Abstract: A method of forming a curved semiconductor includes: forming a device layer on a semiconductor substrate; forming a metal layer on the device layer; removing the semiconductor substrate from the device layer; and curving the device layer and the metal layer.

Abstract: An isolation system and method are disclosed. The isolation system includes a beam that includes a first end and a second end. The isolation system may include at least one clamping block comprising first elastomeric material, and the first end may be coupled with the first elastomeric material by the at least one clamping block. An end condition of the buckling beam may be varied based on compression stiffening of the first elastomeric material.

Abstract: An isolation system and method are disclosed. The isolation system includes a beam that includes a first end and a second end. The isolation system may include at least one clamping block comprising first elastomeric material, and the first end may be coupled with the first elastomeric material by the at least one clamping block. An end condition of the buckling beam may be varied based on compression stiffening of the first elastomeric material.

Abstract: An isolation system and method are disclosed. The isolation system includes a beam that includes a first end and a second end. The isolation system may include at least one clamping block comprising first elastomeric material, and the first end may be coupled with the first elastomeric material by the at least one clamping block. An end condition of the buckling beam may be varied based on compression stiffening of the first elastomeric material.

Abstract: In at least one embodiment, a rotational spring is provided with adjustable stiffness and includes at least one beam arranged about an axis between an input tuning port and an output port, wherein the input tuning port is configured to change an effective bending length of at least one beam so as to change a shear stiffness with respect to the input tuning port and the output port.

Abstract: A method of manufacturing a hybrid focal-plane array includes: forming a read-out integrated circuit with integral bending slit; forming a detector die separately from the read-out integrated circuit and including a detector with integral bending slit; and joining the read-out integrated circuit and the detector die to each other such that the read-out bending slit and the detector bending slit are aligned with each other.

Abstract: A continuous wave (CW) heterodyne light detection and ranging (LIDAR) air velocity sensor system that comprises a first light emitting structure arranged to send a signal light in a first direction in space; a second light emitting structure arranged to produce a local oscillator light having a wavelength different from the wavelength of the signal light by a predetermined wavelength; a receiver arranged to receive light from said first direction in space; and a first optical mixer for mixing the received light with said local oscillator light.

Abstract: A method of manufacturing a curved semiconductor die includes: designing a semiconductor die design by conducting finite element analysis of an initial semiconductor die design having a partial spherical curvature, the initial semiconductor die design including a shape of a semiconductor die and a location and shape of a slit in the semiconductor die; when a size of a gap at the slit in the curved semiconductor die is outside a tolerance, modifying the initial semiconductor die design to provide a revised semiconductor die design and conducting another finite element analysis thereof; when the size of the gap at the slit in the curved semiconductor die is within the tolerance, manufacturing a microfabrication mask utilizing the initial semiconductor die design or the revised semiconductor die design having the size of the gap within the tolerance; forming a semiconductor die by utilizing the microfabrication mask; and curving the semiconductor die.

Abstract: A method of testing a SMA element includes connecting the SMA element to a validation tool, and applying an electrical current to the SMA element over a test cycle. A resistance of the SMA element during the test cycle is measured, while the electrical current is being applied. The measured resistance of the SMA element during the test cycle is correlated to an estimated strain value of the SMA element during the test cycle. A temperature of the SMA element during the test cycle is estimated. A stress in the SMA element during the test cycle is estimated from a stress predicting grid, using the estimated strain value and the estimated temperature of the SMA element during the test cycle. The proper functionality of the SMA element may be determined based on the estimated stress in the SMA element.

Abstract: In at least one embodiment, a rotational spring is provided with adjustable stiffness and includes at least one beam arranged about an axis between an input tuning port and an output port, wherein the input tuning port is configured to change an effective bending length of at least one beam so as to change a shear stiffness with respect to the input tuning port and the output port.

Abstract: A lighting assembly includes a light source, such as an ultraviolet (UV) light source that is configured to emit UVC light, and a reflector system including a base having an internal central crest that is configured to direct emitted light away from the light source.

Abstract: A lighting assembly includes a light source, such as an ultraviolet (UV) light source that is configured to emit UVC light, and a reflector system including a base having an internal central crest that is configured to direct emitted light away from the light source.

Abstract: A continuous wave (CW) heterodyne light detection and ranging (LIDAR) air velocity sensor system that comprises a first light emitting structure arranged to send a signal light in a first direction in space; a second light emitting structure arranged to produce a local oscillator light having a wavelength different from the wavelength of the signal light by a predetermined wavelength; a receiver arranged to receive light from said first direction in space; and a first optical mixer for mixing the received light with said local oscillator light.

Abstract: A negative stiffness torsional spring. A plurality of spokes secured between a hub and an outer cylinder assembly are preloaded in compression. As the hub is rotated, the stiffness of the torsional spring is negative over a range of angles.

Abstract: A method of testing a SMA element includes connecting the SMA element to a validation tool, and applying an electrical current to the SMA element over a test cycle. A resistance of the SMA element during the test cycle is measured, while the electrical current is being applied. The measured resistance of the SMA element during the test cycle is correlated to an estimated strain value of the SMA element during the test cycle. A temperature of the SMA element during the test cycle is estimated. A stress in the SMA element during the test cycle is estimated from a stress predicting grid, using the estimated strain value and the estimated temperature of the SMA element during the test cycle. The proper functionality of the SMA element may be determined based on the estimated stress in the SMA element.

Abstract: A variable stiffness structure configured to support a variable load, the variable stiffness structure including a shaft coupled to the variable load, a negative stiffness element, a clutch coupled to the negative stiffness element and configured to disengage and to engage the shaft, in response to a change in the variable load, while the structure supports the variable load.

Abstract: A slack compensator includes a stator fixedly attachable to a base and a shuttle. The shuttle is selectably movable from a first position on the stator to a second position on the stator. The shuttle is selectably releasably attached to the stator in the first position. The shuttle is to be permanently captured upon reaching the second position. The slack compensator is attachable to an SMA wire for removing slack that develops in the SMA wire during a plurality of break-in cycles.

Abstract: In at least one embodiment, a rotational spring is provided with adjustable stiffness and includes at least one beam arranged about an axis between an input tuning port and an output port, wherein the input tuning port is configured to change an effective bending length of at least one beam so as to change a shear stiffness with respect to the input tuning port and the output port.

Abstract: In one embodiment, a vibration control apparatus is provided having a pair of face sheets with a core material in between. The core material comprising a positive stiffness material. A stack comprising a positive stiffness structure in series with a negative stiffness structure is located between the pair of face sheets, in parallel with the core material. The stack may be embedded in the core material. Various embodiments may include multiple stacks in parallel with each other. In some embodiments, the stack may include multiple positive stiffness structures in series with multiple negative stiffness structures. The multiple positive stiffness structures and negative stiffness structures may be interleaved.

Abstract: A slack compensator includes a stator fixedly attachable to a base and a shuttle. The shuttle is selectably movable from a first position on the stator to a second position on the stator. The shuttle is selectably releasably attached to the stator in the first position. The shuttle is to be permanently captured upon reaching the second position. The slack compensator is attachable to an SMA wire for removing slack that develops in the SMA wire during a plurality of break-in cycles.