Patents by Inventor Andrew Carswell
Andrew Carswell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9401285Abstract: Systems and methods for chemical mechanical planarization topography control via implants are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes increasing the content of at least one of silicon or germanium in at least select regions of a dielectric material thereby reducing the material removal rate for a chemical mechanical polishing (CMP) process at the select regions, and removing material from the dielectric material using the CMP process. In another embodiment, a method of manufacturing a semiconductor device includes increasing content of at least one of boron, phosphorus, or hydrogen in at least select regions of a dielectric material thereby increasing the material removal rate of a CMP process at the select regions, and removing material from the dielectric material using the CMP process.Type: GrantFiled: December 16, 2014Date of Patent: July 26, 2016Assignee: Micron Technology, Inc.Inventors: Andrew Carswell, Tony M. Lindenberg, Mark Morley, Kyle Ritter, Lequn Liu
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Publication number: 20160172208Abstract: Systems and methods for chemical mechanical planarization topography control via implants are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes increasing the content of at least one of silicon or germanium in at least select regions of a dielectric material thereby reducing the material removal rate for a chemical mechanical polishing (CMP) process at the select regions, and removing material from the dielectric material using the CMP process. In another embodiment, a method of manufacturing a semiconductor device includes increasing content of at least one of boron, phosphorus, or hydrogen in at least select regions of a dielectric material thereby increasing the material removal rate of a CMP process at the select regions, and removing material from the dielectric material using the CMP process.Type: ApplicationFiled: December 16, 2014Publication date: June 16, 2016Inventors: Andrew Carswell, Tony M. Lindenberg, Mark Morley, Kyle Ritter, Lequn Liu
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Patent number: 8610280Abstract: Some embodiments include constructions which have platinum-containing structures. In some embodiments, the constructions may have a planarized surface extending across the platinum-containing structures and across metal oxide. In some embodiments, the constructions may have a planarized surface extending across the platinum-containing structures, across a first material retaining the platinum-containing structures, and across metal oxide liners along sidewalls of the platinum-containing structures and directly between the platinum-containing structures and the first material. Some embodiments include methods of forming platinum-containing structures. In some embodiments, first material is formed across electrically conductive structures, and metal oxide is formed across the first material. Openings are formed to extend through the metal oxide and the first material to the electrically conductive structures. Platinum-containing material is formed within the openings and over the metal oxide.Type: GrantFiled: September 16, 2011Date of Patent: December 17, 2013Assignee: Micron Technology, Inc.Inventors: Andrey V. Zagrebelny, Chet E. Carter, Andrew Carswell
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Publication number: 20130313718Abstract: A method of processing a substrate having integrated circuitry includes forming through-substrate vias partially through the substrate from a first side of the substrate. At least one through-substrate structure is formed partially through the substrate from the first substrate side. The at least one through-substrate structure extends deeper into the substrate than do the through-substrate vias. Substrate material is removed from a second side of the substrate to expose the through-substrate vias and the at least one through-substrate structure on the second substrate side. Additional implementations are disclosed. Integrated circuit substrates are disclosed independent of method of manufacture.Type: ApplicationFiled: May 24, 2012Publication date: November 28, 2013Applicant: MICRON TECHNOLOGY, INC.Inventors: Sony Varghese, Andrew Carswell, Kozaburo Sakai, Andrey V. Zagrebelny, Wayne Huang, Jin Lu, Suresh Ramakrishnan
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Publication number: 20130069237Abstract: Some embodiments include constructions which have platinum-containing structures. In some embodiments, the constructions may have a planarized surface extending across the platinum-containing structures and across metal oxide. In some embodiments, the constructions may have a planarized surface extending across the platinum-containing structures, across a first material retaining the platinum-containing structures, and across metal oxide liners along sidewalls of the platinum-containing structures and directly between the platinum-containing structures and the first material. Some embodiments include methods of forming platinum-containing structures. In some embodiments, first material is formed across electrically conductive structures, and metal oxide is formed across the first material. Openings are formed to extend through the metal oxide and the first material to the electrically conductive structures. Platinum-containing material is formed within the openings and over the metal oxide.Type: ApplicationFiled: September 16, 2011Publication date: March 21, 2013Applicant: MICRON TECHNOLOGY, INC.Inventors: Andrey V. Zagrebelny, Chet E. Carter, Andrew Carswell
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Patent number: 8105131Abstract: Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface. The subpad in this embodiment further includes a hydro-control agent in the matrix. The hydro-control agent has a hydrophobicity that inhibits liquid from absorbing into the subpad. The hydro-control agent, for example, can be coupling agents that are generally hydrophobic, surfactants that are hydrophobic, or other agents that are compatible with the matrix and at least generally hydrophobic.Type: GrantFiled: November 18, 2009Date of Patent: January 31, 2012Assignee: Micron Technology, Inc.Inventors: Rodney C. Kistler, Andrew Carswell
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Patent number: 7967661Abstract: Planarizing systems and methods of planarizing microelectronic workpieces using mechanical and/or chemical-mechanical planarization are disclosed herein. In one embodiment, a planarizing system includes a platen having a support surface carrying a planarizing pad. The planarizing pad includes an optically transmissive window extending through the planarizing pad that forms a continuous segment of the planarizing pad. The system also includes a workpiece carrier configured to move the workpiece relative to the planarizing pad and an optical monitor positioned proximate to the platen. The optical monitor emits light through the window and detects reflected light from the workpiece through the window.Type: GrantFiled: June 19, 2008Date of Patent: June 28, 2011Assignee: Micron Technology, Inc.Inventors: Theodore M. Taylor, Andrew Carswell
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Publication number: 20100059705Abstract: Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface. The subpad in this embodiment further includes a hydro-control agent in the matrix. The hydro-control agent has a hydrophobicity that inhibits liquid from absorbing into the subpad. The hydro-control agent, for example, can be coupling agents that are generally hydrophobic, surfactants that are hydrophobic, or other agents that are compatible with the matrix and at least generally hydrophobic.Type: ApplicationFiled: November 18, 2009Publication date: March 11, 2010Applicant: MICRON TECHNOLOGY, INC.Inventors: Rodney C. Kistler, Andrew Carswell
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Publication number: 20090318061Abstract: Planarizing systems and methods of planarizing microelectronic workpieces using mechanical and/or chemical-mechanical planarization are disclosed herein. In one embodiment, a planarizing system includes a platen having a support surface carrying a planarizing pad. The planarizing pad includes an optically transmissive window extending through the planarizing pad that forms a continuous segment of the planarizing pad. The system also includes a workpiece carrier configured to move the workpiece relative to the planarizing pad and an optical monitor positioned proximate to the platen. The optical monitor emits light through the window and detects reflected light from the workpiece through the window.Type: ApplicationFiled: June 19, 2008Publication date: December 24, 2009Applicant: MICRON TECHNOLOGY, INC.Inventors: Theodore M. Taylor, Andrew Carswell
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Patent number: 7628680Abstract: Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface. The subpad in this embodiment further includes a hydro-control agent in the matrix. The hydro-control agent has a hydrophobicity that inhibits liquid from absorbing into the subpad. The hydro-control agent, for example, can be coupling agents that are generally hydrophobic, surfactants that are hydrophobic, or other agents that are compatible with the matrix and at least generally hydrophobic.Type: GrantFiled: November 9, 2007Date of Patent: December 8, 2009Assignee: Micron Technology, Inc.Inventors: Rodney C. Kistler, Andrew Carswell
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Patent number: 7452816Abstract: This invention includes a chemical mechanical polishing method including providing a substrate having an organic material to be polished by chemical mechanical polishing. In one implementation, the organic material is chemical mechanically polished using a polishing pad downforce on the substrate of less than or equal to 1.75 psi, using an aqueous slurry comprising abrasive particles comprising an individual particle size of less than or equal to 100 nanometers and at a particle concentration of less than or equal to 20% by weight, and at least one of an acid or a surfactant effective to achieve a removal rate of the organic material of at least 500 Angstroms per minute. Other aspects and implementations are contemplated.Type: GrantFiled: July 26, 2006Date of Patent: November 18, 2008Assignee: Micron Technology, Inc.Inventors: Zhenyu Lu, Naga Chandrasekaran, Andrew Carswell
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Publication number: 20080064306Abstract: Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface. The subpad in this embodiment further includes a hydro-control agent in the matrix. The hydro-control agent has a hydrophobicity that inhibits liquid from absorbing into the subpad. The hydro-control agent, for example, can be coupling agents that are generally hydrophobic, surfactants that are hydrophobic, or other agents that are compatible with the matrix and at least generally hydrophobic.Type: ApplicationFiled: November 9, 2007Publication date: March 13, 2008Applicant: Micron Technology, Inc.Inventors: Rodney Kistler, Andrew Carswell
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Publication number: 20080026525Abstract: This invention includes a chemical mechanical polishing method including providing a substrate having an organic material to be polished by chemical mechanical polishing. In one implementation, the organic material is chemical mechanically polished using a polishing pad downforce on the substrate of less than or equal to 1.75 psi, using an aqueous slurry comprising abrasive particles comprising an individual particle size of less than or equal to 100 nanometers and at a particle concentration of less than or equal to 20% by weight, and at least one of an acid or a surfactant effective to achieve a removal rate of the organic material of at least 500 Angstroms per minute. Other aspects and implementations are contemplated.Type: ApplicationFiled: July 26, 2006Publication date: January 31, 2008Inventors: Zhenyu Lu, Naga Chandrasekaran, Andrew Carswell
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Patent number: 7294049Abstract: Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface. The subpad in this embodiment further includes a hydro-control agent in the matrix. The hydro-control agent has a hydrophobicity that inhibits liquid from absorbing into the subpad. The hydro-control agent, for example, can be coupling agents that are generally hydrophobic, surfactants that are hydrophobic, or other agents that are compatible with the matrix and at least generally hydrophobic.Type: GrantFiled: September 1, 2005Date of Patent: November 13, 2007Assignee: Micron Technology, Inc.Inventors: Rodney C. Kistler, Andrew Carswell
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Publication number: 20070049177Abstract: Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface. The subpad in this embodiment further includes a hydro-control agent in the matrix. The hydro-control agent has a hydrophobicity that inhibits liquid from absorbing into the subpad. The hydro-control agent, for example, can be coupling agents that are generally hydrophobic, surfactants that are hydrophobic, or other agents that are compatible with the matrix and at least generally hydrophobic.Type: ApplicationFiled: September 1, 2005Publication date: March 1, 2007Applicant: Micron Technology, Inc.Inventors: Rodney Kistler, Andrew Carswell