Patents by Inventor Andrew Alexander Taylor

Andrew Alexander Taylor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10002785
    Abstract: A semiconductor process for providing a metal layer uses the following steps: A barrier dielectric layer is deposited on a semiconductor layer comprising an exposed metal line. A via layer is formed on top of the barrier dielectric layer comprising at least one via. A non-conformal film is deposited on top of the via layer thereby forming a void in the at least one via, and at least one trench is etched into the non-conformal film thereby opening the void, and creating a dual-damascene layer.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: June 19, 2018
    Assignee: MICROCHIP TECHNOLOGY INCORPORATED
    Inventors: Justin Hiroki Sato, Andrew Alexander Taylor
  • Publication number: 20150380298
    Abstract: A semiconductor process for providing a metal layer uses the following steps: A barrier dielectric layer is deposited on a semiconductor layer comprising an exposed metal line. A via layer is formed on top of the barrier dielectric layer comprising at least one via. A non-conformal film is deposited on top of the via layer thereby forming a void in the at least one via, and at least one trench is etched into the non-conformal film thereby opening the void, and creating a dual-damascene layer.
    Type: Application
    Filed: June 10, 2015
    Publication date: December 31, 2015
    Applicant: MICROCHIP TECHNOLOGY INCORPORATED
    Inventors: Justin Hiroki Sato, Andrew Alexander Taylor