Patents by Inventor Andrew Cannon Maccabe

Andrew Cannon Maccabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Aperture feed network with common mode rejection
    Patent number: 10826173
    Abstract: An aperture feed network includes a substrate having a first surface and a parallel second surface, first and second conductive traces on the first surface of the substrate, a third conductive trace on the second surface of the substrate, a conductive via extending through a thickness of the substrate, and one or more ground plane structures on the second surface of the substrate. The substrate comprises a dielectric material. The first and second conductive traces together form a differential signal line. The third conductive trace comprises a first branch and a second branch. The conductive via contacts the first branch of the third conductive trace on the second surface of the substrate and the second conductive trace on the first surface of the substrate. The one or more ground plane structures have irregular shapes.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: November 3, 2020
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventor: Andrew Cannon Maccabe
  • APERTURE FEED NETWORK WITH COMMON MODE REJECTION
    Publication number: 20200235466
    Abstract: An aperture feed network includes a substrate having a first surface and a parallel second surface, first and second conductive traces on the first surface of the substrate, a third conductive trace on the second surface of the substrate, a conductive via extending through a thickness of the substrate, and one or more ground plane structures on the second surface of the substrate. The substrate comprises a dielectric material. The first and second conductive traces together form a differential signal line. The third conductive trace comprises a first branch and a second branch. The conductive via contacts the first branch of the third conductive trace on the second surface of the substrate and the second conductive trace on the first surface of the substrate. The one or more ground plane structures have irregular shapes.
    Type: Application
    Filed: January 18, 2019
    Publication date: July 23, 2020
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventor: Andrew Cannon Maccabe