Abstract: Systems and methods according to aspects of the subject technology provide for power line communication (PLC) coupling through two-wire and three-wire external power supplies. In some aspects of the subject technology, a three-wire solution is provided that allows the transfer of direct current (DC) power signals, differential PLC signals, and a zero-cross signal between an external power supply and a PLC device using three wires. This may be accomplished by multiplexing two signals on two of the three wires. In some aspects of the subject technology, a two-wire solution is provided that allows the transfer of DC power signals, differential PLC signals, and a zero-cross signal between an external power supply and a PLC device using two wires. This may be accomplished by multiplexing two signals on one of the wires and three signals on the other wire.

Abstract: A method of forming a SOI wafer obtains an intermediate apparatus having a first wafer, a second wafer, and an insulator material bonding the first and second wafers together. The first wafer has an oxygen precipitate concentration sufficient for gettering. The method reduces the profile of at least a portion of the first wafer to form an exposed surface, and adds a layer of material to the exposed surface of the first wafer. The layer of material substantially integrates with the first wafer to have substantially the same structure.