. In an embodiment, the method may include: providing a solar cell having an interconnect member formed thereon, the interconnect member comprising a metallic part formed on a surface of the solar cell and a first precursor layer formed over the metallic part; providing an interconnector comprising a second precursor layer at a surface thereof; heating the interconnector and the interconnect member to a temperature equal to or above a eutectic temperature of the materials of the first and second precursor layers and pressing one of them against the other so as to form a eutectic liquid phase; and isothermal solidifying the eutectic liquid to form a bonding layer of eutectic alloy.
    Type: Application
    Filed: January 14, 2013
    Publication date: April 17, 2014
    Applicant: Emcore Solar Power, Inc.
    Inventors: Cory Tourino, Arthur Cornfeld, Pravin Patel, Andreea Boca
  • Publication number: 20110303288
    Abstract: A semiconductor structure including a bonding layer connecting a first semiconductor wafer layer to a second semiconductor wafer layer, the bonding layer including an electrically conductive carbonaceous component and a binder component.
    Type: Application
    Filed: June 14, 2010
    Publication date: December 15, 2011
    Applicant: THE BOEING COMPANY
    Inventors: Andreea Boca, Daniel C. Law, Joseph Charles Boisvert, Nasser H. Karam