Abstract: The present invention provides fully IgG bi-specific antibodies comprising designed residues in the interface of the heavy chain-heavy chain (CH3/CH3) domains, processes for preparing said fully IgG bi-specific antibodies, and nucleic acids, vectors and host cells encoding the same.

Abstract: An implant system for implantation at a joint. The implant system includes an implant device with a body portion having first and second ends, and a first elongate member, extending from the first or second end of the body portion. The implant system has a corresponding fixation device with at least one latching element. The first elongate member has at least one cooperating element capable of cooperating with the at least one latching element of the fixation device in use.

Abstract: Systems, methods, and computer-readable storage devices are disclosed for simulated choral audio chatter in communication systems. One method including: receiving audio data from each of a plurality of users participating in a first group of a plurality of groups for an event using a communication system; generating first simulated choral audio chatter based on the audio data received from each of the plurality of users in the first group; and providing the generated first simulated choral audio data to at least one user of a plurality of users of the event.

Abstract: A map-based graphical user interface for a social media application displays to special social media activity information based on submission of geo-tagged social media items to the platform. For users and or submitted items that need predefined location fuzzing criteria, such activity is represented in the graphical user interface at an intentionally inaccurate position.

Abstract: An integrated circuit (IC) package with an embedded heat spreader in a redistribution layer (RDL) is provided. IC packaging facilitates a high density package for ICs, including monolithic microwave integrated circuits (MMICs). However, IC packaging may result in reduced heat removal from an IC, decreasing radio frequency (RF) circuit performance. In an exemplary aspect, an IC package is provided which incorporates an embedded heat spreader within a dielectric layer of an RDL coupled to an IC die. The embedded heat spreader provides efficient heat transfer, robust RF performance, and operation through millimeter wave (mmW) frequencies, all in a miniature low-cost, low-profile surface mountable (SM) package.

Abstract: A monolithic microwave integrated circuit (MMIC) with embedded transmission line (ETL) ground shielding is provided. In an exemplary aspect, an ETL MMIC according to this disclosure includes a MMIC substrate having an active side, an ETL dielectric layer covering the active side, and a topside ground plane over the ETL dielectric layer. The active side includes one or more transmission lines or other components which may undesirably couple to metal signal lines (e.g., package metal interconnects) in an external circuit assembly. The topside ground plane in the ETL MMIC provides shielding to reduce such electromagnetic coupling. The topside ground plane can also facilitate improved thermal paths for heat dissipation, such as through a redistribution layer (RDL) to a next higher assembly (NHA) and/or through a backside ground plane of the MMIC substrate.

Abstract: A reconfigurable capillary liquid chromatography system includes a solvent delivery manager including a first solvent pump assembly including a first pump housing or mount. A base module is further provided including a base module housing which is user accessible, or a base module bracket, and an injection valve for sample injection to a liquid chromatography column. The injection valve has an inlet port for receiving a sample and the injection valve is mounted in or on the base module housing or the base module bracket. The solvent delivery manager is configured to deliver solvent to the injection valve. A reconfigurable control system is also provided for controlling the reconfigurable capillary liquid chromatography system.

Abstract: Monolithic microwave integrated circuits (MMICs) with backside interconnects for fanout-style packaging are disclosed. Fanout-style packaging, such as fanout wafer (FOWLP) or fanout panel-level packaging (FOPLP), facilitates a high density package for MMICs. However, the fanout-style packaging may produce undesired electromagnetic (EM) coupling between a MMIC die and metal features in a redistribution layer (RDL) of the FOW/PLP package and/or a next higher assembly (NHA). In an exemplary aspect, a circuit package according to this disclosure includes the MMIC die and an RDL. The MMIC includes a chip side with components which may undesirably couple to metal signal lines (e.g., package metal interconnects) in the RDL. The chip side of the MMIC is oriented away from the RDL to reduce such EM coupling.

Abstract: A monolithic microwave integrated circuit (MMIC) with embedded transmission line (ETL) ground shielding is provided. In an exemplary aspect, an ETL MMIC according to this disclosure includes a MMIC substrate having an active side, an ETL dielectric layer covering the active side, and a topside ground plane over the ETL dielectric layer. The active side includes one or more transmission lines or other components which may undesirably couple to metal signal lines (e.g., package metal interconnects) in an external circuit assembly. The topside ground plane in the ETL MMIC provides shielding to reduce such electromagnetic coupling. The topside ground plane can also facilitate improved thermal paths for heat dissipation, such as through a redistribution layer (RDL) to a next higher assembly (NHA) and/or through a backside ground plane of the MMIC substrate.

Abstract: An integrated circuit (IC) package with an embedded heat spreader in a redistribution layer (RDL) is provided. IC packaging facilitates a high density package for ICs, including monolithic microwave integrated circuits (MMICs). However, IC packaging may result in reduced heat removal from an IC, decreasing radio frequency (RF) circuit performance. In an exemplary aspect, an IC package is provided which incorporates an embedded heat spreader within a dielectric layer of an RDL coupled to an IC die. The embedded heat spreader provides efficient heat transfer, robust RF performance, and operation through millimeter wave (mmW) frequencies, all in a miniature low-cost, low-profile surface mountable (SM) package.

Abstract: According to aspects of the present disclosure there are provided methods and apparatus for providing a user-centric application comprising a plurality of service modules, the method comprising identifying available resources associated with each of a plurality of edge devices in the local network, identifying a first device of the local network, the first device offering a user input service, identifying a second device of the local network, the second device to receive an output event and present the output event for consumption by the user, for each service module, each service module to provide a portion of a functionality of the user-centric application and having an associated resource request, deploying the service module to an edge device based on the associated resource request and the identified available resources, and configuring data flows between the deployed service modules, the first device, and the second device to realize the user-centric application.

Abstract: An integrated circuit (IC) package with an embedded heat spreader in a redistribution layer (RDL) is provided. IC packaging facilitates a high density package for ICs, including monolithic microwave integrated circuits (MMICs). However, IC packaging may result in reduced heat removal from an IC, decreasing radio frequency (RF) circuit performance. In an exemplary aspect, an IC package is provided which incorporates an embedded heat spreader within a dielectric layer of an RDL coupled to an IC die. The embedded heat spreader provides efficient heat transfer, robust RF performance, and operation through millimeter wave (mmW) frequencies, all in a miniature low-cost, low-profile surface mountable (SM) package.

Abstract: A composite joint implant device replaces or repairs damaged meniscus tissue in an animal or human. In one embodiment, a composite joint implant comprises a polymeric body which is reinforced with a pre-formed engineered ligature mechanism. The ligature reinforces the polymeric body around the circumference and is used for attaching the device within an animal or human body. The ligature mechanism internally supports the transmission of vertical loads into tensile stresses. The ligature mechanism can be coated with a compatible material to promote integration with the polymeric body and coated with an encapsulation material.

Abstract: A monolithic microwave integrated circuit (MMIC) with embedded transmission line (ETL) ground shielding is provided. In an exemplary aspect, an ETL MMIC according to this disclosure includes a MMIC substrate having an active side, an ETL dielectric layer covering the active side, and a topside ground plane over the ETL dielectric layer. The active side includes one or more transmission lines or other components which may undesirably couple to metal signal lines (e.g., package metal interconnects) in an external circuit assembly. The topside ground plane in the ETL MMIC provides shielding to reduce such electromagnetic coupling. The topside ground plane can also facilitate improved thermal paths for heat dissipation, such as through a redistribution layer (RDL) to a next higher assembly (NHA) and/or through a backside ground plane of the MMIC substrate.

Abstract: A fluidic valve may include an inlet, a control port, an additional control port, an outlet, a fluid channel configured to convey fluid from the inlet to the outlet, and a piston that includes (1) a restricting gate transmission element configured to block, when the piston is in a first position, the fluid channel and unblock, when the piston is in a second position, the fluid channel, (2) a controlling gate transmission element configured to interface with a control pressure from the control port that forces the piston towards the first position when applied to the controlling gate transmission element, and (3) an additional controlling gate transmission element configured to interface with an additional control pressure from the additional control port that forces the piston towards the second position when applied to the additional controlling gate transmission element. Various other related devices, systems, and methods are also disclosed.

Abstract: A composite joint implant device replaces or repairs damaged meniscus tissue in an animal or human. In one embodiment, a composite joint implant comprises a polymeric body which is reinforced with a pre-formed engineered ligature mechanism. The ligature reinforces the polymeric body around the circumference and is used for attaching the device within an animal or human body. The ligature mechanism internally supports the transmission of vertical loads into tensile stresses. The ligature mechanism can be coated with a compatible material to promote integration with the polymeric body and coated with an encapsulation material.

Abstract: A method creates haptic stimulations on a user of an artificial reality system. The system includes a head-mounted display (HMD) and a wearable device. The HMD includes a display and speakers. The wearable device includes a plurality of transducers that can each generate waves to provide haptic feedback to a user. The system displays media content on the display and, in accordance with the displayed media content, determines a virtual object location in the displayed media content corresponding to a physical object location. The system provides, to the user, audio directed to the virtual object location. The system activates one or more transducers to provide haptic feedback at a target location on the user, distinct from the physical object location, to produce haptic feedback whose perceptual interpretation is at the physical object location based on a combination of the displayed media, the provided audio, and the haptic feedback.

Abstract: The systems and methods described herein provide a wearable sweat sensing device. The device includes a sweat patch component including a sweat biochemical sensor patch having a substrate defining a hole, at least one biochemical sensor, and a capture wick including a tip that extends through the hole, the capture wick configured to channel sweat across the at least one biochemical sensor. The sweat patch component further includes a wick downstream from the capture wick and separated from the capture wick by a gap, and electronic circuitry disposed against at least one face of the wick, wherein an electronic response of the electronic circuitry changes as sweat flows through the wick. The wearable sweat sensing device further includes an electronics module component configured to facilitate assessing hydration of a wearer based on signals from the at least one biochemical sensor and the electronic circuitry.

Abstract: Example devices include a fluidic device, such as a fluidic valve, including a body formed from a rigid body material including a fluidic source, a fluidic drain, and a fluidic gate, each of which may have a fluid connection with a chamber, or a portion thereof. The device may further include a gate transmission element, located within the chamber, that is controllable between at least a first position and a second position using a gate pressure received through the fluidic drain. Adjustment of the position of the gate transmission element may allow control of fluid flow through the device. Other devices, methods, systems, and computer-readable media are also disclosed.

Abstract: A fluid handling apparatus for a bioprocessing system includes a first plate having a first surface and a second surface, at least one fluid flow channel formed in the first surface, at least one valve recess formed in the first surface along the at least one fluid flow channel, and at least one fluid passageway extending through the first plate from the at least one fluid flow channel to the second surface, and a sealing layer disposed over the first surface and enclosing the at least one fluid flow channel. The at least one valve recess is configured to cooperate with an actuator and the sealing layer to prevent a flow of fluid through the at least one fluid flow channel.