Abstract: An extruder system for rapid change between different melt strength polymers is provided. The extruder system includes at least three polymer extruders; a flow spool; and a multilayer feedblock including a first combining zone, a second combining zone, and at least one cartridge insert arrangement in each of the first combining zone and the second combining zone; where each cartridge insert arrangement is configured to receive a cartridge insert, the cartridge insert directing flow of a polymer from one of the polymer extruders. Also provided are method of forming an encapsulated coating with the extruder system and an encapsulate coating formed with the extruder system.

Abstract: The present invention provides phased array antenna apparatus (200) for operation in frequencies above six gigahertz.

Abstract: The present invention provides phased array antenna apparatus (200) for operation in frequencies above six gigahertz.

Abstract: An extruder system for rapid change between different melt strength polymers is provided. The extruder system includes at least three polymer extruders; a flow spool; and a multilayer feedblock including a first combining zone, a second combining zone, and at least one cartridge insert arrangement in each of the first combining zone and the second combining zone; where each cartridge insert arrangement is configured to receive a cartridge insert, the cartridge insert directing flow of a polymer from one of the polymer extruders. Also provided are method of forming an encapsulated coating with the extruder system and an encapsulate coating formed with the extruder system.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped or the like, and singulated. The singulated dies, which may be of different sizes and functionality, are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Sets of dies of different functionality may be tested as a system or subsystem. Once test probing is complete, the dies (or sets of dies) and tile are singulated into die/tile assemblies.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped or the like, and singulated. The singulated dies, which may be of different sizes and functionality, are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Sets of dies of different functionality may be tested as a system or subsystem. Once test probing is complete, the dies (or sets of dies) and tile are singulated into die/tile assemblies.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped or the like, and singulated. The singulated dies, which may be of different sizes and functionality, are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Sets of dies of different functionality may be tested as a system or subsystem. Once test probing is complete, the dies (or sets of dies) and tile are singulated into die/tile assemblies.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped or the like, and singulated. The singulated dies, which may be of different sizes and functionality, are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Sets of dies of different functionality may be tested as a system or subsystem. Once test probing is complete, the dies (or sets of dies) and tile are singulated into die/tile assemblies.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped, and singulated. The singulated dies are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Once test probing is complete, the dies and tile are singulated into die/tile assemblies.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped, and singulated. The singulated dies are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Once test probing is complete, the dies and tile are singulated into die/tile assemblies.

Abstract: In one example an apparatus is provided. The apparatus includes a housing for coupling a satellite dish, an elevation adjustment bolt to perform an elevation adjustment on the satellite dish, an azimuth adjustment bolt to perform an azimuth adjustment on the satellite dish, a plate for coupling one or more U-bolts coupled to the housing, the plate comprising a curved portion that sits flush along a perimeter of a pole and a movable tab member coupled to the plate to allow for a plurality of different pole mounting configurations.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped, and singulated. The singulated dies are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Once test probing is complete, the dies and tile are singulated into die/tile assemblies.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped, and singulated. The singulated dies are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Once test probing is complete, the dies and tile are singulated into die/tile assemblies.

Abstract: In one example an apparatus is provided. The apparatus includes a housing for coupling a satellite dish, an elevation adjustment bolt to perform an elevation adjustment on the satellite dish, an azimuth adjustment bolt to perform an azimuth adjustment on the satellite dish, a plate for coupling one or more U-bolts coupled to the housing, the plate comprising a curved portion that sits flush along a perimeter of a pole and a movable tab member coupled to the plate to allow for a plurality of different pole mounting configurations.

Abstract: A mount for mounting a reflector of a satellite dish is provided. In one embodiment, the mount includes one or more first hooks and one or more second hooks located offset from the one or more first hooks, wherein the one or more second hooks are spring loaded and the one or more first hooks and the one or more second hooks fasten the reflector of the satellite dish to the mount.

Abstract: The present disclosure relates generally to an anti-backlash component. In one embodiment, the anti-backlash component includes a housing, the housing comprising a first threaded opening and a second opening, a bolt coupled to the housing through the first threaded opening and the second opening, the bolt comprising a spherical end, a nut coupled to the bolt and an exterior side of the second opening of the housing and a socket coupled to the spherical end of the bolt.

Abstract: Penetrating the skin of a poultry item with an array of small holes accomplished by using a plurality of circular blades laterally spaced apart and substantially parallel and having a plurality teeth protruding from the edge of the blades and forcibly engaging and penetrating the skin of the poultry item with the plurality of teeth. The plurality of circular blades can have a common axis of rotation and rotating about a shaft extending along the common axis thereby forming a roller of blades.

Abstract: Penetrating the skin of a poultry item with an array of small holes accomplished by using a plurality of circular blades laterally spaced apart and substantially parallel and having a plurality teeth protruding from the edge of the blades and forcibly engaging and penetrating the skin of the poultry item with the plurality of teeth. The plurality of circular blades can have a common axis of rotation and rotating about a shaft extending along the common axis thereby forming a roller of blades.

Abstract: Penetrating the skin of a poultry item with an array of small holes accomplished by using a plurality of circular blades laterally spaced apart and substantially parallel and having a plurality teeth protruding from the edge of the blades and forcibly engaging and penetrating the skin of the poultry item with the plurality of teeth. The plurality of circular blades can have a common axis of rotation and rotating about a shaft extending along the common axis thereby forming a roller of blades.

Abstract: A mount for mounting a reflector of a satellite dish is provided. In one embodiment, the mount includes one or more first hooks and one or more second hooks located offset from the one or more first hooks, wherein the one or more second hooks are spring loaded and the one or more first hooks and the one or more second hooks fasten the reflector of the satellite dish to the mount.