Abstract: A method of making a surface-mountable pixel engine package comprises providing an array of spaced-apart conductive pillars and an insulating mold compound laterally disposed between the conductive pillars on a substrate together defining a planarized surface. Pixel engines comprising connection posts are printed to the conductive pillars so that each of the connection posts is in electrical contact with one of the conductive pillars. The pixel engines are tested to determine known-good pixel engines. An optically clear mold compound is provided over the planarized surface and tested pixel engines. Optically clear mold compound is adhered to a tape and the substrate is removed. The optically clear mold compound, the insulating mold compound, the conductive pillars, the optically clear mold compound, and the tested pixel engines are singulated to provide pixel packages that comprise the pixel engines and the known-good pixel engines are transferred to a reel or tray.

Abstract: A current-selectable light-emitting-diode (LED) display includes pixels distributed in an array of rows and columns. The pixels are grouped in mutually exclusive clusters and cluster controllers are connected to each pixel in a cluster of pixels to control the pixels in the cluster to emit light. Each cluster controller comprises a selectable current source. Each of the selectable current sources can include cluster current sources that are responsive to a current-select signal to enable one or more of the cluster current sources. The pixels can include micro-LEDs and the cluster controller can be disposed between the micro-LEDs. The display can be disposed on a display substrate with signal wires. The signal wires can include separate wire segments that are electrically connected through regeneration circuits that regenerate the signals. The display can be an information display or a backlight.

Abstract: An electrical conductor structure comprises a substrate and an electrical conductor disposed on or in the substrate. The electrical conductor comprises a first layer and a second layer disposed on a side of the first layer opposite the substrate. The first layer comprises a first electrical conductor that forms a non-conductive layer on a surface of the first electrical conductor when exposed to air and the second layer comprising a second electrical conductor that does not form a non-conductive layer on a surface of the second electrical conductor when exposed to air. A component comprises a connection post that is electrically connected to the second layer and the electrical conductor. The first and second layers can be inorganic. The first layer can comprise a metal such as aluminum and the second layer can comprise an electrically conductive metal oxide such as indium tin oxide.

Abstract: An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

Abstract: A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.

Abstract: An interpolated flat-panel display comprises a display substrate and an array of clusters disposed on the display substrate. Each cluster comprises an exclusive group of display pixels and a cluster controller for controlling the display pixels. The cluster controller is operable to receive input data specifying a desired light output from one or more but fewer than all of the display pixels in the group of display pixels, calculate interpolated data at least in part from the input data, and drive the display pixels to emit light in response to the calculated interpolated data and received input data. The input data can correspond to an image pixel in an input image. The cluster controller can be operable to receive a parameter value describing attributes of a local portion of the input image including the image pixel and the interpolated data is calculated at least in part from the parameter value.

Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

Abstract: A flat-panel display comprises a display substrate, an array of pixels distributed in rows and columns over the display substrate, the array having a column-control side, and column controller disposed on the column-control side of the array providing column data to the array of pixels through column-data lines. In some embodiments, rows of pixels in the array of pixels form row groups and each column of pixels in a row group receives column data through a separate column-data line. In some embodiments, each pixel in each column of pixels in the array of pixels is serially connected and each pixel in the array of pixels comprises a token-passing circuit for passing a token through the serially connected column of pixels.

Abstract: An electrical conductor structure comprises a substrate and an electrical conductor disposed on or in the substrate. The electrical conductor comprises a first layer and a second layer disposed on a side of the first layer opposite the substrate. The first layer comprises a first electrical conductor that forms a non-conductive layer on a surface of the first electrical conductor when exposed to air and the second layer comprising a second electrical conductor that does not form a non-conductive layer on a surface of the second electrical conductor when exposed to air. A component comprises a connection post that is electrically connected to the second layer and the electrical conductor. The first and second layers can be inorganic. The first layer can comprise a metal such as aluminum and the second layer can comprise an electrically conductive metal oxide such as indium tin oxide.

Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.

Abstract: A flat-panel display comprises a display substrate, an array of pixels distributed in rows and columns over the display substrate, the array having a column-control side, and column controller disposed on the column-control side of the array providing column data to the array of pixels through column-data lines. In some embodiments, rows of pixels in the array of pixels form row groups and each column of pixels in a row group receives column data through a separate column-data line. In some embodiments, each pixel in each column of pixels in the array of pixels is serially connected and each pixel in the array of pixels comprises a token-passing circuit for passing a token through the serially connected column of pixels.

Abstract: A tiled display structure comprises a screen support having a screen emitter side and an opposing screen back side. A black matrix comprises a patterned layer of black-matrix material disposed on the screen back side, the pattern defining pixel openings that are substantially devoid of black-matrix material. An array of tiles comprises tiles each having a tile substrate and a plurality of pixels disposed in or on the tile substrate. Each pixel comprises one or more light emitters. The one or more light emitters are each disposed to emit light through a pixel opening in the black matrix. A substantially transparent adhesive layer adheres the array of tiles to the black-matrix material.

Abstract: An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.

Abstract: A pulse-density-modulation display and image capture system comprises a display comprising a plurality of pixels. Each pixel comprises a light emitter that controllably emits light at a constant current for a variable amount of time and a control circuit connected to the light emitter to control the light emitter to emit light in response to an input signal specifying the desired luminance of the light emitter. The control circuit converts the input signal to a non-contiguous pulse-density-modulation signal and controls the light emitter to emit light in response to the non-contiguous pulse-density-modulation signal with a temporally variable constant-current control signal. Each pixel emits light responsive to a display timing signal. The pulse-density-modulation display and image capture system also comprises a sampling camera that records the pixels and is responsive to a camera timing signal different from the display timing signal.

Abstract: Provided is a method including providing a first audio content object that includes a plurality of audio content segments to a set of user computing devices. Each audio content segment of the plurality of audio content segments is associated with a first version. The method also includes obtaining a second version of a first audio content segment and updating the first version of the first audio content segment to the second version to generate a second audio content object that includes the second version of the first audio content segment and at least a first version of a second audio content segment. The method also includes providing the second audio content object to at least a first portion of the set of user computing devices and indicating a version history of the first audio content segment to at least the first portion of the set of user computing devices.

Abstract: A pulse-density-modulation display and image capture system comprises a display comprising a plurality of pixels. Each pixel comprises a light emitter that controllably emits light at a constant current for a variable amount of time and a control circuit connected to the light emitter to control the light emitter to emit light in response to an input signal specifying the desired luminance of the light emitter. The control circuit converts the input signal to a non-contiguous pulse-density-modulation signal and controls the light emitter to emit light in response to the non-contiguous pulse-density-modulation signal with a temporally variable constant-current control signal. Each pixel emits light responsive to a display timing signal. The pulse-density-modulation display and image capture system also comprises a sampling camera that records the pixels and is responsive to a camera timing signal different from the display timing signal.

Abstract: An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

Abstract: A flat-panel display comprises a display substrate, an array of pixels distributed in rows and columns over the display substrate, the array having a column-control side, and column controller disposed on the column-control side of the array providing column data to the array of pixels through column-data lines. In some embodiments, rows of pixels in the array of pixels form row groups and each column of pixels in a row group receives column data through a separate column-data line. In some embodiments, each pixel in each column of pixels in the array of pixels is serially connected and each pixel in the array of pixels comprises a token-passing circuit for passing a token through the serially connected column of pixels.