Patents by Inventor ANDRES GABRIEL HOFMANN

ANDRES GABRIEL HOFMANN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10129997
    Abstract: A guide assembly an enclosure-based device such as a computer provided in a rack-mountable chassis. The guide assembly is configured to facilitate blind connector mating such as electrical interconnection between a receiving connector on a previously-mounted board and an edge connector on a circuit board supported in a housing of a module that is slid or inserted into the interior space of the enclosure or chassis. The guide assembly (and devices that include a guide assembly) address the two design challenges discussed above of increasing numbers of circuits in devices that need to be connected and of decreasing pitch between the connectors. The guide assembly is configured, with its mechanical features, to decouple the degrees of freedom (DOFs) between the module being inserted into the chassis and the receiving/mating connector on the previously-mounted board. The guide assembly constrains five out of the six DOFs, which effectively ensures proper connector mating.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: November 13, 2018
    Assignee: ORACLE INTERNATIONAL CORPORATION
    Inventors: Andres Gabriel Hofmann, Rebecca Di Ricco Kurzava, Gabrielle Kariann Stetor
  • Patent number: 10051758
    Abstract: A rack-mountable system is provided that includes fastening mechanisms mounted to the chassis sidewalls. The fastening mechanisms or “ears” of a rack-mountable chassis are each provided as a unitary part or piece rather than as multiple sheet metal or cast/extruded metallic parts that have to be assembled. The ear is attached or mounted to the chassis in a tool-less manner through specific design of the ear and its chassis-locking features and of holes and/or receiving/mating surfaces and/or openings on the chassis sidewalls. The left and right (or first and second) ears are manufactured in a number of ways including 3D printing, casting, and molding in a shock and impact-resistant material, such as a plastic (e.g., a thermoplastic). The chassis with the low-cost, tool-less ears are useful for mounting routers, switches, servers, digital data storage units, and instrumentation in a rack (e.g., a conventional enclosure for computer and telecommunications equipment).
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: August 14, 2018
    Assignee: ORACLE INTERNATIONAL CORPORATION
    Inventors: Andres Gabriel Hofmann, Eric Munro Innes
  • Publication number: 20180192535
    Abstract: A guide assembly an enclosure-based device such as a computer provided in a rack-mountable chassis. The guide assembly is configured to facilitate blind connector mating such as electrical interconnection between a receiving connector on a previously-mounted board and an edge connector on a circuit board supported in a housing of a module that is slid or inserted into the interior space of the enclosure or chassis. The guide assembly (and devices that include a guide assembly) address the two design challenges discussed above of increasing numbers of circuits in devices that need to be connected and of decreasing pitch between the connectors. The guide assembly is configured, with its mechanical features, to decouple the degrees of freedom (DOFs) between the module being inserted into the chassis and the receiving/mating connector on the previously-mounted board. The guide assembly constrains five out of the six DOFs, which effectively ensures proper connector mating.
    Type: Application
    Filed: January 5, 2017
    Publication date: July 5, 2018
    Inventors: ANDRES GABRIEL HOFMANN, REBECCA DI RICCO KURZAVA, GABRIELLE KARIANN STETOR
  • Patent number: 9965001
    Abstract: A computer enclosure with a mounting assembly for accurately positioning, attaching, and supporting a circuit board within an enclosure or module without tools or fasteners. The mounting assembly includes a number of components and features that act as low-cost, tool-less mechanisms for mounting and fastening a circuit board within an enclosure with accurate locating of the board for later mating with other boards and/or electrical connectors. The mounting assembly allows for a circuit board to be installed and securely mounted to an enclosure without hardware, fasteners, and tools. This is accomplished through components that were designed and engineered to provide accurate positioning of the board within the enclosure when the board is snapped into place with a single hand of the installer and without the use of tools for fastening the board in a predefined location within the enclosure.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: May 8, 2018
    Assignee: ORACLE INTERNATIONAL CORPORATION
    Inventors: Gabrielle Kariann Stetor, Andres Gabriel Hofmann, Eric Munro Innes
  • Publication number: 20180070469
    Abstract: A rack-mountable system is provided that includes fastening mechanisms mounted to the chassis sidewalls. The fastening mechanisms or “ears” of a rack-mountable chassis are each provided as a unitary part or piece rather than as multiple sheet metal or cast/extruded metallic parts that have to be assembled. The ear is attached or mounted to the chassis in a tool-less manner through specific design of the ear and its chassis-locking features and of holes and/or receiving/mating surfaces and/or openings on the chassis sidewalls. The left and right (or first and second) ears are manufactured in a number of ways including 3D printing, casting, and molding in a shock and impact-resistant material, such as a plastic (e.g., a thermoplastic). The chassis with the low-cost, tool-less ears are useful for mounting routers, switches, servers, digital data storage units, and instrumentation in a rack (e.g., a conventional enclosure for computer and telecommunications equipment).
    Type: Application
    Filed: September 8, 2016
    Publication date: March 8, 2018
    Inventors: ANDRES GABRIEL HOFMANN, ERIC MUNRO INNES