Abstract: A power control circuit to control data center power delivery is disclosed. In at least one embodiment, the power control circuit may be configured to selectively cause at least a portion of a supplied power to be directed to one or more server racks or to charge one or more batteries based, at least in part on, one or more charge levels corresponding to the one or more batteries.

Abstract: A flexible cold plate assembly may include a flexible cold plate which allows for conformance or flexing to support warping associated with an underlying computing component. The conformance or flexing may be based, at least in part, on one or more of a thin base plate, on heat removal surface extensions of the flexible cold plate assembly having multiple cross-cuts therein, or a distribution seal having conformance or flexing properties. The cross-cuts may be perpendicular to a direction of flow of a fluid through the heat removal surface extensions to provide the conformance or flexing in the flexible cold plate.

Abstract: A deformation assembly, in at least one aspect, may support a cold plate assembly or may be part of the cold plate assembly which includes a cold plate. The deformation assembly may allow a controlled deformation to the cold plate. The controlled deformation may deform the cold plate to a predetermined curvature of a computing component.

Abstract: Example graphics processing subsystems and computing devices that include the graphics processing subsystem(s) are described. In one example, the graphics processing subsystem may comprise a first fan, a second fan and a printed circuit board (PCB) on which a processor is disposed. The first fan may be associated with a first axis about which the first fan is rotatable. The second fan may be associated with a second axis about which the second fan is rotatable. The PCB may be shaped and positioned such that (a) a first airflow path for cooling the processor traverses through the first fan and a first opening below the first fan, and (b) a second airflow path for cooling the processor traverses through the second fan and a second opening below the second fan. The first airflow path and the second airflow path are substantially linear relative to the respective first axis and second axis.

Abstract: According to various embodiments, a processing subsystem includes: a processor mounted on a first printed circuit board that is oriented parallel to a first plane; a heat sink thermally coupled to the processor; a second printed circuit board that is communicatively coupled to the first printed circuit board and oriented parallel to a second plane, wherein the second plane is not parallel with the first plane; and at least one cooling fan that is positioned to direct a cooling fluid through the heat sink in a direction parallel to the first plane.

Abstract: According to various embodiments, a processing subsystem includes: a processor mounted on a first printed circuit board that is oriented parallel to a first plane; a heat sink thermally coupled to the processor; a second printed circuit board that is communicatively coupled to the first printed circuit board and oriented parallel to a second plane, wherein the second plane is not parallel with the first plane; and at least one cooling fan that is positioned to direct a cooling fluid through the heat sink in a direction parallel to the first plane.

Abstract: A method for controlling header cut height on a combine. The combine includes an adapter, a header pivotably mounted to the adapter, a cutter bar assembly operatively extending across a front portion of the header, and a gauge wheel pivotably coupled to the header. The method comprising the steps of receiving a request to adjust a height of the cutter bar assembly, determining whether a position of a first cylinder is greater than a value, and if it is determined that the position of the first cylinder is greater than the value, using the first cylinder to adjust the height of the cutter bar assembly.

Abstract: A graphics subsystem includes a printed circuit board (PCB), a blower, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU similarly occupies just a portion of the width of the graphics subsystem. The blower is disposed adjacent to the PCB and heat sink and configured to occupy the full height of the graphics subsystem. The blower is further configured to intake air from both the top side of the graphics subsystem and the bottom side of the graphics subsystem. In this configuration, the blower provides an elevated air flow rate in order to facilitate cooling of the PCB and/or GPU.

Abstract: A portable computing device comprises: a base portion that includes a keyboard; and a display portion that is movably coupled to the base portion and includes: a heat sink with cooling fins; one or more heat-generating electronic devices that are thermally coupled to the heat sink; and at least one cooling fan configured to direct cooling air across the cooling fins.

Abstract: There is disclosed a piezoelectric ceramic having the composition: a[PbTiO3]-b[SrTiO3]-c[BiFeO3]-d[(KxBi1-x)TiO3]; wherein 0.4<x<0.6; 0.1<a<0.4; 0.01<b?0.2; c?0.05; d?0.01; and a+b+c+d=1 optionally comprising an A- or B-site metal dopant in an amount of up to 2 at. %.

Abstract: A mixture for forming a wear resistant layer on a substrate comprises particles of a first wear resistant particle type, particles of a second wear resistant particle type and a wear resistant layer binder for binding the first and the second wear resistant particles in the wear resistant layer when the layer is formed. As well, wear resistant particle size distributions for the first and second wear resistant particle types have a first mode and a second mode. The first particle type is associated with the first mode and the second particle type is associated with the second mode. Moreover, a number of first wear resistant particles associated with the first mode is larger than a number of second wear resistant particles associated with the second mode. Further, the second mode is larger than the first mode.

Abstract: According to various embodiments, a processing subsystem includes: a processor mounted on a first printed circuit board that is oriented parallel to a first plane; a heat sink thermally coupled to the processor; a second printed circuit board that is communicatively coupled to the first printed circuit board and oriented parallel to a second plane, wherein the second plane is not parallel with the first plane; and at least one cooling fan that is positioned to direct a cooling fluid through the heat sink in a direction parallel to the first plane.

Abstract: A computing device comprises: a heat sink that has a plurality of cooling fins and a vapor chamber; one or more heat-generating electronic devices that are thermally coupled to the vapor chamber; and at least one cooling fan configured to direct cooling air across the plurality of cooling fins, wherein a first fin included in the plurality of cooling fins and a second fin included in the plurality of cooling fins form a first air passage that has a first air inlet opening and a first air outlet opening, and wherein the first fin is adjacent to the second fin, and a first distance between the first fin and the second fin proximate to the first air inlet opening is less than a second distance between the first fin and the second fin proximate to the first air outlet opening.

Abstract: A graphics subsystem includes a printed circuit board (PCB), a set of one or more fans, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU and configured to extend beyond an edge of the PCB, thereby occupying a larger portion of the width of the graphics subsystem compared to the PCB. A first fan is disposed partially or fully beyond the edge of the PCB and is configured to direct air through the portion of the heat sink that extends beyond the edge of the PCB, along a first airflow path, and out of the graphics subsystem. A second fan is configured to direct air through the heat sink, along a second airflow path, towards the GPU.

Abstract: For mechanical keyboards or other input devices with individual mechanical key buttons, and particularly for compact keyboards used for laptops and other such devices, the size of the up and down arrow keys is usually half the size of most other keys on the keyboard. For example, each letter key on a physical keyboard is typically double the size of each of the up and down arrow keys on that same keyboard. Due to the smaller physical size of the up and down arrow keys, a modified mechanical configuration is used which results in a variation in the tactile feel of the various buttons of the keyboard for a user. The present disclosure discloses a capacitive touch enabled key with a corresponding tactile button to allow the key to represent multiple different inputs while also maintaining a same tactile response as other single input keys of the input device.

Abstract: Crop is carried into a feed opening of a harvester by two side drapers, two rear back sheets defining an opening between inner edges, a central feed draper and a roller with end flight portions and a central finger portion located above the feed draper. In this geometry, a bottom tangent to the flight portions has a position which is at a height below the rear edge of the side drapers. The roller axis of the feed roller is behind the rear edge of the side drapers and behind a common plane containing the back sheets. The inner guide roller of each of the first and second side drapers is located inwardly of the inner edge of the first back sheet and inwardly of an outer end of the end flight portion. A forward most tangent to the flight portions projects forward of or proud of the common back sheet plane.

Abstract: A power adapter has a solenoid actuated retaining latch controlled by an electronic circuit that detects the presence or absence of AC mains voltage. When the assembled AC-DC adapter and plug assembly are removed from the wall, the latch detects removal and unlocks the plug assembly for easy removal without undue force required by the user. The circuit is designed for minimal power consumption, and the solenoid only consumes power when it is engaging or disengaging the latch.

Abstract: A computing device comprises: a base portion; a display portion that is movably coupled to the base portion and includes a housing having a movable panel and one or more fixed panels; and a mechanical assembly that positions the movable panel away from the one or more fixed panels as the display portion opens away from the base portion.

Abstract: A composite material comprising a plurality of round particles bound together by a binding material. Each of the plurality of round particles includes a wear resistant element, an intermediate coating on the wear resistant element, and a round outer layer encapsulating the intermediate coating and the wear resistant element. The intermediate coating is metallurgically bonded to the wear resistant element, and is metallurgically bondable to the binding material.

Abstract: A graphics subsystem includes a printed circuit board (PCB), a blower, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU similarly occupies just a portion of the width of the graphics subsystem. The blower is disposed adjacent to the PCB and heat sink and configured to occupy the full height of the graphics subsystem. The blower is further configured to intake air from both the top side of the graphics subsystem and the bottom side of the graphics subsystem. In this configuration, the blower provides an elevated air flow rate in order to facilitate cooling of the PCB and/or GPU.