Patents by Inventor Andrew Collins
Andrew Collins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12388019Abstract: Various embodiments relate to a semiconductor package. The semiconductor package includes a first die. The first die includes a first bridge interconnect region. The semiconductor package further includes a second die. The second die includes a second bridge interconnect region. The semiconductor package includes a bridge die. The bridge die includes a first contact area to connect to the first bridge interconnect region and a second contact area to connect to the second bridge interconnect region. In the semiconductor package, the first bridge interconnect region is larger than the second bridge interconnect region. Additionally, each of the first bridge interconnect region and the second bridge interconnect region include a plurality of conductive bumps. An average pitch between adjacent bumps of the first bridge interconnect region is larger than an average pitch between adjacent bumps of the second bridge interconnect region.Type: GrantFiled: June 21, 2024Date of Patent: August 12, 2025Assignee: Intel CorporationInventors: Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath
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Publication number: 20250094452Abstract: A central database system trains and applies machine-learned models based on characteristics of one or more entities associated with the central database system. For instance, the central database system trains a machine-learned model configured to identify issues a target entity is likely to encounter based on training data identifying characteristics of historical entities and issues faced by the historical entities. Likewise, the central database system trains machine-learned models configured to predict actions that entities are likely to take in the future, and resources required to take those actions. The central database system can then perform one or more proactive actions or make one or more recommendations based on the predicted issues, the predicted future actions, and the predicted required resources.Type: ApplicationFiled: September 15, 2023Publication date: March 20, 2025Inventors: Christian Franklin Hillson, Jacques Robert Caspi, Andrew Collins Bessey, Lilly Anne Pieper, Ryan David Kappedal, Jasmine Walker Motupalli, Addison Woodford Bohannon, Rebecca Alice Carter
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Publication number: 20250094899Abstract: A central database system trains and applies machine-learned models based on characteristics of one or more entities associated with the central database system. For instance, the central database system trains a machine-learned model configured to identify issues a target entity is likely to encounter based on training data identifying characteristics of historical entities and issues faced by the historical entities. Likewise, the central database system trains machine-learned models configured to predict actions that entities are likely to take in the future, and resources required to take those actions. The central database system can then perform one or more proactive actions or make one or more recommendations based on the predicted issues, the predicted future actions, and the predicted required resources.Type: ApplicationFiled: September 15, 2023Publication date: March 20, 2025Inventors: Christian Franklin Hillson, Jacques Robert Caspi, Andrew Collins Bessey, Lilly Anne Pieper, Ryan David Kappedal, Jasmine Walker Motupalli, Addison Woodford Bohannon, Rebecca Alice Carter
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Publication number: 20250094859Abstract: A central database system trains and applies machine-learned models based on characteristics of one or more entities associated with the central database system. For instance, the central database system trains a machine-learned model configured to identify issues a target entity is likely to encounter based on training data identifying characteristics of historical entities and issues faced by the historical entities. Likewise, the central database system trains machine-learned models configured to predict actions that entities are likely to take in the future, and resources required to take those actions. The central database system can then perform one or more proactive actions or make one or more recommendations based on the predicted issues, the predicted future actions, and the predicted required resources.Type: ApplicationFiled: September 15, 2023Publication date: March 20, 2025Inventors: Christian Franklin Hillson, Jacques Robert Caspi, Andrew Collins Bessey, Lilly Anne Pieper, Ryan David Kappedal, Jasmine Walker Motupalli, Addison Woodford Bohannon, Rebecca Alice Carter
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Patent number: 12205924Abstract: Apparatuses, devices and systems associated with semiconductor packages with chiplet and memory device coupling are disclosed herein. In embodiments, a semiconductor package may include a first chiplet, a second chiplet, and a memory device. The semiconductor package may further include an interconnect structure that couples the first chiplet to a first memory channel of the memory device and the second chiplet to a second memory channel of the memory device. Other embodiments may be described and/or claimed.Type: GrantFiled: February 21, 2023Date of Patent: January 21, 2025Assignee: Intel CorporationInventors: Andrew Collins, Jianyong Xie
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Publication number: 20240409035Abstract: A support device for facilitating the loading of a container on a vehicle. the support device comprising a front arm and a rear arm, comprising corresponding front and rear support surfaces for the container, the front and rear arms being pivotally connected to one another about a first axis, and pivotally moveable relative to one another between a stowed configuration and a deployed configuration, wherein pivotal movement of the front and rear arms relative to one another is achieved by way of an actuator acting on intermediate portions of both the front and rear arms, where from a stowed configuration, extension of the actuator moves the front and rear arms toward their deployed configuration, and where from the deployed configuration, retraction of the actuator moves the front and rear arms toward their stowed configuration. the support device further comprising a latching arrangement for securing the front and rear arms in their deployed configuration.Type: ApplicationFiled: September 21, 2022Publication date: December 12, 2024Inventor: Andrew Collins
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Patent number: 12069206Abstract: One example method of operation may include identifying a call from a caller and destined for a callee, receiving a data message associated with the call, forwarding the data message to a call processing server, processing the data message to identify one or more call parameters, comparing the one or more call parameters to an active call scam model applied by the call processing server, determining a scam score for the call based on the comparing of the one or more call parameters to the active call scam model applied by the call processing server, and determining whether to notify the callee that the call is a scam based on the scam score.Type: GrantFiled: June 21, 2023Date of Patent: August 20, 2024Assignee: FIRST ORION CORP.Inventors: Mark Hamilton Botner, Collin Michael Turney, Daniel Francis Kliebhan, Robert Francis Piscopo, Jr., Charles Donald Morgan, Jamelle Adnan Brown, Chee-Fung Choy, Samuel Kenton Welch, Nysia Inet George, Andrew Collin Shaddox
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Publication number: 20240256991Abstract: A method for quoting and booking aircraft services via text messaging includes receiving an initial message from a mobile device; authenticating the user based on the mobile device, the authentication resulting in identification of a user record corresponding to the user; receiving a plurality of booking messages; extracting booking data selected from the group consisting of departure airport information, arrival airport information, departure date information, departure time information, passenger count information, and combinations thereof; generating one or more quotes; transmitting a quote message including the one or more quotes; receiving a quote choice message corresponding to a selected one of the one or more quotes; booking aircraft services corresponding to the booking data and the selected one of the one or more quotes, the booking resulting in a booking record having a booking record identifier; transmitting the booking record identifier.Type: ApplicationFiled: February 1, 2023Publication date: August 1, 2024Inventors: Michael Campobasso, Durga Prasad Nagalla, Andrew Collins
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Patent number: 12051647Abstract: Various embodiments relate to a semiconductor package. The semiconductor package includes a first die. The first die includes a first bridge interconnect region. The semiconductor package further includes a second die. The second die includes a second bridge interconnect region. The semiconductor package includes a bridge die. The bridge die includes a first contact area to connect to the first bridge interconnect region and a second contact area to connect to the second bridge interconnect region. In the semiconductor package, the first bridge interconnect region is larger than the second bridge interconnect region. Additionally, each of the first bridge interconnect region and the second bridge interconnect region include a plurality of conductive bumps. An average pitch between adjacent bumps of the first bridge interconnect region is larger than an average pitch between adjacent bumps of the second bridge interconnect region.Type: GrantFiled: May 19, 2023Date of Patent: July 30, 2024Assignee: Intel CorporationInventors: Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath
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Patent number: 12046568Abstract: A package substrate is disclosed. The package substrate includes a die package in the package substrate located at least partially underneath a location of a power delivery interface in a die that is coupled to the surface of the package substrate. Connection terminals are accessible on a surface of the die package to provide connection to the die that is coupled to the surface of the package substrate. Metal-insulator-metal layers inside the die package are coupled to the connection terminals.Type: GrantFiled: June 27, 2023Date of Patent: July 23, 2024Assignee: Intel CorporationInventors: Andrew Collins, Sujit Sharan, Jianyong Xie
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Publication number: 20240195949Abstract: Devices, systems, and methods are provided for receiving, by a first device, a first video feed from a first camera at a first televised event the first video feed comprising synthesized content preceding the first televised event, the synthesized content comprising a virtual representation of an object or being; detecting a first delay time between audio and video of the synthesized content in the first video feed; generating, based on the first delay time, video content comprising a first portion of the first video feed; and sending the video content to a second device for presentation of the televised event.Type: ApplicationFiled: December 12, 2022Publication date: June 13, 2024Applicant: Amazon Technologies, Inc.Inventors: Andrew Collins, Alexander Charles Mackin, Benoit Quentin Arthur Vallade, David William Higham, Erdem Durgut
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Publication number: 20240114622Abstract: An electronic device includes a substrate including a core layer; a cavity formed in the core layer, wherein the cavity includes sidewalls plated with a conductive material; a prefabricated passive electronic component disposed in the cavity; and a cavity sidewall connection providing electrical continuity from the plated cavity sidewalls to a first surface of the substrate and to a second surface of the substrate.Type: ApplicationFiled: September 29, 2022Publication date: April 4, 2024Inventors: Kristof Darmawikarta, Srinivas Venkata Ramanuja Pietambaram, Tarek A. Ibrahim, Cary Kuliasha, Siddharth K. Alur, Jung Kyu Han, Beomseok Choi, Russell K. Mortensen, Andrew Collins, Haobo Chen, Brandon C. Marin
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Publication number: 20240060350Abstract: A material-actuated door includes a door housing including a flexible material; and one or more least one Shape Memory Alloy (SMA) actuators embedded in the door housing. Each SMA actuator is elastically biased in a first actuator physical state and is configured to transition into a second actuator physical state in response to receiving electrical current. The material-actuated door is transitioned into a first door position in response to disconnecting the electrical current to the at least one SMA actuator, and is transitioned into a second door position in response to delivering the electrical current to the at least one SMA actuator.Type: ApplicationFiled: December 15, 2022Publication date: February 22, 2024Inventors: Robert Andrew Collins, Joseph William Post, Timothy M. Quinn, James Joseph Stusse, William B. Coney
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Patent number: 11889021Abstract: One example method of operation may include collecting call metric data over a predefined period of time for identified calls, querying the call metric data to identify whether one or more call filtering criteria parameters require changes, determining one or more call filtering criteria parameters require changes based on a deviation from one or more expected call metric data values included in the call metric data, modifying one or more of the call filtering criteria parameters, and updating an active call scam model stored on a call processing server based on the one or more call filtering parameters.Type: GrantFiled: March 13, 2023Date of Patent: January 30, 2024Assignee: FIRST ORION CORP.Inventors: Mark Hamilton Botner, Collin Michael Turney, Daniel Francis Kliebhan, Robert Francis Piscopo, Jr., Charles Donald Morgan, Jamelle Adnan Brown, Chee-Fung Choy, Samuel Kenton Welch, Nysia Inet George, Andrew Collin Shaddox
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Publication number: 20230392006Abstract: A boron-free slime-like composition can include polyethylene oxide, cellulose, a filler, and water.Type: ApplicationFiled: October 26, 2021Publication date: December 7, 2023Inventors: Shamshad F. Noor, Andrew Collins
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Patent number: 11761461Abstract: A rotary servo valve comprising a housing portion (105) defining a cylindrical cavity (107) and a first layer of ports. The rotary servo valve further comprises two opposing indented sides and two opposing sides having an increased radius relative to the indented sides, each side of increased radius extending between the two indented sides. The spool portion (103) is mounted for rotation relative to the cylindrical cavity (107), from a neutral position so as to prevent fluid flow through the valve, to an open position in which a fluid flow path is provided.Type: GrantFiled: February 5, 2020Date of Patent: September 19, 2023Assignee: DOMIN FLUID POWER LIMITEDInventors: Andrew Collins, Martin MacDonald
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Patent number: 11728294Abstract: A package substrate is disclosed. The package substrate includes a die package in the package substrate located at least partially underneath a location of a power delivery interface in a die that is coupled to the surface of the package substrate. Connection terminals are accessible on a surface of the die package to provide connection to the die that is coupled to the surface of the package substrate. Metal-insulator-metal layers inside the die package are coupled to the connection terminals.Type: GrantFiled: November 3, 2021Date of Patent: August 15, 2023Assignee: Intel CorporationInventors: Andrew Collins, Sujit Sharan, Jianyong Xie
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Patent number: 11729314Abstract: One example method of operation may include identifying a call from a caller and destined for a callee, receiving a data message associated with the call, forwarding the data message to a call processing server, processing the data message to identify one or more call parameters, comparing the one or more call parameters to an active call scam model applied by the call processing server, determining a scam score for the call based on the comparing of the one or more call parameters to the active call scam model applied by the call processing server, and determining whether to notify the callee that the call is a scam based on the scam score.Type: GrantFiled: March 29, 2022Date of Patent: August 15, 2023Assignee: FIRST ORION CORP.Inventors: Mark Hamilton Botner, Collin Michael Turney, Daniel Francis Kliebhan, Robert Francis Piscopo, Jr., Charles Donald Morgan, Jamelle Adnan Brown, Chee-Fung Choy, Samuel Kenton Welch, Nysia Inet George, Andrew Collin Shaddox
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Publication number: 20230230181Abstract: Embodiments described herein are related to systems and methods for offering an upgrade for a transportation service. In one aspect, a computer can receive a reservation request for a transportation service including an itinerary indicating a first location, a second location, and a first service category of the transportation service. The computer can determine a plurality of reposition estimates for a plurality of service categories including the first service category and one or more potential service categories, each reposition estimate being determined based upon the first location, the second location, and a particular service category. The computer can identify, as a second service category, the potential service category having the reposition estimate lower than the reposition estimate of the first service category in the reservation request. The computer can transmit to the client device an upgrade notification indicating an eligibility to update the itinerary to include the second service category.Type: ApplicationFiled: January 17, 2023Publication date: July 20, 2023Applicant: OneSky Flight LLCInventors: Andrew Collins, Adam Hohulin, Michael Campobasso, Durga Ngalla, William Lanphear, David Syphers, Oleksandr Hendrik
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Patent number: 11705398Abstract: Various embodiments relate to a semiconductor package. The semiconductor package includes a first die. The first die includes a first bridge interconnect region. The semiconductor package further includes a second die. The second die includes a second bridge interconnect region. The semiconductor package includes a bridge die. The bridge die includes a first contact area to connect to the first bridge interconnect region and a second contact area to connect to the second bridge interconnect region. In the semiconductor package, the first bridge interconnect region is larger than the second bridge interconnect region. Additionally, each of the first bridge interconnect region and the second bridge interconnect region include a plurality of conductive bumps. An average pitch between adjacent bumps of the first bridge interconnect region is larger than an average pitch between adjacent bumps of the second bridge interconnect region.Type: GrantFiled: January 26, 2022Date of Patent: July 18, 2023Assignee: Intel CorporationInventors: Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath