Abstract: An image data acquisition system for acquiring visible spectrum image data used in the inspection of circuit boards. The system comprises a rigid structure having upper and lower banks of cameras and telecentric lenses mounted in axial pairs at a substantially right angle to the circuit boards which are transported on the conveyor below. The cameras have overlapping fields of view which form a directionally contiguous band or two-dimensional web of sensor coverage. A beam splitter and mirror arrangement is mounted to the structure under the upper and lower banks such that light striking the mirror is reflected into the lower bank of cameras while light striking the beam splitter is partially reflected toward the mirror and partially transmitted through the body of the beam splitter into the upper bank of cameras.

Abstract: An integrated machine vision inspection and rework system is provided for inspecting and reworking printed circuit boards. The system includes an inspection unit that acquires image data of printed circuit boards mounted on a machine framework and a vision computer that processes the image data contained within a chamber in the framework. Also mounted on the framework is a three stage asynchronous conveyor with sensors, and drive and stepping motors that communicate with I/O boards connected to the vision computer. A rework station also mounted on the framework provides a dual reporting scheme, which includes both a laser indicator and a fault display monitor.

Abstract: A distributed light delivery system for the illumination of printed circuit boards during fault detection operations is provided. The system has at least one light delivery bar having at least two optical light lines. Each optical light line is composed of an array of optical fibers. The entire array of optical fibers are oriented within the light delivery bar at one of at least two predetermined angles. When the light bar is properly mounted and directed on a staging apparatus, the light delivery bar is effective to illuminate all four sides and the top of three-dimensional components. The distributed light delivery system thus provides uniform and substantially shadow-free illumination of discrete through-hole technology components inserted through printed circuit boards, solder paste screened onto bare circuit boards, and/or SMD technology components mounted on printed circuit boards.