Abstract: A press-forming device for forming individual solder bodies from a wire of soldering material includes a press-forming mechanism and a separation means. The press-forming mechanism forms a continuous strand of preformed solder sections from the wire by using two notched rollers that rotate in opposite directions and that press opposite notches into the wire. The preformed solder sections are disposed equidistantly along the strand and are connected to each other by connecting links disposed at the notches. The separation means forms individual solder bodies by separating the preformed solder sections one by one at the connecting links. The separation means separates individual preformed solder sections using a cutting mechanism that moves in a direction perpendicular to the length direction of the strand. Individual solder bodies are transported to a solder jetting section where they are liquefied by a laser beam and jetted from the solder jetting section by gas pressure.

Abstract: A method for separating a semiconductor component from a carrier, the semiconductor component being held in a material-bonded manner in a connection plane on a carrier by a metalliferous connective agent. The connective agent is liquified and the semiconductor component is taken hold of by a holding tool. The holding tool is oscillated. The holding tool is displaced and the semiconductor component is separated from the carrier. Furthermore, a device for separating a semiconductor component held in a material-bonded manner on a carrier by a connective agent, in which the device comprises a holding tool and at least one drive.

Abstract: A method of forming a plurality of solder contact pins on a contact pad layout of a substrate including the steps of arranging a plurality of first solder balls at an arranging layout of a transporting tool, the arranging layout of the transporting tool corresponding to the contact pad layout of the substrate, placing the transporting tool opposite the substrate such that the plurality of first solder balls is associated with the plurality of contact pads, melting the plurality of first solder balls and releasing the plurality of first solder balls to the plurality of contact pads so as to form a plurality of solder bumps arranging a plurality of second solder balls at the arranging positions and releasing the plurality of second solder balls from the transporting tool so as to form a plurality of monolithic solder contact pins on the plurality of contact pads.

Abstract: A bonding head for holding a substrate to be soldered includes a laser source, a vacuum source, a main body and a holding nozzle. A laser duct extends through the main body to a laser exit. The vacuum source creates a vacuum in the laser duct. The laser source directs the laser beam through the laser duct towards the laser exit. The holding nozzle is connected to the main body. A nozzle duct extends through the holding nozzle from a nozzle entry to a nozzle exit. The nozzle entry is adjacent to the laser exit. The holding nozzle is configured to hold the substrate at the nozzle exit when the vacuum source creates the vacuum in the laser duct. The laser beam passes through the nozzle duct and is directed towards the substrate. The holding nozzle is configured to hold the substrate over a mounting face of a second substrate.

Abstract: A laser soldering system and a method for monitoring a laser soldering process by means of a monitoring device of the laser soldering system, wherein a solder ball is dispensed onto a solderable surface of a substrate by means of a solder ball feeding device of the laser soldering system, wherein the solder ball is at least partially melted by means of a laser device of the laser soldering system, wherein, during the laser soldering process, a light signal is formed which is detected by means of an optical detection unit of the monitoring device, wherein the light signal is dispersed into a spectrum of the light signal by means of a spectroscope device of the monitoring device, wherein the spectrum is analyzed by means of a processing device of the monitoring device, and it is identified on the basis of a composition of the spectrum whether or not a burning of the substrate has occurred during the laser soldering process.

Abstract: An apparatus and method for establishing a contact connection between at least one connection contact of a substrate and at least one connection contact of a semiconductor component, a conductor material web being formed on the substrate and the semiconductor component. The apparatus includes a joining tool for positioning and joining the semiconductor component on/to the substrate, a beam channel for optical radiation being formed within the joining tool, a laser device for applying laser radiation to the substrate and/or to the semiconductor component, a detection device for detecting optical radiation, and a substrate receptacle on which the substrate is fixed in place and with which at least one underside of the substrate can be brought into contact.

Abstract: A bonding head for holding a substrate to be soldered includes a laser source, a vacuum source, a main body and a holding nozzle. A laser duct extends through the main body to a laser exit. The vacuum source creates a vacuum in the laser duct. The laser source directs the laser beam through the laser duct towards the laser exit. The holding nozzle is connected to the main body. A nozzle duct extends through the holding nozzle from a nozzle entry to a nozzle exit. The nozzle entry is adjacent to the laser exit. The holding nozzle is configured to hold the substrate at the nozzle exit when the vacuum source creates the vacuum in the laser duct. The laser beam passes through the nozzle duct and is directed towards the substrate. The holding nozzle is configured to hold the substrate over a mounting face of a second substrate.

Abstract: A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

Abstract: A method for electrically contacting terminal faces of two substrates, the first substrate being positioned against the terminal faces of the second substrate, and a first laser radiation being applied to at least one of the substrates on the rear side in a first application phase, and a second laser radiation being applied to at least one of the substrates in a second application phase and a solder material arranged between the substrates being fused to establish an electrical contact between the terminal faces of the substrates, and the application in the first application phase being carried out with a first laser radiation, which has a wavelength that differs from the second laser radiation, and the switch from the first application phase to the second application phase being controlled by a control device A laser arrangement for applying laser energy to at least one substrate is proposed.

Abstract: A package comprises at least two contacts for microtechnology, the contacts each having a contact surface, the contacts being connected to at least one support structure and the contacts being spaced apart from each other and disposed in such a manner that the contact surfaces are disposed in one plane and are oriented in the same direction. The support structure is made of a connective material being separable and/or destroyable by a laser. Furthermore, a method for handling such a package and a tool for implementing such a method are provided.

Abstract: A device for removing or repositioning defective and erroneously placed electronic components from circuit boards includes a vacuum suction nozzle, a laser beam and a temperature sensor. The vacuum nozzle has an adaptor tip at which suction is generated. The adaptor tip is larger than the defective or erroneously positioned electronic component. The laser beam is emitted out of the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing or repositioning the defective or erroneously placed electronic component from the circuit board positions the adaptor tip over the electronic component and directs the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then removed or repositioned and remounted on the circuit board.

Abstract: A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

Abstract: A bonding head for holding a substrate to be soldered includes a laser source, a vacuum source, a main body and a holding nozzle. A laser duct extends through the main body to a laser exit. The vacuum source creates a vacuum in the laser duct. The laser source directs the laser beam through the laser duct towards the laser exit. The holding nozzle is connected to the main body. A nozzle duct extends through the holding nozzle from a nozzle entry to a nozzle exit. The nozzle entry is adjacent to the laser exit. The holding nozzle is configured to hold the substrate at the nozzle exit when the vacuum source creates the vacuum in the laser duct. The laser beam passes through the nozzle duct and is directed towards the substrate. The holding nozzle is configured to hold the substrate over a mounting face of a second substrate.

Abstract: A device for removing a defective electronic component from a circuit board includes a vacuum suction nozzle, a laser beam emitter and an infrared temperature sensor. The vacuum suction nozzle has a suction opening at which suction is generated. The suction opening is dimensioned to be larger than the defective electronic component. The laser beam emitter is oriented so as to emit a laser beam out the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing the defective electronic component from the circuit board includes positioning the suction opening over the electronic component and directing the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then sucked into the vacuum suction nozzle.

Abstract: A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

Abstract: A soldering apparatus includes an application device, a conveying device and an application nozzle. The application device has a laser duct extending straight from a laser entry at the top to a laser exit at the bottom and a drop duct that extends from a drop entry at the top to a drop exit at the bottom of the application device. The conveying device separately conveys solder bodies to the drop entry. The application nozzle temporarily holds solder bodies received from the drop exit. The laser and drop ducts are interconnected over their entire lengths from the top to the bottom of the application device. The drop entry and laser entry are side by side and form a common entry. The drop exit and laser exit are spatially coincident and form a common exit that is smaller than the common entry. The application nozzle is connected to the common exit.

Abstract: A laser soldering system and a method for monitoring a laser soldering process by means of a monitoring device of the laser soldering system, wherein a solder ball is dispensed onto a solderable surface of a substrate by means of a solder ball feeding device of the laser soldering system, wherein the solder ball is at least partially melted by means of a laser device of the laser soldering system, wherein, during the laser soldering process, a light signal is formed which is detected by means of an optical detection unit of the monitoring device, wherein the light signal is dispersed into a spectrum of the light signal by means of a spectroscope device of the monitoring device, wherein the spectrum is analyzed by means of a processing device of the monitoring device, and it is identified on the basis of a composition of the spectrum whether or not a burning of the substrate has occurred during the laser soldering process.

Abstract: A press-forming device for forming individual solder bodies from a wire of soldering material includes a press-forming mechanism and a separation means. The press-forming mechanism forms a continuous strand of preformed solder sections from the wire by using two notched rollers that rotate in opposite directions and that press opposite notches into the wire. The preformed solder sections are disposed equidistantly along the strand and are connected to each other by connecting links disposed at the notches. The separation means forms individual solder bodies by separating the preformed solder sections one by one at the connecting links. The separation means separates individual preformed solder sections using a cutting mechanism that moves in a direction perpendicular to the length direction of the strand. Individual solder bodies are transported to a solder jetting section where they are liquefied by a laser beam and jetted from the solder jetting section by gas pressure.

Abstract: A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

Abstract: A semiconductor-chip stack package includes a plurality of semiconductor chips disposed in a stack arrangement and at least one connecting substrate which connects the semiconductor chips. The semiconductor chips include a chip terminal face on a chip edge extending at least partially as a side terminal face in a side surface of the semiconductor chip. The side surfaces of the semiconductor chips provided with the side terminal face are arranged in a shared side surface plane S of the semiconductor-chip stack arrangement. The connecting substrate is arranged with a contact surface parallel to the side surface plane S of the semiconductor chips. Substrate terminal faces are formed on the contact surface for connecting a connection conductor structure formed in the connecting substrate and which are connected to the side terminal faces via a connecting material in a connection plane V1 parallel to the contact surface.