Patents by Inventor Andrew Bemis
Andrew Bemis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11359985Abstract: The disclosed technology includes an oil-filled pressure transducer assembly and an oil-filled compensating sensing element disposed near one another and attached to a common housing. The oil-filled pressure transducer assembly may receive and measure pressure media via a first oil-filled cavity and a protective diagram in communication with the pressure media. The compensating sensing element may be isolated from the pressure media. In certain example implementations, the compensating sensing element is configured to measure certain common error phenomena that are also measured by the oil-filled pressure transducer assembly, for example, due to acceleration, temperature, and/or vibration. In certain implementations, the signal measured by the compensating sensing element may be subtracted from the signal measured by the oil-filled pressure transducer assembly to provide a compensated output signal.Type: GrantFiled: August 12, 2019Date of Patent: June 14, 2022Assignee: KULITE SEMICONDUCTOR PRODUCTS, INC.Inventors: Alexander A. Ned, Sorin Stefanescu, Andrew Bemis, Scott Goodman
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Publication number: 20210048363Abstract: The disclosed technology includes an oil-filled pressure transducer assembly and an oil-filled compensating sensing element disposed near one another and attached to a common housing. The oil-filled pressure transducer assembly may receive and measure pressure media via a first oil-filled cavity and a protective diagram in communication with the pressure media. The compensating sensing element may be isolated from the pressure media. In certain example implementations, the compensating sensing element is configured to measure certain common error phenomena that are also measured by the oil-filled pressure transducer assembly, for example, due to acceleration, temperature, and/or vibration. In certain implementations, the signal measured by the compensating sensing element may be subtracted from the signal measured by the oil-filled pressure transducer assembly to provide a compensated output signal.Type: ApplicationFiled: August 12, 2019Publication date: February 18, 2021Inventors: Alexander A. Ned, Sorin Stefanescu, Andrew Bemis, Scott Goodman
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Patent number: 10132705Abstract: Systems and methods are disclosed for a pressure sensor device. The pressure sensor device includes a header that defines an interior cavity including one or more tether connecting regions. The header further defines an outer portion in communication with the interior cavity; the outer portion includes a plurality of through bores in communication with an exterior portion of the header for insertion of header pins through the header. The pressure sensor device includes a pressure sensor chip disposed within the interior cavity of the header. One or more anchoring tethers are attached to the corresponding one or more tether connecting regions. The pressure sensor chip is free to move within the interior cavity of the header, and the one or more anchoring tethers are in communication with the pressure sensor chip and are configured to limit movement of the pressure sensor chip within the header.Type: GrantFiled: July 19, 2016Date of Patent: November 20, 2018Assignee: Kulite Semiconductor Products, Inc.Inventors: Sorin Stefanescu, Alexander A. Ned, Joseph R. VanDeWeert, Andrew Bemis
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Publication number: 20180024020Abstract: Systems and methods are disclosed for a pressure sensor device. The pressure sensor device includes a header that defines an interior cavity including one or more tether connecting regions. The header further defines an outer portion in communication with the interior cavity; the outer portion includes a plurality of through bores in communication with an exterior portion of the header for insertion of header pins through the header. The pressure sensor device includes a pressure sensor chip disposed within the interior cavity of the header. One or more anchoring tethers are attached to the corresponding one or more tether connecting regions. The pressure sensor chip is free to move within the interior cavity of the header, and the one or more anchoring tethers are in communication with the pressure sensor chip and are configured to limit movement of the pressure sensor chip within the header.Type: ApplicationFiled: July 19, 2016Publication date: January 25, 2018Inventors: Sorin Stefanescu, Alexander A. Ned, Joseph R. VanDeWeert, Andrew Bemis
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Patent number: 9429491Abstract: Example embodiments of the disclosed technology methods, devices, and systems for compensating a sensor having thermal gradients. In one embodiment, a system is provided that includes a sensor, including a first half-bridge transducer configured to output a first pressure signal associated with a first received pressure; a first set of span resistors coupled to the first half-bridge transducer, and configured generate a first compensated pressure signal; a second half-bridge transducer, configured to output a second pressure signal associated with a second received pressure; and a second set of span resistors coupled to the second half-bridge transducer and configured to generate a second compensated pressure signal. The system includes an output port that is configured to output a signal associated with a difference between the first compensated pressure signal and the second compensated pressure signal.Type: GrantFiled: January 23, 2014Date of Patent: August 30, 2016Assignee: Kulite Semiconductor Products, Inc.Inventors: Andrew Bemis, Timothy Nunn, Joseph VanDeWeert
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Publication number: 20150204746Abstract: This disclosure provides example methods, devices, and systems for compensating a sensor having thermal gradients.Type: ApplicationFiled: January 23, 2014Publication date: July 23, 2015Applicant: Kulite Semiconductor Products, Inc.Inventors: Andrew Bemis, Timothy Nunn, Joseph R. VanDeWeert
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Patent number: 8910524Abstract: A gage/differential pressure transducer assembly having enhanced output capabilities, comprising a first pressure port adapted to communicate a first pressure to a first sensor, the first sensor comprising a first Wheatstone bridge adapted to output a first signal indicative of the first pressure, wherein the first pressure is a main pressure; and a second pressure port adapted to communicate a second pressure to a second sensor, the second sensor comprising a second Wheatstone bridge adapted to output a second signal indicative of the second pressure, wherein the second pressure is a reference pressure; and an output port connected to the first Wheatstone bridge and the second Wheatstone bridge for outputting a third signal representative of the difference between the first and second pressures.Type: GrantFiled: December 8, 2011Date of Patent: December 16, 2014Assignee: Kulite Semiconductor Products, Inc.Inventors: Andrew Bemis, Timothy Nunn
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Publication number: 20130145854Abstract: A gage/differential pressure transducer assembly having enhanced output capabilities, comprising a first pressure port adapted to communicate a first pressure to a first sensor, the first sensor comprising a first Wheatstone bridge adapted to output a first signal indicative of the first pressure, wherein the first pressure is a main pressure; and a second pressure port adapted to communicate a second pressure to a second sensor, the second sensor comprising a second Wheatstone bridge adapted to output a second signal indicative of the second pressure, wherein the second pressure is a reference pressure; and an output port connected to the first Wheatstone bridge and the second Wheatstone bridge for outputting a third signal representative of the difference between the first and second pressures.Type: ApplicationFiled: December 8, 2011Publication date: June 13, 2013Applicant: Kulite Semiconductor Products, Inc.Inventors: ANDREW BEMIS, Timothy Nunn
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Patent number: 6523415Abstract: A pressure transducer including: a silicon substrate including: a first surface adapted for receiving a pressure applied thereto, an oppositely disposed second surface, and a flexing portion adapted to deflect when pressure is applied to the first surface; at least a first sensor formed on the second surface and adjacent to a center of the flexing portion, and adapted to measure the pressure applied to the first surface; at least a second gauge sensor formed on the second surface and adjacent to a periphery of the flexing portion, and adapted to measure the pressure applied to the first surface; a glass substrate secured to the second surface of the silicon wafer.Type: GrantFiled: August 6, 2001Date of Patent: February 25, 2003Assignee: Kulite Semiconductor Products, Inc.Inventors: Anthony D. Kurtz, Andrew Bemis, Timothy Nunn, Joseph Van De Weert
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Publication number: 20020000127Abstract: A pressure transducer including: a silicon substrate including: a first surface adapted for receiving a pressure applied thereto, an oppositely disposed second surface, and a flexing portion adapted to deflect when pressure is applied to the first surface; at least a first sensor formed on the second surface and adjacent to a center of the flexing portion, and adapted to measure the pressure applied to the first surface; at least a second gauge sensor formed on the second surface and adjacent to a periphery of the flexing portion, and adapted to measure the pressure applied to the first surface; a glass substrate secured to the second surface of the silicon wafer.Type: ApplicationFiled: August 6, 2001Publication date: January 3, 2002Inventors: Anthony D. Kurtz, Andrew Bemis, Timothy Nunn, Joseph Van De Weert
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Patent number: 6272929Abstract: A pressure transducer including: a silicon substrate including: a first surface adapted for receiving a pressure applied thereto, an oppositely disposed second surface, and a flexing portion adapted to deflect when pressure is applied to the first surface; at least a first sensor formed on the second surface and adjacent to a center of the flexing portion, and adapted to measure the pressure applied to the first surface; at least a second gauge sensor formed on the second surface and adjacent to a periphery of the flexing portion, and adapted to measure the pressure applied to the first surface; a glass substrate secured to the second surface of the silicon wafer.Type: GrantFiled: February 4, 1999Date of Patent: August 14, 2001Assignee: Kulite Semiconductor ProductsInventors: Anthony D. Kurtz, Andrew Bemis, Timothy Nunn, Joseph Van De Weert