Abstract: The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.

Abstract: The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.

Abstract: A chuck for supporting and retaining a test substrate includes a device for supporting and retaining a calibration substrate. The chuck comprises a first support surface for supporting a test substrate and a second support surface, which is laterally offset to the first support surface, for supporting a calibration substrate. The calibration substrate has planar calibration standards for calibration of a measuring unit of a prober, and dielectric material or air situated below the calibration substrate at least in the area of the calibration standard. In order to be able to take the actual thermal conditions on the test substrate and in particular also on known and unknown calibration standards and thus the thermal influence on the electrical behavior of the calibration standard used into consideration, the second support surface is equipped for temperature control of the calibration substrate.

Abstract: An arrangement is provided for testing DUTs with a chuck that has a support surface for supporting of a DUT as well as for supplying the support surface with a defined potential, or for connecting the DUT. The arrangement further includes a positioning device for positioning the chuck as well as an electromagnetic shielding housing enclosing at least the chuck. Inside the housing and adjacent to the chuck, a signal preamplifier is arranged whose signal port facing the chuck is electrically connected with the support surface, wherein the signal preamplifier is moveable together with the chuck by the positioning device in a way that it holds its position constant relative to the chuck during positioning. The signal preamplifier is connected to a measurement unit outside of the housing via a measurement cable.

Abstract: A chuck for supporting and retaining a test substrate includes a device for supporting and retaining a calibration substrate. The chuck comprises a first support surface for supporting a test substrate and a second support surface, which is laterally offset to the first support surface, for supporting a calibration substrate. The calibration substrate has planar calibration standards for calibration of a measuring unit of a prober, and dielectric material or air situated below the calibration substrate at least in the area of the calibration standard. In order to be able to take the actual thermal conditions on the test substrate and in particular also on known and unknown calibration standards and thus the thermal influence on the electrical behavior of the calibration standard used into consideration, the second support surface is equipped for temperature control of the calibration substrate.

Abstract: An arrangement is provided for testing DUTs with a chuck that has a support surface for supporting of a DUT as well as for supplying the support surface with a defined potential, or for connecting the DUT. The arrangement further includes a positioning device for positioning the chuck as well as an electromagnetic shielding housing enclosing at least the chuck. Inside the housing and adjacent to the chuck, a signal preamplifier is arranged whose signal port facing the chuck is electrically connected with the support surface, wherein the signal preamplifier is moveable together with the chuck by the positioning device in a way that it holds its position constant relative to the chuck during positioning. The signal preamplifier is connected to a measurement unit outside of the housing via a measurement cable.

Abstract: A chuck for supporting and retaining a test substrate includes a device for supporting and retaining a calibration substrate. The chuck comprises a first support surface for supporting a test substrate and a second support surface, which is laterally offset to the first support surface, for supporting a calibration substrate The calibration substrate has planar calibration standards for calibration of a measuring unit of a prober, and dielectric material or air situated below the calibration substrate at least in the area of the calibration standard. In order to be able to take the actual thermal conditions on the test substrate and in particular also on known and unknown calibration standards and thus the thermal influence on the electrical behavior of the calibration standard used into consideration, the second support surface is equipped for temperature control of the calibration substrate.

Abstract: Method for calibrating a vectorial network analyzer, with n measurement ports (n>2) and at least m measurement sites, where m>n+1 includes measurement of three different n-port reflection standards, connected between measurement ports in any desired order, and successive measurement of reflection and transmission parameters at different transmission standards, connected between two respective measurement ports, and computational determination of error coefficients and error-corrected scattering matrices [Sx] of the n-port standards. Reflection standards, Short and Open, are unknown, but physically identical at each n-fold one-port. Reflection standard, realized by wave terminations, is known, but can be different at each n-fold one-port. Transmission standards are measured at a transmission standard, having known length and attenuation at a two-port, and at unknown transmission standards, identical for incident and reflected waves at remaining two-ports, which can be connected.

Abstract: A method is provided for calibration of a vectorial network analyzer, having n measurement ports (n>1) and at least m measurement sites with n+1<m<2n. Calibration includes measurement of three different n-port reflection standards connected between the measurement ports in any sequence, and measurement of different transmission standards connected between two measurement ports, and mathematical determination of the error coefficients of the network analyzer and the error-corrected scattering matrices [Sx] of the n-port calibration standards. The reflection standards, similar to shorts and opens, are unknown and the reflection standard implemented by wave terminations is known, but can be different at each n-fold one-port. The measurement of the transmission standards occurs on a transmission standard known in length and attenuation, which is implemented on each possible two-port by different combination of measurement ports.

Abstract: In a method for measurement of impedance of electronic circuits, an input of the electronic circuit is acted upon by a high-frequency ac voltage with a measurement frequency f as a test signal and, from the reaction of the circuit to the test signal, the impedance Z of the circuit is determined. A parameter S, which represents the value S = Z - Z 0 Z + Z 0 at a stipulated reference impedance Z0, is produced by an analyzer with a reference impedance Z0, and from this parameter S the impedance Z is determined. To minimize the error in measuring the impedances by determining parameter S, the measurement frequency f is set so that a minimal error ?Z is produced for Z.

Abstract: A chuck for supporting and retaining a test substrate includes a device for supporting and retaining a calibration substrate. The chuck comprises a first support surface for supporting a test substrate and a second support surface, which is laterally offset to the first support surface, for supporting a calibration substrate The calibration substrate has planar calibration standards for calibration of a measuring unit of a prober, and dielectric material or air situated below the calibration substrate at least in the area of the calibration standard. In order to be able to take the actual thermal conditions on the test substrate and in particular also on known and unknown calibration standards and thus the thermal influence on the electrical behavior of the calibration standard used into consideration, the second support surface is equipped for temperature control of the calibration substrate.

Abstract: In a method for calibration of a measurement unit for determination of electrical properties of electronic components using at least one planar calibration standard, an electrical measurement quantity is measured at two different temperatures. The electrical property of the calibration standard is known at at least one temperature or is to be determined by calculation. A temperature coefficient is determined from both measured quantities, which describes the relative change of the electrical property of the calibration standard accompanying the temperature change and with which the electrical property of the calibration standard is determined at a measurement temperature. From the change in electrical property, an error coefficient of the measurement unit is determined. A method is also provided for determination of an electrical property of an electronic component, using the calibration method.

Abstract: The task underlying the invention, which concerns a method for measurement of impedance of electronic circuits, in which the input of the electronic circuit is acted upon by a high-frequency ac voltage with a measurement frequency f as test signal and from the reaction of the circuit to the test signal the impedance Z of the circuit is determined, in which a parameter S, which represents the value S = Z - Z 0 Z + Z 0 at a stipulated reference impedance Z0, is produced by means of an analyzer with a reference impedance Z0, and from this parameter S the impedance Z is determined, is to minimize the error in measuring the impedances by determining parameter S. This is solved by the fact that the measurement frequency f is set so that a minimal error ?Z is produced for Z.

Abstract: In a method for determining measurement errors in scattering parameter measurements, in particular for giving the measurement accuracy of a scalar or vector network analyzer, which has n measurement ports (n?1), on the basis of the measurements of the scattering parameters of at least one reference line with defined characteristic impedance, the characteristic impedance of the reference line is calculated and the reflection values of a one-port or two-port, realized by way of the reference line, are measured. The reflection values are renormalized to the known characteristic impedance of the reference line and the source match is calculated therefrom.

Abstract: A method is provided for calibration of a vectorial network analyzer, having n measurement ports (n>1) and at least m measurement sites with n+1<m<2n. Calibration includes measurement of three different n-port reflection standards connected between the measurement ports in any sequence, and measurement of different transmission standards connected between two measurement ports, and mathematical determination of the error coefficients of the network analyzer and the error-corrected scattering matrices [Sx] of the n-port calibration standards. The reflection standards, similar to shorts and opens, are unknown and the reflection standard implemented by wave terminations is known, but can be different at each n-fold one-port. The measurement of the transmission standards occurs on a transmission standard known in length and attenuation, which is implemented on each possible two-port by different combination of measurement ports.

Abstract: A method for calibrating a vectorial network analyzer, with n measurement ports (n>2) and at least m measurement sites, where m>n+1 comprises measurement of three different n-port reflection standards, connected between measurement ports in any desired order, and successive measurement of reflection and transmission parameters at different transmission standards, connected between two respective measurement ports, and computational determination of error coefficients and error-corrected scattering matrices [Sx] of the n-port standards. Reflection standards, similar to short and open circuits, are unknown, but physically identical at each n-fold one-port. Reflection standard, realized by wave terminations, is known, but can be different at each n-fold one-port. Transmission standards are measured at a transmission standard, having known length and attenuation at a two-port, and at unknown transmission standards, identical for incident and reflected waves at remaining two-ports, which can be connected.