Abstract: Systems are provided for a cooling system for an electric device. In one example, a system includes a metallic plate coupled to a circuit board and a coolant manifold. The coolant manifold comprises a semi-open coolant channel configured to flow coolant in contact with the metallic plate.

Abstract: A cooler assembly, comprising: a heat exchanger with a heat exchanger surface having a dielectric layer of dielectric material physically coupled thereto, wherein a single or plurality of layers of another material are coupled to an exposed surface of the dielectric layer; and at least one component coupled to the heat exchanger such that the at least one component is electrically isolated from the heat exchanger surface by the dielectric material, wherein the heat exchanger surface is electrically isolated with respect to the at least one component.

Abstract: Systems are provided for a power electronics cooling assembly. In one example, a system for a power electronics cooling assembly includes: a first cooling plate, a mounting plate, the mounting plate having mounting points to be attached to a housing, an electronic module disposed between the first cooling plate and the mounting plate, and a spring bracket applying force towards the first cooling plate, the spring bracket having mounting points aligned with the mounting points of the mounting plate.

Abstract: A heat exchanger includes a fluid flow passage with a wavy fin turbulizer. The turbulizer includes sidewalls extending lengthwise along a fluid flow direction between its first and second ends, and the sidewalls are spaced apart across the width of the turbulizer. Each flow channel of the turbulizer is defined between two adjacent sidewalls. Each sidewall has a smoothly and continuously curved profile with repeating wave forms being defined along the length of the turbulizer. The continuously curved profile of the sidewalls is defined by a non-circular shape, such as elliptical, sinusoidal, parabolic and hyperbolic shapes. The radius of curvature changes constantly and reaches a maximum at or near the inflection point between adjacent crests and troughs of the profile, to provide improved particle pass-through, lower pressure drop, and enhanced plateability of internal surfaces.