Abstract: A wearable interstitial fluid (ISF) sensing includes a first patch layer and an electronics module component layer. The electronics module component layer is laminated to the first patch layer to form a patch component and a plurality of microneedles extending from the patch component. The electronics module component layer includes a substrate and a sensor positioned on the substrate. Each microneedle of the plurality of microneedles includes a microneedle base extending from the patch component, a body extending from the microneedle base, and a tip extending from the body. The body defines a slot extending through the first patch layer of the body. The slot defines a first opening and a second opening. The at least one sensor is positioned over the second opening. The first opening, the slot, and the sensor define a channel exposed to the environment. The channel is configured to channel ISF to the sensor.

Abstract: A microneedle actuator for monitoring ISF of a user includes a rigid support defining a slot, a geared cam positioned within the rigid support and including an axle extending through the slot, and a spring positioned within the rigid support and configured to rotate the geared cam about the axle. The microneedle actuator further includes an ISF sensing module and an actuation device. The ISF sensing module is attached to the geared cam and including a plurality of microneedles, each microneedle of the plurality of microneedles including at least one sensor for detecting the ISF of the user. The actuation device is attached to the rigid support and the geared cam. Actuation of the actuation device releases the spring, rotating the geared cam to insert the plurality of microneedles into the user's skin, and wherein the at least one sensor detects constituents of the ISF of the user.

Abstract: An implant system for implantation at a joint. The implant system includes an implant device with a body portion having first and second ends, and a first elongate member, extending from the first or second end of the body portion. The implant system has a corresponding fixation device with at least one latching element. The first elongate member has at least one cooperating element capable of cooperating with the at least one latching element of the fixation device in use.

Abstract: A composite joint implant device replaces or repairs damaged meniscus tissue in an animal or human. In one embodiment, a composite joint implant comprises a polymeric body which is reinforced with a pre-formed engineered ligature mechanism. The ligature reinforces the polymeric body around the circumference and is used for attaching the device within an animal or human body. The ligature mechanism internally supports the transmission of vertical loads into tensile stresses. The ligature mechanism can be coated with a compatible material to promote integration with the polymeric body and coated with an encapsulation material.

Abstract: An implant system for implantation at a joint. The implant system includes an implant device with a body portion having first and second ends, and a first elongate member, extending from the first or second end of the body portion. The implant system has a corresponding fixation device with at least one latching element. The first elongate member has at least one cooperating element capable of cooperating with the at least one latching element of the fixation device in use.

Abstract: A fireplace assembly includes: a housing defining an airflow space and an inner chamber; one or more fans disposed in the housing to facilitate airflow through the airflow space; a flame generator disposed in the inner chamber and capable of generating a flame with a maximum heat output of at least 20,000 BTU (British thermal units); a display device disposed in the housing and configured to display a visual image in front of or behind the flame generator; one or more glass panels disposed in the housing to at least partially define the airflow space to facilitate the airflow; and a control module operatively coupled with the display device and disposed within the airflow space. The airflow through the airflow space is configured to control temperature within the airflow space.

Abstract: Provided herein are computer implemented methods, systems and processes for determining a transmission metric or transmission path for related pathogens. Also provided herein is a non-transitory computer-readable storage medium with an executable program stored thereon, which program is configured to instruct a microprocessor to generate a transmission path for related pathogens.

Abstract: A reconfigurable capillary liquid chromatography system includes a solvent delivery manager including a first solvent pump assembly including a first pump housing or mount. A base module is further provided including a base module housing which is user accessible, or a base module bracket, and an injection valve for sample injection to a liquid chromatography column. The injection valve has an inlet port for receiving a sample and the injection valve is mounted in or on the base module housing or the base module bracket. The solvent delivery manager is configured to deliver solvent to the injection valve. A reconfigurable control system is also provided for controlling the reconfigurable capillary liquid chromatography system.

Abstract: A reconfigurable capillary liquid chromatography system includes a solvent delivery manager including a first solvent pump assembly including a first pump housing or mount. A base module is further provided including a base module housing which is user accessible, or a base module bracket, and an injection valve for sample injection to a liquid chromatography column. The injection valve has an inlet port for receiving a sample and the injection valve is mounted in or on the base module housing or the base module bracket. The solvent delivery manager is configured to deliver solvent to the injection valve. A reconfigurable control system is also provided for controlling the reconfigurable capillary liquid chromatography system.

Abstract: An implant system for implantation at a joint. The implant system includes an implant device with a body portion having first and second ends, and a first elongate member, extending from the first or second end of the body portion. The implant system has a corresponding fixation device with at least one latching element. The first elongate member has at least one cooperating element capable of cooperating with the at least one latching element of the fixation device in use.

Abstract: An integrated circuit (IC) package with an embedded heat spreader in a redistribution layer (RDL) is provided. IC packaging facilitates a high density package for ICs, including monolithic microwave integrated circuits (MMICs). However, IC packaging may result in reduced heat removal from an IC, decreasing radio frequency (RF) circuit performance. In an exemplary aspect, an IC package is provided which incorporates an embedded heat spreader within a dielectric layer of an RDL coupled to an IC die. The embedded heat spreader provides efficient heat transfer, robust RF performance, and operation through millimeter wave (mmW) frequencies, all in a miniature low-cost, low-profile surface mountable (SM) package.

Abstract: A monolithic microwave integrated circuit (MMIC) with embedded transmission line (ETL) ground shielding is provided. In an exemplary aspect, an ETL MMIC according to this disclosure includes a MMIC substrate having an active side, an ETL dielectric layer covering the active side, and a topside ground plane over the ETL dielectric layer. The active side includes one or more transmission lines or other components which may undesirably couple to metal signal lines (e.g., package metal interconnects) in an external circuit assembly. The topside ground plane in the ETL MMIC provides shielding to reduce such electromagnetic coupling. The topside ground plane can also facilitate improved thermal paths for heat dissipation, such as through a redistribution layer (RDL) to a next higher assembly (NHA) and/or through a backside ground plane of the MMIC substrate.

Abstract: A reconfigurable capillary liquid chromatography system includes a solvent delivery manager including a first solvent pump assembly including a first pump housing or mount. A base module is further provided including a base module housing which is user accessible, or a base module bracket, and an injection valve for sample injection to a liquid chromatography column. The injection valve has an inlet port for receiving a sample and the injection valve is mounted in or on the base module housing or the base module bracket. The solvent delivery manager is configured to deliver solvent to the injection valve. A reconfigurable control system is also provided for controlling the reconfigurable capillary liquid chromatography system.

Abstract: Monolithic microwave integrated circuits (MMICs) with backside interconnects for fanout-style packaging are disclosed. Fanout-style packaging, such as fanout wafer (FOWLP) or fanout panel-level packaging (FOPLP), facilitates a high density package for MMICs. However, the fanout-style packaging may produce undesired electromagnetic (EM) coupling between a MMIC die and metal features in a redistribution layer (RDL) of the FOW/PLP package and/or a next higher assembly (NHA). In an exemplary aspect, a circuit package according to this disclosure includes the MMIC die and an RDL. The MMIC includes a chip side with components which may undesirably couple to metal signal lines (e.g., package metal interconnects) in the RDL. The chip side of the MMIC is oriented away from the RDL to reduce such EM coupling.

Abstract: A monolithic microwave integrated circuit (MMIC) with embedded transmission line (ETL) ground shielding is provided. In an exemplary aspect, an ETL MMIC according to this disclosure includes a MMIC substrate having an active side, an ETL dielectric layer covering the active side, and a topside ground plane over the ETL dielectric layer. The active side includes one or more transmission lines or other components which may undesirably couple to metal signal lines (e.g., package metal interconnects) in an external circuit assembly. The topside ground plane in the ETL MMIC provides shielding to reduce such electromagnetic coupling. The topside ground plane can also facilitate improved thermal paths for heat dissipation, such as through a redistribution layer (RDL) to a next higher assembly (NHA) and/or through a backside ground plane of the MMIC substrate.

Abstract: An integrated circuit (IC) package with an embedded heat spreader in a redistribution layer (RDL) is provided. IC packaging facilitates a high density package for ICs, including monolithic microwave integrated circuits (MMICs). However, IC packaging may result in reduced heat removal from an IC, decreasing radio frequency (RF) circuit performance. In an exemplary aspect, an IC package is provided which incorporates an embedded heat spreader within a dielectric layer of an RDL coupled to an IC die. The embedded heat spreader provides efficient heat transfer, robust RF performance, and operation through millimeter wave (mmW) frequencies, all in a miniature low-cost, low-profile surface mountable (SM) package.

Abstract: According to aspects of the present disclosure there are provided methods and apparatus for providing a user-centric application comprising a plurality of service modules, the method comprising identifying available resources associated with each of a plurality of edge devices in the local network, identifying a first device of the local network, the first device offering a user input service, identifying a second device of the local network, the second device to receive an output event and present the output event for consumption by the user, for each service module, each service module to provide a portion of a functionality of the user-centric application and having an associated resource request, deploying the service module to an edge device based on the associated resource request and the identified available resources, and configuring data flows between the deployed service modules, the first device, and the second device to realize the user-centric application.

Abstract: An integrated circuit (IC) package with an embedded heat spreader in a redistribution layer (RDL) is provided. IC packaging facilitates a high density package for ICs, including monolithic microwave integrated circuits (MMICs). However, IC packaging may result in reduced heat removal from an IC, decreasing radio frequency (RF) circuit performance. In an exemplary aspect, an IC package is provided which incorporates an embedded heat spreader within a dielectric layer of an RDL coupled to an IC die. The embedded heat spreader provides efficient heat transfer, robust RF performance, and operation through millimeter wave (mmW) frequencies, all in a miniature low-cost, low-profile surface mountable (SM) package.

Abstract: A composite joint implant device replaces or repairs damaged meniscus tissue in an animal or human. In one embodiment, a composite joint implant comprises a polymeric body which is reinforced with a pre-formed engineered ligature mechanism. The ligature reinforces the polymeric body around the circumference and is used for attaching the device within an animal or human body. The ligature mechanism internally supports the transmission of vertical loads into tensile stresses. The ligature mechanism can be coated with a compatible material to promote integration with the polymeric body and coated with an encapsulation material.

Abstract: A monolithic microwave integrated circuit (MMIC) with embedded transmission line (ETL) ground shielding is provided. In an exemplary aspect, an ETL MMIC according to this disclosure includes a MMIC substrate having an active side, an ETL dielectric layer covering the active side, and a topside ground plane over the ETL dielectric layer. The active side includes one or more transmission lines or other components which may undesirably couple to metal signal lines (e.g., package metal interconnects) in an external circuit assembly. The topside ground plane in the ETL MMIC provides shielding to reduce such electromagnetic coupling. The topside ground plane can also facilitate improved thermal paths for heat dissipation, such as through a redistribution layer (RDL) to a next higher assembly (NHA) and/or through a backside ground plane of the MMIC substrate.