Patents by Inventor Andrew C. Alduino
Andrew C. Alduino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210288035Abstract: Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.Type: ApplicationFiled: March 12, 2020Publication date: September 16, 2021Applicant: Intel CorporationInventors: Thomas Liljeberg, Andrew C. Alduino, Ravindranath Vithal Mahajan, Ling Liao, Kenneth Brown, James Jaussi, Bharadwaj Parthasarathy, Nitin A. Deshpande
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Publication number: 20210210478Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: ApplicationFiled: March 3, 2021Publication date: July 8, 2021Inventors: Susheel JADHAV, Juan DOMINGUEZ, Ankur AGRAWAL, Kenneth BROWN, Yi LI, Jing CHEN, Aditi MALLIK, Xiaoyu HONG, Thomas LILJEBERG, Andrew C. ALDUINO, Ling LIAO, David HUI, Ren-Kang CHIOU, Harinadh POTLURI, Hari MAHALINGAM, Lobna KAMYAB, Sasanka KANUPARTHI, Sushrutha Reddy GUJJULA, Saeed FATHOLOLOUMI, Priyanka DOBRIYAL, Boping XIE, Abiola AWUJOOLA, Vladimir TAMARKIN, Keith MEASE, Stephen KEELE, David SCHWEITZER, Brent ROTHERMEL, Ning TANG, Suresh POTHUKUCHI, Srikant NEKKANTY, Zhichao ZHANG, Kaiyuan ZENG, Baikuan WANG, Donald TRAN, Ravindranath MAHAJAN, Baris BICEN, Grant SMITH
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Patent number: 10295283Abstract: Generally discussed herein are devices and methods for thermal management of a component. An apparatus can include a phase change material substantially at a phase transition temperature of the phase change material, a component near, on, or at least partially in the phase change material, and a heat removal device to transfer heat energy away from the phase change material and maintain the phase change material substantially at the phase transition temperature.Type: GrantFiled: December 18, 2015Date of Patent: May 21, 2019Assignee: Intel CorporationInventors: Michael K. Patterson, Andrew C. Alduino
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Patent number: 9904027Abstract: Embodiments of the present disclosure provide techniques and configurations for a rack assembly. In one embodiment, a tray to be disposed in a rack assembly may comprise a plurality of sleds with individual sleds including one or more compute nodes; and a networking element coupled with a sled of the plurality of sleds and configured to communicatively connect the sled to one or more other components of the rack assembly via an optical communication system. The optical communication system may include an external optical cable configured to communicatively connect the networking element with the rack assembly. Other embodiments may be described and/or claimed.Type: GrantFiled: December 14, 2016Date of Patent: February 27, 2018Assignee: Intel CorporationInventors: Donald L. Faw, Uri V. Cummings, Terrence J. Trausch, Daniel P. Daly, Andrew C. Alduino
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Publication number: 20170176118Abstract: Generally discussed herein are devices and methods for thermal management of a component. An apparatus can include a phase change material substantially at a phase transition temperature of the phase change material, a component near, on, or at least partially in the phase change material, and a heat removal device to transfer heat energy away from the phase change material and maintain the phase change material substantially at the phase transition temperature.Type: ApplicationFiled: December 18, 2015Publication date: June 22, 2017Inventors: Michael K. Patterson, Andrew C. Alduino
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Publication number: 20170102510Abstract: Embodiments of the present disclosure provide techniques and configurations for a rack assembly. In one embodiment, a tray to be disposed in a rack assembly may comprise a plurality of sleds with individual sleds including one or more compute nodes; and a networking element coupled with a sled of the plurality of sleds and configured to communicatively connect the sled to one or more other components of the rack assembly via an optical communication system. The optical communication system may include an external optical cable configured to communicatively connect the networking element with the rack assembly. Other embodiments may be described and/or claimed.Type: ApplicationFiled: December 14, 2016Publication date: April 13, 2017Inventors: Donald L. FAW, Uri V. CUMMINGS, Terrence J. TRAUSCH, Daniel P. DALY, Andrew C. ALDUINO
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Patent number: 9609782Abstract: Embodiments of the present disclosure provide techniques and configurations for a rack assembly. In one embodiment, a tray to be disposed in a rack assembly may comprise a plurality of sleds with individual sleds including one or more compute nodes; and a networking element coupled with a sled of the plurality of sleds and configured to communicatively connect the sled to one or more other components of the rack assembly via an optical communication system. The optical communication system may include an external optical cable configured to communicatively connect the networking element with the rack assembly. Other embodiments may be described and/or claimed.Type: GrantFiled: January 15, 2014Date of Patent: March 28, 2017Assignee: INTEL CORPORATIONInventors: Donald L. Faw, Uri V. Cummings, Terrence J. Trausch, Daniel P. Daly, Andrew C. Alduino
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Publication number: 20150334867Abstract: Embodiments of the present disclosure provide techniques and configurations for a rack assembly. In one embodiment, a tray to be disposed in a rack assembly may comprise a plurality of sleds with individual sleds including one or more compute nodes; and a networking element coupled with a sled of the plurality of sleds and configured to communicatively connect the sled to one or more other components of the rack assembly via an optical communication system. The optical communication system may include an external optical cable configured to communicatively connect the networking element with the rack assembly. Other embodiments may be described and/or claimed.Type: ApplicationFiled: January 15, 2014Publication date: November 19, 2015Inventors: Donald L. FAW, Uri V. CUMMINGS, Terrence J. TRAUSCH, Daniel P. DALY, Andrew C. ALDUINO
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Patent number: 7782921Abstract: An electrical-optical coupling and detecting device. An apparatus according to an embodiment of the present invention includes a reflective surface defined on semiconductor material. The reflective surface is to reflect an incident optical beam towards an optical destination. An optical detector is monolithically integrated in the reflective surface of the semiconductor material. The optical detector arranged in the reflective surface of the semiconductor material is to detect the incident optical beam.Type: GrantFiled: March 28, 2005Date of Patent: August 24, 2010Assignee: Intel CorporationInventors: Andrew C. Alduino, Mario J. Paniccia, Rami Cohen, Assia Barkai, Ansheng Liu
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Patent number: 7344383Abstract: A split microprocessor socket is disclosed that provides a cavity created at an outer edge of the microprocessor socket. An optical module may be fitted in the cavity thus providing an optical fiber or waveguide connection directly to the socket. This low cost optical interconnect, closely packaged with the microprocessor, may alleviate bandwidth constraints associated with conventional electrical connections.Type: GrantFiled: December 27, 2006Date of Patent: March 18, 2008Assignee: Intel CorporationInventors: Daoqiang Lu, Andrew C. Alduino, Henning Braunisch
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Patent number: 7306378Abstract: An electrical-optical coupling device. An apparatus according to an embodiment of the present invention includes a first trench defined in a first semiconductor substrate. A first reflector is defined at a first end of the first trench in the first semiconductor substrate. The first reflector is angled with respect to an axis of the first trench. A first optical fiber is disposed in the first trench at a second end of the first trench. An optical source is mounted to the first semiconductor substrate proximate to the first trench. The optical source is optically coupled to the first optical fiber via the first reflector.Type: GrantFiled: May 6, 2004Date of Patent: December 11, 2007Assignee: Intel CorporationInventors: Andrew C. Alduino, Mario J. Paniccia
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Patent number: 7231150Abstract: A temperature sensing and control method and apparatus. In one aspect of the present invention, an apparatus according to the teachings of the present invention includes an optical path disposed in semiconductor material. A four-terminal resistor is defined in the semiconductor material. At least a portion of the optical path is directed through the four-terminal resistor. The four-terminal resistor includes a first pair of terminals between which a probe current is to be injected. The four-terminal resistor also includes a second pair of terminals between which a voltage drop is to be measured so as to determine a resistance along the portion of the optical path directed through the four-terminal resistor. Temperature may be derived from the determined resistance of the four-terminal resistor. In one embodiment, the temperature of the semiconductor material may then be controlled with a heater in response to the derived temperature.Type: GrantFiled: October 23, 2002Date of Patent: June 12, 2007Assignee: Intel CorporationInventors: Dean A. Samara-Rubio, Andrew C. Alduino, Christina A. Frost
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Patent number: 7130111Abstract: An optical amplifier comprises a device substrate, a first waveguide embedded in the device substrate, and a plurality of lasers. The lasers are positioned to provide a first plurality of light beams substantially transverse to the first waveguide.Type: GrantFiled: December 13, 2001Date of Patent: October 31, 2006Assignee: Intel CorporationInventors: Andrew C. Alduino, Rongchung Tyan, Christopher J. Scholz
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Patent number: 6856732Abstract: A semiconductor-based tunable add/drop method and apparatus. In one aspect of the present invention, a method according to an embodiment of the present invention includes splitting a first optical beam having multiple wavelengths into second and third optical beams with a first 3 dB optical coupler disposed in a semiconductor substrate. Portions of the second and third optical beams having a tunable wavelength are reflected back to the first 3 dB optical coupler with first and second pluralities of silicon and polysilicon interfaces, respectively, disposed along the semiconductor substrate. In another embodiment, the portions of the second and third optical beams having a tunable wavelength are reflected back to the first 3 dB optical coupler with first and second pluralities of modulated charged regions. Portions of the second and third optical beams not reflected are directed to a second 3 dB optical coupler disposed in the semiconductor substrate.Type: GrantFiled: September 28, 2001Date of Patent: February 15, 2005Assignee: Intel CorporationInventors: Ansheng Liu, Mario J. Paniccia, Remus Nicolaescu, Andrew C. Alduino, Ling Liao
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Patent number: 6853759Abstract: A temperature sensing and control method and apparatus. In one aspect of the present invention, an apparatus according to the teachings of the present invention includes an optical path disposed in semiconductor material, a grating disposed in the optical path, and a thermal probe including an optical sensor optically coupled to the grating to sense a spectral response of the grating. The thermal probe is adapted to determine a temperature of the optical path in which the grating is disposed in response to the spectral response of the grating.Type: GrantFiled: February 12, 2003Date of Patent: February 8, 2005Assignee: Intel CorporationInventors: Dean A. Samara-Rubio, Andrew C. Alduino, Christina A. Frost
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Publication number: 20040156575Abstract: A temperature sensing and control method and apparatus. In one aspect of the present invention, an apparatus according to the teachings of the present invention includes an optical path disposed in semiconductor material, a grating disposed in the optical path, and a thermal probe including an optical sensor optically coupled to the grating to sense a spectral response of the grating. The thermal probe is adapted to determine a temperature of the optical path in which the grating is disposed in response to the spectral response of the grating.Type: ApplicationFiled: February 12, 2003Publication date: August 12, 2004Inventors: Dean A. Samara-Rubio, Andrew C. Alduino, Christina A. Frost
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Publication number: 20040081223Abstract: A temperature sensing and control method and apparatus. In one aspect of the present invention, an apparatus according to the teachings of the present invention includes an optical path disposed in semiconductor material. A four-terminal resistor is defined in the semiconductor material. At least a portion of the optical path is directed through the four-terminal resistor. The four-terminal resistor includes a first pair of terminals between which a probe current is to be injected. The four-terminal resistor also includes a second pair of terminals between which a voltage drop is to be measured so as to determine a resistance along the portion of the optical path directed through the four-terminal resistor. Temperature may be derived from the determined resistance of the four-terminal resistor. In one embodiment, the temperature of the semiconductor material may then be controlled with a heater in response to the derived temperature.Type: ApplicationFiled: October 23, 2002Publication date: April 29, 2004Inventors: Dean A. Samara-Rubio, Andrew C. Alduino, Christina A. Frost
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Patent number: 6721087Abstract: An optical amplifier comprises a device substrate, a first waveguide embedded in the device substrate, a plurality of pumping waveguides coupled along interspersed portions of the first waveguide, and a plurality of lasers. The lasers are positioned to provide pumping light beams into the pumping waveguides.Type: GrantFiled: December 13, 2001Date of Patent: April 13, 2004Assignee: Intel CorporationInventors: Andrew C. Alduino, Dmitri E. Nikonov, David S. Funk, Christopher J. Scholz
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Publication number: 20030112495Abstract: An optical amplifier comprises a device substrate, a first waveguide embedded in the device substrate, and a plurality of lasers. The lasers are positioned to provide a first plurality of light beams substantially transverse to the first waveguide.Type: ApplicationFiled: December 13, 2001Publication date: June 19, 2003Inventors: Andrew C. Alduino, Rongchung Tyan, Christopher J. Scholz
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Publication number: 20030112497Abstract: An optical amplifier comprises a device substrate, a first waveguide embedded in the device substrate, a plurality of pumping waveguides coupled along interspersed portions of the first waveguide, and a plurality of lasers. The lasers are positioned to provide pumping light beams into the pumping waveguides.Type: ApplicationFiled: December 13, 2001Publication date: June 19, 2003Inventors: Andrew C. Alduino, Dmitri E. Nikonov, David S. Funk, Christopher J. Scholz