Patents by Inventor Andres Covarrubias Jaramillo

Andres Covarrubias Jaramillo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro-perforated panel systems, applications, and methods of making micro-perforated panel systems
    Patent number: 11608291
    Abstract: The described embodiments relate generally to a micro-perforated panel systems and methods for noise abatement and method of making a micro-perforated panel system. In particular, embodiments relate to glass micro-perforated panel systems and methods for their construction.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: March 21, 2023
    Assignee: CORNING INCORPORATED
    Inventors: Andres Covarrubias Jaramillo, Daniel Wayne Levesque, Jr., Johannes Moll, Michael S Pambianchi, Prashanth Abraham Vanniamparambil
  • LASER-ENABLED MULTI-LAYER INK ADHESION ONTO OPTICAL FIBERS
    Publication number: 20230025312
    Abstract: A method of marking an optical fiber that includes directing a laser beam onto a first colored layer of an optical fiber. The optical fiber includes a core and a cladding surrounding the core, the first colored layer surrounds the cladding, and the laser beam modifies the first colored layer to form one or more laser-modified regions along an outer surface of the first colored layer.
    Type: Application
    Filed: July 18, 2022
    Publication date: January 26, 2023
    Inventors: Andres Covarrubias Jaramillo, John Randolph Phillips, Alranzo Boh Ruffin, Sergio Tsuda
  • MICRO-PERFORATED PANEL SYSTEMS, APPLICATIONS, AND METHODS OF MAKING MICRO-PERFORATED PANEL SYSTEMS
    Publication number: 20200262742
    Abstract: The described embodiments relate generally to a micro-perforated panel systems and methods for noise abatement and method of making a micro-perforated panel system. In particular, embodiments relate to glass micro-perforated panel systems and methods for their construction.
    Type: Application
    Filed: October 31, 2017
    Publication date: August 20, 2020
    Inventors: Andres Covarrubias Jaramillo, Daniel Wayne Levesque, Jr., Johannes Moll, Michael S Pambianchi, Prashanth Abraham Vanniamparambil
  • Articles having holes with morphology attributes and methods for fabricating the same
    Patent number: 10366904
    Abstract: Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Ra that is less than or equal to 1 ?m. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: July 30, 2019
    Assignee: Corning Incorporated
    Inventors: Andres Covarrubias Jaramillo, Yuhui Jin, Frank Andrew Kramer, IV, Ekaterina Aleksandrovna Kuksenkova, Daniel Wayne Levesque, Jr., Garrett Andrew Piech, Aric Bruce Shorey, Robert Stephen Wagner
  • ARTICLES HAVING HOLES WITH MORPHOLOGY ATTRIBUTES AND METHODS FOR FABRICATING THE SAME
    Publication number: 20180068868
    Abstract: Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Ra that is less than or equal to 1 ?m. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.
    Type: Application
    Filed: September 6, 2017
    Publication date: March 8, 2018
    Inventors: Andres Covarrubias Jaramillo, Yuhui Jin, Frank Andrew Kramer, IV, Ekaterina Aleksandrovna Kuksenkova, Daniel Wayne Levesque, JR., Garrett Andrew Piech, Aric Bruce Shorey, Robert Stephen Wagner