Patents by Inventor Andrei A. Shkel

Andrei A. Shkel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low cost wafer level process for packaging MEMS three dimensional devices
    Patent number: 10167190
    Abstract: An apparatus and method for wafer-level hermetic packaging of MicroElectroMechanical Systems (MEMS) devices of different shapes and form factors is presented in this disclosure. The method is based on bonding a glass cap wafer with fabricated micro-glassblown “bubble-shaped” structures to the substrate glass/Si wafer. Metal traces fabricated on the substrate wafer serve to transfer signals from the sealed cavity of the bubble to the outside world. Furthermore, the method provides for chip-level packaging of MEMS three dimensional structures. The packaging method utilizes a micro glass-blowing process to create “bubbleshaped” glass lids. This new type of lids is used for vacuum packaging of three dimensional MEMS devices, using a standard commercially available type of package.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: January 1, 2019
    Assignee: The Regents of the University of California
    Inventors: Andrei A. Shkel, Alexandra Efimovskaya, Doruk Senkal
  • LOW COST WAFER LEVEL PROCESS FOR PACKAGING MEMS THREE DIMENSIONAL DEVICES
    Publication number: 20170233247
    Abstract: An apparatus and method for wafer-level hermetic packaging of MicroElectroMechanical Systems (MEMS) devices of different shapes and form factors is presented in this disclosure. The method is based on bonding a glass cap wafer with fabricated micro-glassblown “bubble-shaped” structures to the substrate glass/Si wafer. Metal traces fabricated on the substrate wafer serve to transfer signals from the sealed cavity of the bubble to the outside world. Furthermore, the method provides for chip-level packaging of MEMS three dimensional structures. The packaging method utilizes a micro glass-blowing process to create “bubbleshaped” glass lids. This new type of lids is used for vacuum packaging of three dimensional MEMS devices, using a standard commercially available type of package.
    Type: Application
    Filed: February 14, 2017
    Publication date: August 17, 2017
    Applicant: The Regents of the University of California
    Inventors: Andrei A. Shkel, Alexandra Efimovskaya, Doruk Senkal
  • Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS)
    Patent number: 9611138
    Abstract: A high-aspect ratio low resistance through-wafer interconnect for double-sided (TWIDS) fabrication of microelectromechanical systems (MEMS) serves as an interconnection method and structure for co-integration of MEMS and integrated circuits or other microcomponent utilizing both sides of the wafer. TWIDS applied to a three dimensional folded TIMU (timing inertial measurement unit) provides a path for electrical signals from sensors on the front side of the SOI wafer to electronic components on the back side of the wafer, while enabling folding of an array of sensors in a three dimensional shape.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: April 4, 2017
    Assignee: The Regents of the University of California
    Inventors: Andrei A. Shkel, Alexandra Efimovskaya
  • THROUGH-WAFER INTERCONNECTS FOR MEMS DOUBLE-SIDED FABRICATION PROCESS (TWIDS)
    Publication number: 20160167958
    Abstract: A high-aspect ratio low resistance through-wafer interconnect for double-sided (TWIDS) fabrication of microelectromechanical systems (MEMS) serves as an interconnection method and structure for co-integration of MEMS and integrated circuits or other microcomponent utilizing both sides of the wafer. TWIDS applied to a three dimensional folded TIMU (timing inertial measurement unit) provides a path for electrical signals from sensors on the front side of the SOI wafer to electronic components on the back side of the wafer, while enabling folding of an array of sensors in a three dimensional shape.
    Type: Application
    Filed: October 12, 2015
    Publication date: June 16, 2016
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Andrei A. Shkel, Alexandra Efimovskaya
  • Single wafer fabrication process for wavelength dependent reflectance for linear optical serialization of accelerometers
    Patent number: 8334984
    Abstract: A plurality of Fabry-Perot interferometric sensors are optically coupled in series with each other to form an ordered optical series. Each Fabry-Perot interferometric sensor has a unique signalband and a passband. Each Fabry-Perot interferometric sensor has its unique signalband within the passbands of all of the next higher ordered Fabry-Perot interferometric sensors in the optical series so that a corresponding unique fringe signal from each of the Fabry-Perot interferometric sensors is a multiplexed output from the optical series.
    Type: Grant
    Filed: August 21, 2009
    Date of Patent: December 18, 2012
    Assignee: The Regents of the University of California
    Inventors: Maximillian A. Perez, Andrei A. Shkel
  • Single wafer fabrication process for wavelength dependent reflectance for linear optical serialization of accelerometers
    Patent number: 8318524
    Abstract: A plurality of Fabry-Perot interferometric sensors are optically coupled in series with each other to form an ordered optical series. Each Fabry-Perot interferometric sensor has a unique signalband and a passband. Each Fabry-Perot interferometric sensor has its unique signalband within the passbands of all of the next higher ordered Fabry-Perot interferometric sensors in the optical series so that a corresponding unique fringe signal from each of the Fabry-Perot interferometric sensors is a multiplexed output from the optical series.
    Type: Grant
    Filed: May 9, 2012
    Date of Patent: November 27, 2012
    Assignee: The Regent of the University of California
    Inventors: Maximillian A. Perez, Andrei A. Shkel
  • SINGLE WAFER FABRICATION PROCESS FOR WAVELENGTH DEPENDENT REFLECTANCE FOR LINEAR OPTICAL SERIALIZATION OF ACCELEROMETERS
    Publication number: 20120231570
    Abstract: A plurality of Fabry-Perot interferometric sensors are optically coupled in series with each other to form an ordered optical series. Each Fabry-Perot interferometric sensor has a unique signalband and a passband. Each Fabry-Perot interferometric sensor has its unique signalband within the passbands of all of the next higher ordered Fabry-Perot interferometric sensors in the optical series so that a corresponding unique fringe signal from each of the Fabry-Perot interferometric sensors is a multiplexed output from the optical series.
    Type: Application
    Filed: May 9, 2012
    Publication date: September 13, 2012
    Applicant: The Regents of the University of California
    Inventors: Maximillian A. Perez, Andrei A. Shkel
  • SINGLE WAFER FABRICATION PROCESS FOR WAVELENGTH DEPENDENT REFLECTANCE FOR LINEAR OPTICAL SERIALIZATION OF ACCELEROMETERS
    Publication number: 20100046002
    Abstract: A plurality of Fabry-Perot interferometric sensors are optically coupled in series with each other to form an ordered optical series. Each Fabry-Perot interferometric sensor has a unique signalband and a passband. Each Fabry-Perot interferometric sensor has its unique signalband within the passbands of all of the next higher ordered Fabry-Perot interferometric sensors in the optical series so that a corresponding unique fringe signal from each of the Fabry-Perot interferometric sensors is a multiplexed output from the optical series.
    Type: Application
    Filed: August 21, 2009
    Publication date: February 25, 2010
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Maximillian A. Perez, Andrei A. Shkel