Patents by Inventor Andrew Chong

Andrew Chong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11912233
    Abstract: A door interface system for a vehicle door includes a sensor and a visual indicator. The sensor may be a proximity sensor and may be positioned proximate to the visual indicator such that it will detect an object proximate to the proximity sensor. The visual indicator may convey the position of the sensor and/or a status of the vehicle door. The door interface system is configured to control the vehicle door based at least in part on detecting an object proximate the visual indicator.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: February 27, 2024
    Assignee: ZOOX, INC.
    Inventors: Auver Cedric Austria, Amy Chong, Andrew Allen Haskin, Kevin Mark Karol, Michael Moshe Kohen, Ishan Sain, Jingyi Zhang
  • Publication number: 20180265511
    Abstract: Compounds and compositions for treating injuries caused by exposure to chemical warfare agents are described herein.
    Type: Application
    Filed: March 15, 2018
    Publication date: September 20, 2018
    Inventor: Jayhong Andrew Chong
  • Publication number: 20100052183
    Abstract: Microfeature workpiece substrates having through-substrate vias, and associated methods of formation are disclosed. A method in accordance with one embodiment for forming a support substrate for carrying microfeature dies includes exposing a support substrate to an electrolyte, with the support substrate having a first side with a first conductive layer, a second side opposite the first side with a second conductive layer, and a conductive path extending through the support substrate from the first conductive layer to the second conductive layer. The method can further include forming a bond pad at a bond site of the first conductive layer by disposing at least one conductive bond pad material at the bond site, wherein disposing the at least one conductive bond pad material can include passing an electrical current between the first and second conductive layers via the conductive path, while the substrate is exposed to the electrolyte.
    Type: Application
    Filed: November 10, 2009
    Publication date: March 4, 2010
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Teck Kheng Lee, Andrew Chong Pei Lim
  • Patent number: 7622377
    Abstract: Microfeature workpiece substrates having through-substrate vias, and associated methods of formation are disclosed. A method in accordance with one embodiment for forming a support substrate for carrying microfeature dies includes exposing a support substrate to an electrolyte, with the support substrate having a first side with a first conductive layer, a second side opposite the first side with a second conductive layer, and a conductive path extending through the support substrate from the first conductive layer to the second conductive layer. The method can further include forming a bond pad at a bond site of the first conductive layer by disposing at least one conductive bond pad material at the bond site, wherein disposing the at least one conductive bond pad material can include passing an electrical current between the first and second conductive layers via the conductive path, while the substrate is exposed to the electrolyte.
    Type: Grant
    Filed: September 1, 2005
    Date of Patent: November 24, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Teck Kheng Lee, Andrew Chong Pei Lim
  • Patent number: 4981132
    Abstract: A molded plastic orthosis for treating tibial torsion in children without twisting the femur or hip, and which is adjustable to accommodate the growth of the child's leg. The orthosis is made of two braces, a first brace which embraces the tibia and the foot, and a second brace embracing the upper end of the tibia and the femur with the knee in flexed position. The tibial portion of the second brace overlaps the tibia portion of the first brace, and the overlapping portions are surfaced with Velcro fasteners for adjustably locking the two braces against rotation.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: January 1, 1991
    Inventor: Andrew Chong
  • Patent number: 4922895
    Abstract: A brace made of rigid thermoplastic material that retains the corrective features of a corrective cast without the disadvantages of a cast. The brace securely encloses the heel and the medial portion of the foot up to or slightly beyond the tip of the big toe on the medial side only. A strap, adjustably secured to the brace, directs a corrective force on the apex of the deformity on the lateral aspect of the foot, thus effecting correction. The brace has a leg-embracing component which includes a strap for preventing the heel from pulling away from the brace.
    Type: Grant
    Filed: December 3, 1984
    Date of Patent: May 8, 1990
    Inventor: Andrew Chong