Patents by Inventor Andrew C. Engel

Andrew C. Engel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mounting block and a mounting assembly that incorporates the mounting block
    Patent number: 9521742
    Abstract: A mounting block is provided that has a multi-level upper surface that is used to mount one or more IC chips and the printed circuit board (PCB) thereon at heights that allow the lengths of the bond wires interconnecting the chips with the PCB and/or with the other IC chips to be reduced. The distances between the levels of the multi-level surface are preselected based at least in part on the known height of the PCB and the known height of at least one of the IC chips such that when the chip and the PCB are mounted on the mounting block, the distance between the contact pads of the PCB and the contact pads of the IC chip is very small, thereby allowing the lengths of the bond wires to be kept very short.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: December 13, 2016
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Andrew C. Engel, Michael J. Brosnan, David J. K. Meadowcroft, Klaus D. Giessler, Paul Yu
  • MOUNTING BLOCK AND A MOUNTING ASSEMBLY THAT INCORPORATES THE MOUNTING BLOCK
    Publication number: 20150373834
    Abstract: A mounting block is provided that has a multi-level upper surface that is used to mount one or more IC chips and the printed circuit board (PCB) thereon at heights that allow the lengths of the bond wires interconnecting the chips with the PCB and/or with the other IC chips to be reduced. The distances between the levels of the multi-level surface are preselected based at least in part on the known height of the PCB and the known height of at least one of the IC chips such that when the chip and the PCB are mounted on the mounting block, the distance between the contact pads of the PCB and the contact pads of the IC chip is very small, thereby allowing the lengths of the bond wires to be kept very short.
    Type: Application
    Filed: June 19, 2014
    Publication date: December 24, 2015
    Inventors: Andrew C. Engel, Michael J. Brosnan, David J.K. Meadowcroft, Klaus D. Giessler, Paul Yu