Patents by Inventor Andrew Anthony Mojica

Andrew Anthony Mojica has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7850870
    Abstract: Conductive curable compositions contain a free radical polymerizable monomer, oligomer or polymer (i); an organoborane amine complex (ii), and an electrically or thermally conductive filler (iii). The conductive curable compositions can also contain an amine reactive compound having amine reactive groups (iv); and (v) a component capable of generating a gas when mixed with a compound bearing active hydrogen and a catalyst. The electrically conductive curable compositions can be used in composite articles of manufacture in which substrates are coated or bonded together with the composition and cured; and as electrically conductive rubbers, electrically conductive tapes, electrically conductive adhesives, electrically conductive foams, and electrically conductive pressure sensitive adhesives.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: December 14, 2010
    Assignee: Dow Corning Corporation
    Inventors: Dongchan Ahn, Mark David Fisher, Andrew Anthony Mojica
  • Patent number: 6815486
    Abstract: A phase change composition comprises: a matrix comprising a silicone-organic block copolymer, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: November 9, 2004
    Assignee: Dow Corning Corporation
    Inventors: Dorab Edul Bhagwagar, Andrew Anthony Mojica, Kimmai Thi Nguyen
  • Publication number: 20030194537
    Abstract: A phase change composition comprises: a matrix comprising a silicone-organic block copolymer, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.
    Type: Application
    Filed: April 12, 2002
    Publication date: October 16, 2003
    Inventors: Dorab Edul Bhagwagar, Andrew Anthony Mojica, Kimmai Thi Nguyen
  • Patent number: 6201055
    Abstract: A silicone composition for preparing a silicone pressure sensitive adhesive, the composition comprising (A) 20 to 55 parts by weight of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 45 to 80 parts by weight of an organopolysiloxane resin consisting essentially of R33 SiO1/2 units and SiO4/2 units, wherein the total amount of components (A) and (B) is 100 parts by weight; (C) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition; (D) 25 to 200 parts by weight of a silica filler having an average surface area less than 25 m2/g; and (E) a catalytic amount of a hydrosilylation catalyst. Each R3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups. The mole ratio of R33SiO1/2 units to SiO4/2 units in the organopolysiloxane resin is from 0.6:1 to 1.
    Type: Grant
    Filed: March 11, 1999
    Date of Patent: March 13, 2001
    Assignee: Dow Corning Corporation
    Inventors: Michael Andrew Lutz, Andrew Anthony Mojica, Michael John Watson