Patents by Inventor Andrew C. Chen

Andrew C. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240127451
    Abstract: Described herein are methods and computer systems for classification of CD8 T-cell topology using a patient response-based linear cutoff model. A plurality of histology images of tissue samples in a plurality of patients are received by a computer system. An image analysis of the plurality of histology images is performed to obtain a CD8+ T-cell abundance in the tumor parenchyma and stroma in each of the plurality of histology images. Real inflammation scores and tumor infiltration scores are determined based on a polar coordinate transformation of the CD8+ T-cell abundance in the tumor parenchyma and stroma. Based on the real inflammation scores and tumor infiltration scores, a feature space is generated, and linear boundaries or linear cutoffs between a plurality of classifications in the feature space are identified based on the real inflammation scores, the tumor infiltration scores, and patient response data.
    Type: Application
    Filed: February 25, 2022
    Publication date: April 18, 2024
    Applicant: Bristol-Myers Squibb Company
    Inventors: George C. Lee, Robin Edwards, Scott Ely, Daniel N. Cohen, John B. Wojcik, Vipul A. Baxi, Dimple Pandya, Jimena Trillo-Tinoco, Benjamin J. Chen, Andrew Fisher, Falon Gray
  • Publication number: 20240096721
    Abstract: An electronic package of which the manufacturing method is to dispose an electronic element on a circuit portion, encapsulate the electronic element with an Ajinomoto build-up film (ABF) used as an encapsulating layer, form a wiring layer on the encapsulating layer, and form a conductive via in the encapsulating layer. Therefore, the wiring layer can be well bonded onto the encapsulating layer as the ABF material is used as the encapsulating layer.
    Type: Application
    Filed: August 28, 2023
    Publication date: March 21, 2024
    Inventors: Chien-Kuang LAI, Andrew C. CHANG, Min-Yao CHEN
  • Publication number: 20240096776
    Abstract: A package substrate is provided and includes a core board body and a first circuit structure and a second circuit structure disposed on opposite sides of the core board body, where the number of wiring layers of the second circuit structure is different from the number of wiring layers of the first circuit structure, so that the package substrate is asymmetrical. The first circuit structure and the second circuit structure are designed according to the thickness and coefficient of thermal expansion of the first dielectric layer of the first circuit structure and the second dielectric layer of the second circuit structure, so as to prevent the problem of warping from occurring to the package substrate.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 21, 2024
    Inventors: Andrew C. CHANG, Min-Yao CHEN, Sung-Kun LIN
  • Patent number: 8431350
    Abstract: The present invention relates to compositions containing a novel protein and methods of using those compositions for the diagnosis and treatment of immune related diseases involving detection of the PRO52254 polypeptide.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: April 30, 2013
    Assignee: Genentech, Inc.
    Inventors: Daryl T. Baldwin, Sarah C. Bodary-Winter, Andrew C. Chen, Hilary Clark, Janet K. Jackman, William I. Wood
  • Publication number: 20110104170
    Abstract: The present invention relates to compositions containing a novel protein and methods of using those compositions for the diagnosis and treatment of immune related diseases.
    Type: Application
    Filed: December 14, 2010
    Publication date: May 5, 2011
    Applicant: Genentech, Inc.
    Inventors: Daryl T. Baldwin, Sarah C. Bodary, Andrew C. Chen, Hilary Clark, Janet K. Jackman, William I. Wood
  • Patent number: D1022714
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: April 16, 2024
    Assignee: Apple Inc.
    Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Kevin Will Chen, Andrew Patrick Clymer, Clara Geneviève Marine Courtaigne, Markus Diebel, Alan C. Dye, Aurelio Guzmán, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Duncan Robert Kerr, Aaron Mathew Melim, Marc A. Newson, Peter Russell-Clarke, Benjamin Andrew Shaffer, Joe Sung-Ho Tan, Clement Tissandier, Jacob Weiss, Eugene Antony Whang, Rico Zörkendörfer