Abstract: A system for probing circuit elements, includes a panel fixture, probe holder and stage. The fixture has a platen surface to support a work piece having work piece surface. The work piece surface is substantially parallel to the platen surface and has a target element thereon. The probe holder is configured to support a probe for detecting a characteristic of the target element. A stage rotates the probe holder about an axis substantially orthogonal to the platen surface, to align the probe with probe locations associated with the circuit element, so that the characteristic of the circuit element can detected by the probe. Fixturing motion can be optimized for efficient work piece manufacturing. Calibration and vision subassemblies are also provided.

Abstract: The present invention relates to a method for writing an optical structure within a workpiece of a dielectric material using FLDM. In a first embodiment system parameters for the FLDM are determined in dependence upon the dielectric material, a predetermined volume element and a predetermined change of the refractive index of the dielectric material within the predetermined volume element. The system parameters are determined such that self-focusing of a pulsed femtosecond laser beam is inhibted by non-linear absorption of the energy of the pulsed femtosecond laser beam within the dielectric material. A pulsed femtosecond laser beam based on the determined system parameters is focused at a predetermined location within the workpiece for inducing a change of the refractive index through dielectric modification within the predetermined volume element, the volume element including the focus. Various embodiments enable writing of various different optical structures into a workpiece.

Abstract: In the laser trimming of passive circuit elements such as resistors, capacitors and inductors, various trimming parameters must be selected. To select a element is compared with a target value for the parameter to determine an offset value between the measured parameter value and the target value. The relevant trim parameters are then selected based on the determined offset values.

Abstract: In the laser trimming of passive circuit elements such as resistors, capacitors and inductors, various trimming parameters must be selected. To select a parameter, such as a cut type or speed, a value of a parameter, such as the resistance or impedance of a resistor, of each of a plurality of elements is measured. The measured parameter value of each element is compared with a target value for the parameter to determine an offset value between the measured parameter value and the target value. The relevant trim parameters are then selected based on the determined offset values.

Abstract: In the laser trimming of passive circuit elements such as resistors, capacitors and inductors, various trimming parameters must be selected. To select a parameter, such as a cut type or speed, a value of a parameter, such as the resistance or impedance of a resistor, of each of a plurality of elements is measured. The measured parameter value of each element is compared with a target value for the parameter to determine an offset value between the measured parameter value and the target value. The relevant trim parameters are then selected based on the determined offset values.