Abstract: Embodiments of the present disclosure describe thermal interface techniques and configurations. In some embodiments, a thermal interface apparatus may include a flexible container, a plurality of thermally conductive objects disposed within the flexible container, and an attachment member coupled to the flexible container for attaching the thermal interface apparatus to a heat sink. The thermally conductive objects may be movable to rearrange their packing within the flexible container in response to deformation of the flexible container. Other embodiments may be described and/or claimed.