Patents by Inventor Andres Fernando Munoz
Andres Fernando Munoz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8492295Abstract: A semiconductor structure fabrication method. A provided structure includes: a semiconductor substrate, a transistor on the semiconductor substrate, N interconnect layers on the semiconductor substrate, and a temporary filling region within the N layers. N is at least 2. The temporary filling region is heated at a high temperature sufficiently high to result in the temporary filling material being replaced by a cooling pipes system that does not include any solid or liquid material. A first portion and a second portion of the cooling pipes system are each in direct physical contact with a surrounding ambient at a first interface and a second interface respectively such that a first direction perpendicular to the first interface is perpendicular to a second direction perpendicular to the second interface. A totality of interfaces between the cooling pipes system and the ambient consists of the first interface and the second interface.Type: GrantFiled: September 13, 2012Date of Patent: July 23, 2013Assignee: International Business Machines CorporationInventors: Kaushik A. Kumar, Andres Fernando Munoz, Michael Ray Sievers, Richard Stephen Wise
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Publication number: 20130012018Abstract: A semiconductor structure fabrication method. A provided structure includes: a semiconductor substrate, a transistor on the semiconductor substrate, N interconnect layers on the semiconductor substrate, and a temporary filling region within the N layers. N is at least 2. The temporary filling region is heated at a high temperature sufficiently high to result in the temporary filling material being replaced by a cooling pipes system that does not include any solid or liquid material. A first portion and a second portion of the cooling pipes system are each in direct physical contact with a surrounding ambient at a first interface and a second interface respectively such that a first direction perpendicular to the first interface is perpendicular to a second direction perpendicular to the second interface. A totality of interfaces between the cooling pipes system and the ambient consists of the first interface and the second interface.Type: ApplicationFiled: September 13, 2012Publication date: January 10, 2013Applicant: International Business Machines CorporationInventors: Kaushik A. Kumar, Andres Fernando Munoz, Michael Ray Sievers, Richard Stephen Wise
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Patent number: 8298966Abstract: Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. The cooling pipes system does not include any solid or liquid material. Given any first point and any second point in the cooling pipes system, there exists a continuous path which connects the first and second points and which is totally within the cooling pipes system. A first portion of the cooling pipes system overlaps the transistor. A second portion of the cooling pipes system is higher than the substrate and lower than a top interconnect layer. The second portion is in direct physical contact with a surrounding ambient.Type: GrantFiled: February 2, 2010Date of Patent: October 30, 2012Assignee: International Business Machines CorporationInventors: Kaushik A. Kumar, Andres Fernando Munoz, Michael Ray Sievers, Richard Stephen Wise
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Publication number: 20100136800Abstract: Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. The cooling pipes system does not include any solid or liquid material. Given any first point and any second point in the cooling pipes system, there exists a continuous path which connects the first and second points and which is totally within the cooling pipes system. A first portion of the cooling pipes system overlaps the transistor. A second portion of the cooling pipes system is higher than the substrate and lower than a top interconnect layer. The second portion is in direct physical contact with a surrounding ambient.Type: ApplicationFiled: February 2, 2010Publication date: June 3, 2010Applicant: International Business Machines CorporationInventors: Kaushik A. Kumar, Andres Fernando Munoz, Michael Ray Sievers, Richard Stephen Wise
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Patent number: 7659616Abstract: Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. The cooling pipes system does not include any solid or liquid material. Given any first point and any second point in the cooling pipes system, there exists a continuous path which connects the first and second points and which is totally within the cooling pipes system. A first portion of the cooling pipes system overlaps the transistor. A second portion of the cooling pipes system is higher than the substrate and lower than a top interconnect layer. The second portion is in direct physical contact with a surrounding ambient.Type: GrantFiled: October 10, 2007Date of Patent: February 9, 2010Assignee: International Business Machines CorporationInventors: Kaushik A. Kumar, Andres Fernando Munoz, Michael Ray Sievers, Richard Stephen Wise
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Publication number: 20090096056Abstract: Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. The cooling pipes system does not include any solid or liquid material. Given any first point and any second point in the cooling pipes system, there exists a continuous path which connects the first and second points and which is totally within the cooling pipes system. A first portion of the cooling pipes system overlaps the transistor. A second portion of the cooling pipes system is higher than the substrate and lower than a top interconnect layer. The second portion is in direct physical contact with a surrounding ambient.Type: ApplicationFiled: October 10, 2007Publication date: April 16, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kaushik A. Kumar, Andres Fernando Munoz, Michael Ray Sievers, Richard Stephen Wise