Patents by Inventor Andres Eduardo Avila

Andres Eduardo Avila has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6256557
    Abstract: A serial data communication system and protocol for communicating data on a serial data bus in a vehicle. The serial data communication system includes a serial data bus connected to a plurality of electronic devices in a vehicle. Each of the electronic devices includes an encoder for encoding bits of information and a decoder for receiving data and decoding the received serial data. The present invention provides for a communication protocol for communicating data on the serial data bus including the steps of providing serial data to be transmitted onto the serial data bus in the vehicle. The serial data is encoded with a pulse width varying as a function of a time, and the time-based variable pulse width is assigned to groupings of at least two data bits to code each of the data bit groupings. A series of coded data bit groupings are transmitted onto the serial data bus in the vehicle, and the electronic devices may receive and decode the encoded data signals to decipher the data.
    Type: Grant
    Filed: November 25, 1998
    Date of Patent: July 3, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Andres Eduardo Avila, Victor Mendez, Kevin Joseph Hawes
  • Patent number: 6220876
    Abstract: An integrated BEDC and PCB provided through a low cost, highly reliable interconnect system. The upper and/or lower half of the main insulation assembly of a BEDC is provided with a recess for accommodating at least an edge portion of the substrate of a PCB. The PCB is provided with apertures such as holes for receiving therethrough a bus wire and/or terminal slots through which terminals having wire slots are fixedly staked. The apertures on the PCB are arranged in a predetermined pattern so as to align with corresponding respective apertures in the form of corresponding holes and/or terminal slots on the BEDC at the recess thereof. Accordingly, with the PCB seated in the recess, as the bus wires are laid, they will pass through the holes in the PCB and/or pass through the wire slots of the terminals and thereby provide interconnection therebetween when the two halves of the main insulation assembly are united and the PCB is sandwiched therebetween.
    Type: Grant
    Filed: November 24, 1999
    Date of Patent: April 24, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Andres Eduardo Avila, David Jay Vess, Kevin Joseph Hawes, Joseph Howard Gladd, Dominic Carano, Richard Alan Natoli