Patents by Inventor Andrei CATUNEANU

Andrei CATUNEANU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12598693
    Abstract: A cooler assembly, comprising: a heat exchanger with a heat exchanger surface having a dielectric layer of dielectric material physically coupled thereto, wherein a single or plurality of layers of another material are coupled to an exposed surface of the dielectric layer; and at least one component coupled to the heat exchanger such that the at least one component is electrically isolated from the heat exchanger surface by the dielectric material, wherein the heat exchanger surface is electrically isolated with respect to the at least one component.
    Type: Grant
    Filed: August 2, 2023
    Date of Patent: April 7, 2026
    Assignee: DANA CANADA CORPORATION
    Inventors: Matthew S. Birkett, Andrei Catuneanu
  • Publication number: 20260068107
    Abstract: A method for forming a thermally conductive metallurgic joint, comprising: applying a liquid filler metal alloy comprising 76-90 wt. % gallium and 10-24 wt. % tin to a first surface and a second surface; placing the first surface and second surface in relative positions to form an assembly; and heating the assembly and holding the assembly at an approximately constant temperature for a non-zero duration of time to form the thermally conductive metallurgic joint.
    Type: Application
    Filed: August 28, 2024
    Publication date: March 5, 2026
    Inventor: Andrei CATUNEANU
  • Patent number: 12453046
    Abstract: Systems are provided for a cooling system for an electric device. In one example, a system includes a metallic plate coupled to a circuit board and a coolant manifold. The coolant manifold comprises a semi-open coolant channel configured to flow coolant in contact with the metallic plate.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: October 21, 2025
    Assignee: DANA CANADA CORPORATION
    Inventors: Jingyuan Liang, Andrei Catuneanu, Matthew S. Birkett
  • Publication number: 20250303503
    Abstract: Systems relate to a processed braze sheet (PBS) for a heat exchanger. In one example, a processed braze sheet (PBS) comprises at least a layer of aluminum (Al) with at least one side clad and a melting point depressant (MPD) layer comprising copper (Cu). The layer of Al is clad on at least one side with a metal comprising a melting point lower than Al.
    Type: Application
    Filed: March 29, 2024
    Publication date: October 2, 2025
    Inventors: Andrei CATUNEANU, Feng LIANG
  • Patent number: 12317457
    Abstract: Systems are provided for a power electronics cooling assembly. In one example, a system for a power electronics cooling assembly includes: a first cooling plate, a mounting plate, the mounting plate having mounting points to be attached to a housing, an electronic module disposed between the first cooling plate and the mounting plate, and a spring bracket applying force towards the first cooling plate, the spring bracket having mounting points aligned with the mounting points of the mounting plate.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: May 27, 2025
    Assignee: DANA CANADA CORPORATION
    Inventors: Andrei Catuneanu, Benjamin A. Kenney, Silvio Tonellato, Jiangfeng Yu
  • Publication number: 20250123062
    Abstract: A heat exchanger includes a fluid flow passage with a wavy fin turbulizer. The turbulizer includes sidewalls extending lengthwise along a fluid flow direction between its first and second ends, and the sidewalls are spaced apart across the width of the turbulizer. Each flow channel of the turbulizer is defined between two adjacent sidewalls. Each sidewall has a smoothly and continuously curved profile with repeating wave forms being defined along the length of the turbulizer. The continuously curved profile of the sidewalls is defined by a non-circular shape, such as elliptical, sinusoidal, parabolic and hyperbolic shapes. The radius of curvature changes constantly and reaches a maximum at or near the inflection point between adjacent crests and troughs of the profile, to provide improved particle pass-through, lower pressure drop, and enhanced plateability of internal surfaces.
    Type: Application
    Filed: December 27, 2024
    Publication date: April 17, 2025
    Inventors: Andrei CATUNEANU, John G. BURGERS, Kenneth M.A. ABELS
  • Publication number: 20250058392
    Abstract: A heat exchanger including a first component formed of aluminum and/or aluminum alloy and a second component formed of copper and/or copper alloy. The first element and the second element are fused together by furnace brazing. In some examples, the heat exchanger is an aluminum/copper hybrid heat exchanger including an aluminum and/or aluminum alloy component and a copper and/or copper alloy component. The aluminum and/or aluminum alloy component includes a body and/or cover of the hybrid heat exchanger and the copper and/or copper alloy component includes a heat transfer enhancement component, fixedly coupled to the aluminum and/or aluminum alloy component.
    Type: Application
    Filed: August 15, 2023
    Publication date: February 20, 2025
    Inventor: Andrei CATUNEANU
  • Patent number: 12215933
    Abstract: A heat exchanger includes a fluid flow passage with a wavy fin turbulizer. The turbulizer includes sidewalls extending lengthwise along a fluid flow direction between its first and second ends, and the sidewalls are spaced apart across the width of the turbulizer. Each flow channel of the turbulizer is defined between two adjacent sidewalls. Each sidewall has a smoothly and continuously curved profile with repeating wave forms being defined along the length of the turbulizer. The continuously curved profile of the sidewalls is defined by a non-circular shape, such as elliptical, sinusoidal, parabolic and hyperbolic shapes. The radius of curvature changes constantly and reaches a maximum at or near the inflection point between adjacent crests and troughs of the profile, to provide improved particle pass-through, lower pressure drop, and enhanced plateability of internal surfaces.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: February 4, 2025
    Assignee: Dana Canada Corporation
    Inventors: Andrei Catuneanu, John G. Burgers, Kenneth M. A. Abels
  • Publication number: 20240237280
    Abstract: Systems are provided for a cooling system for an electric device. In one example, a system includes a metallic plate coupled to a circuit board and a coolant manifold. The coolant manifold comprises a semi-open coolant channel configured to flow coolant in contact with the metallic plate.
    Type: Application
    Filed: October 19, 2022
    Publication date: July 11, 2024
    Inventors: Jingyuan LIANG, Andrei CATUNEANU, Matthew S. BIRKETT
  • Publication number: 20240138107
    Abstract: Systems are provided for a cooling system for an electric device. In one example, a system includes a metallic plate coupled to a circuit board and a coolant manifold. The coolant manifold comprises a semi-open coolant channel configured to flow coolant in contact with the metallic plate.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 25, 2024
    Inventors: Jingyuan LIANG, Andrei CATUNEANU, Matthew S. BIRKETT
  • Publication number: 20240090119
    Abstract: A cooler assembly, comprising: a heat exchanger with a heat exchanger surface having a dielectric layer of dielectric material physically coupled thereto, wherein a single or plurality of layers of another material are coupled to an exposed surface of the dielectric layer; and at least one component coupled to the heat exchanger such that the at least one component is electrically isolated from the heat exchanger surface by the dielectric material, wherein the heat exchanger surface is electrically isolated with respect to the at least one component.
    Type: Application
    Filed: August 2, 2023
    Publication date: March 14, 2024
    Inventors: Matthew S. BIRKETT, Andrei CATUNEANU
  • Publication number: 20230380103
    Abstract: Systems are provided for a power electronics cooling assembly. In one example, a system for a power electronics cooling assembly includes: a first cooling plate, a mounting plate, the mounting plate having mounting points to be attached to a housing, an electronic module disposed between the first cooling plate and the mounting plate, and a spring bracket applying force towards the first cooling plate, the spring bracket having mounting points aligned with the mounting points of the mounting plate.
    Type: Application
    Filed: May 17, 2022
    Publication date: November 23, 2023
    Inventors: Andrei CATUNEANU, Benjamin A. KENNEY, Silvio TONELLATO, Jiangfeng YU
  • Publication number: 20220170706
    Abstract: A heat exchanger includes a fluid flow passage with a wavy fin turbulizer. The turbulizer includes sidewalls extending lengthwise along a fluid flow direction between its first and second ends, and the sidewalls are spaced apart across the width of the turbulizer. Each flow channel of the turbulizer is defined between two adjacent sidewalls. Each sidewall has a smoothly and continuously curved profile with repeating wave forms being defined along the length of the turbulizer. The continuously curved profile of the sidewalls is defined by a non-circular shape, such as elliptical, sinusoidal, parabolic and hyperbolic shapes. The radius of curvature changes constantly and reaches a maximum at or near the inflection point between adjacent crests and troughs of the profile, to provide improved particle pass-through, lower pressure drop, and enhanced plateability of internal surfaces.
    Type: Application
    Filed: November 30, 2020
    Publication date: June 2, 2022
    Inventors: Andrei CATUNEANU, John G. BURGERS, Kenneth M.A. ABELS