Abstract: Disclosed herewith a interconnection system includes an optoelectronic receptacle connector including insulative housing defines a cylindrical receiving chamber having a front and a rear end. An aligning pin extends from the rear end into the chamber and with an optical receiver disposed in the chamber. An optoelectronic plug connector includes a jack member defining a passage to receive the aligning pin when the plug connector is inserted into the receptacle connector. An organizer is enveloped on the jack member and defines at least a pair of orifices aligned with the optical receiver. And an optoelectronic cable includes at least a pair of fiber optics disposed within the orifices of the organizer and at least a conductive wires terminated to the jack member.

Abstract: A reworking device (10) for removing an electrical element (20) mounted on a motherboard (40) comprises a body portion (12), a pair of hooks (14) formed at two opposite ends of the body portion for engaging with a bottom surface of the element, and an elastic arm (16) formed at each of the two opposite ends of the body portion to lift up the element-when solders are reflown.

Abstract: An electrical connector comprises a wafer integrally formed with a pair of terminal pairs and each pair configured by first and second terminals. The first terminal includes a first base portion having a first tail portion, and a first mating portion, the first tail and mating portions extending beyond the wafer. The second terminal includes a second base portion having a second tail portion, and a second mating portion, the second tail and mating portions extending beyond the wafer; wherein the first and second base portions of the first and second terminal are spaced apart from each other in a side-by-side arrangement.

Abstract: An electrical connector comprises a wafer integrally formed with a pair of terminal pairs and each pair configured by first and second terminals. The first terminal includes a first base portion having a first tail portion, and a first mating portion, the first tail and mating portions extending beyond the wafer. The second terminal includes a second base portion having a second tail portion, and a second mating portion, the second tail and mating portions extending beyond the wafer; wherein the first and second base portions of the first and second terminal are spaced apart from each other in a side-by-side arrangement.