Patents by Inventor Andrew Collins

Andrew Collins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12388019
    Abstract: Various embodiments relate to a semiconductor package. The semiconductor package includes a first die. The first die includes a first bridge interconnect region. The semiconductor package further includes a second die. The second die includes a second bridge interconnect region. The semiconductor package includes a bridge die. The bridge die includes a first contact area to connect to the first bridge interconnect region and a second contact area to connect to the second bridge interconnect region. In the semiconductor package, the first bridge interconnect region is larger than the second bridge interconnect region. Additionally, each of the first bridge interconnect region and the second bridge interconnect region include a plurality of conductive bumps. An average pitch between adjacent bumps of the first bridge interconnect region is larger than an average pitch between adjacent bumps of the second bridge interconnect region.
    Type: Grant
    Filed: June 21, 2024
    Date of Patent: August 12, 2025
    Assignee: Intel Corporation
    Inventors: Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath
  • Publication number: 20250094452
    Abstract: A central database system trains and applies machine-learned models based on characteristics of one or more entities associated with the central database system. For instance, the central database system trains a machine-learned model configured to identify issues a target entity is likely to encounter based on training data identifying characteristics of historical entities and issues faced by the historical entities. Likewise, the central database system trains machine-learned models configured to predict actions that entities are likely to take in the future, and resources required to take those actions. The central database system can then perform one or more proactive actions or make one or more recommendations based on the predicted issues, the predicted future actions, and the predicted required resources.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 20, 2025
    Inventors: Christian Franklin Hillson, Jacques Robert Caspi, Andrew Collins Bessey, Lilly Anne Pieper, Ryan David Kappedal, Jasmine Walker Motupalli, Addison Woodford Bohannon, Rebecca Alice Carter
  • Publication number: 20250094899
    Abstract: A central database system trains and applies machine-learned models based on characteristics of one or more entities associated with the central database system. For instance, the central database system trains a machine-learned model configured to identify issues a target entity is likely to encounter based on training data identifying characteristics of historical entities and issues faced by the historical entities. Likewise, the central database system trains machine-learned models configured to predict actions that entities are likely to take in the future, and resources required to take those actions. The central database system can then perform one or more proactive actions or make one or more recommendations based on the predicted issues, the predicted future actions, and the predicted required resources.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 20, 2025
    Inventors: Christian Franklin Hillson, Jacques Robert Caspi, Andrew Collins Bessey, Lilly Anne Pieper, Ryan David Kappedal, Jasmine Walker Motupalli, Addison Woodford Bohannon, Rebecca Alice Carter
  • Publication number: 20250094859
    Abstract: A central database system trains and applies machine-learned models based on characteristics of one or more entities associated with the central database system. For instance, the central database system trains a machine-learned model configured to identify issues a target entity is likely to encounter based on training data identifying characteristics of historical entities and issues faced by the historical entities. Likewise, the central database system trains machine-learned models configured to predict actions that entities are likely to take in the future, and resources required to take those actions. The central database system can then perform one or more proactive actions or make one or more recommendations based on the predicted issues, the predicted future actions, and the predicted required resources.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 20, 2025
    Inventors: Christian Franklin Hillson, Jacques Robert Caspi, Andrew Collins Bessey, Lilly Anne Pieper, Ryan David Kappedal, Jasmine Walker Motupalli, Addison Woodford Bohannon, Rebecca Alice Carter
  • Patent number: 12205924
    Abstract: Apparatuses, devices and systems associated with semiconductor packages with chiplet and memory device coupling are disclosed herein. In embodiments, a semiconductor package may include a first chiplet, a second chiplet, and a memory device. The semiconductor package may further include an interconnect structure that couples the first chiplet to a first memory channel of the memory device and the second chiplet to a second memory channel of the memory device. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: February 21, 2023
    Date of Patent: January 21, 2025
    Assignee: Intel Corporation
    Inventors: Andrew Collins, Jianyong Xie
  • Publication number: 20240409035
    Abstract: A support device for facilitating the loading of a container on a vehicle. the support device comprising a front arm and a rear arm, comprising corresponding front and rear support surfaces for the container, the front and rear arms being pivotally connected to one another about a first axis, and pivotally moveable relative to one another between a stowed configuration and a deployed configuration, wherein pivotal movement of the front and rear arms relative to one another is achieved by way of an actuator acting on intermediate portions of both the front and rear arms, where from a stowed configuration, extension of the actuator moves the front and rear arms toward their deployed configuration, and where from the deployed configuration, retraction of the actuator moves the front and rear arms toward their stowed configuration. the support device further comprising a latching arrangement for securing the front and rear arms in their deployed configuration.
    Type: Application
    Filed: September 21, 2022
    Publication date: December 12, 2024
    Inventor: Andrew Collins
  • Patent number: 12069206
    Abstract: One example method of operation may include identifying a call from a caller and destined for a callee, receiving a data message associated with the call, forwarding the data message to a call processing server, processing the data message to identify one or more call parameters, comparing the one or more call parameters to an active call scam model applied by the call processing server, determining a scam score for the call based on the comparing of the one or more call parameters to the active call scam model applied by the call processing server, and determining whether to notify the callee that the call is a scam based on the scam score.
    Type: Grant
    Filed: June 21, 2023
    Date of Patent: August 20, 2024
    Assignee: FIRST ORION CORP.
    Inventors: Mark Hamilton Botner, Collin Michael Turney, Daniel Francis Kliebhan, Robert Francis Piscopo, Jr., Charles Donald Morgan, Jamelle Adnan Brown, Chee-Fung Choy, Samuel Kenton Welch, Nysia Inet George, Andrew Collin Shaddox
  • Publication number: 20240256991
    Abstract: A method for quoting and booking aircraft services via text messaging includes receiving an initial message from a mobile device; authenticating the user based on the mobile device, the authentication resulting in identification of a user record corresponding to the user; receiving a plurality of booking messages; extracting booking data selected from the group consisting of departure airport information, arrival airport information, departure date information, departure time information, passenger count information, and combinations thereof; generating one or more quotes; transmitting a quote message including the one or more quotes; receiving a quote choice message corresponding to a selected one of the one or more quotes; booking aircraft services corresponding to the booking data and the selected one of the one or more quotes, the booking resulting in a booking record having a booking record identifier; transmitting the booking record identifier.
    Type: Application
    Filed: February 1, 2023
    Publication date: August 1, 2024
    Inventors: Michael Campobasso, Durga Prasad Nagalla, Andrew Collins
  • Patent number: 12051647
    Abstract: Various embodiments relate to a semiconductor package. The semiconductor package includes a first die. The first die includes a first bridge interconnect region. The semiconductor package further includes a second die. The second die includes a second bridge interconnect region. The semiconductor package includes a bridge die. The bridge die includes a first contact area to connect to the first bridge interconnect region and a second contact area to connect to the second bridge interconnect region. In the semiconductor package, the first bridge interconnect region is larger than the second bridge interconnect region. Additionally, each of the first bridge interconnect region and the second bridge interconnect region include a plurality of conductive bumps. An average pitch between adjacent bumps of the first bridge interconnect region is larger than an average pitch between adjacent bumps of the second bridge interconnect region.
    Type: Grant
    Filed: May 19, 2023
    Date of Patent: July 30, 2024
    Assignee: Intel Corporation
    Inventors: Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath
  • Patent number: 12046568
    Abstract: A package substrate is disclosed. The package substrate includes a die package in the package substrate located at least partially underneath a location of a power delivery interface in a die that is coupled to the surface of the package substrate. Connection terminals are accessible on a surface of the die package to provide connection to the die that is coupled to the surface of the package substrate. Metal-insulator-metal layers inside the die package are coupled to the connection terminals.
    Type: Grant
    Filed: June 27, 2023
    Date of Patent: July 23, 2024
    Assignee: Intel Corporation
    Inventors: Andrew Collins, Sujit Sharan, Jianyong Xie
  • Publication number: 20240195949
    Abstract: Devices, systems, and methods are provided for receiving, by a first device, a first video feed from a first camera at a first televised event the first video feed comprising synthesized content preceding the first televised event, the synthesized content comprising a virtual representation of an object or being; detecting a first delay time between audio and video of the synthesized content in the first video feed; generating, based on the first delay time, video content comprising a first portion of the first video feed; and sending the video content to a second device for presentation of the televised event.
    Type: Application
    Filed: December 12, 2022
    Publication date: June 13, 2024
    Applicant: Amazon Technologies, Inc.
    Inventors: Andrew Collins, Alexander Charles Mackin, Benoit Quentin Arthur Vallade, David William Higham, Erdem Durgut
  • Publication number: 20240114622
    Abstract: An electronic device includes a substrate including a core layer; a cavity formed in the core layer, wherein the cavity includes sidewalls plated with a conductive material; a prefabricated passive electronic component disposed in the cavity; and a cavity sidewall connection providing electrical continuity from the plated cavity sidewalls to a first surface of the substrate and to a second surface of the substrate.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: Kristof Darmawikarta, Srinivas Venkata Ramanuja Pietambaram, Tarek A. Ibrahim, Cary Kuliasha, Siddharth K. Alur, Jung Kyu Han, Beomseok Choi, Russell K. Mortensen, Andrew Collins, Haobo Chen, Brandon C. Marin
  • Publication number: 20240060350
    Abstract: A material-actuated door includes a door housing including a flexible material; and one or more least one Shape Memory Alloy (SMA) actuators embedded in the door housing. Each SMA actuator is elastically biased in a first actuator physical state and is configured to transition into a second actuator physical state in response to receiving electrical current. The material-actuated door is transitioned into a first door position in response to disconnecting the electrical current to the at least one SMA actuator, and is transitioned into a second door position in response to delivering the electrical current to the at least one SMA actuator.
    Type: Application
    Filed: December 15, 2022
    Publication date: February 22, 2024
    Inventors: Robert Andrew Collins, Joseph William Post, Timothy M. Quinn, James Joseph Stusse, William B. Coney
  • Patent number: 11889021
    Abstract: One example method of operation may include collecting call metric data over a predefined period of time for identified calls, querying the call metric data to identify whether one or more call filtering criteria parameters require changes, determining one or more call filtering criteria parameters require changes based on a deviation from one or more expected call metric data values included in the call metric data, modifying one or more of the call filtering criteria parameters, and updating an active call scam model stored on a call processing server based on the one or more call filtering parameters.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: January 30, 2024
    Assignee: FIRST ORION CORP.
    Inventors: Mark Hamilton Botner, Collin Michael Turney, Daniel Francis Kliebhan, Robert Francis Piscopo, Jr., Charles Donald Morgan, Jamelle Adnan Brown, Chee-Fung Choy, Samuel Kenton Welch, Nysia Inet George, Andrew Collin Shaddox
  • Publication number: 20230392006
    Abstract: A boron-free slime-like composition can include polyethylene oxide, cellulose, a filler, and water.
    Type: Application
    Filed: October 26, 2021
    Publication date: December 7, 2023
    Inventors: Shamshad F. Noor, Andrew Collins
  • Patent number: 11761461
    Abstract: A rotary servo valve comprising a housing portion (105) defining a cylindrical cavity (107) and a first layer of ports. The rotary servo valve further comprises two opposing indented sides and two opposing sides having an increased radius relative to the indented sides, each side of increased radius extending between the two indented sides. The spool portion (103) is mounted for rotation relative to the cylindrical cavity (107), from a neutral position so as to prevent fluid flow through the valve, to an open position in which a fluid flow path is provided.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: September 19, 2023
    Assignee: DOMIN FLUID POWER LIMITED
    Inventors: Andrew Collins, Martin MacDonald
  • Patent number: 11728294
    Abstract: A package substrate is disclosed. The package substrate includes a die package in the package substrate located at least partially underneath a location of a power delivery interface in a die that is coupled to the surface of the package substrate. Connection terminals are accessible on a surface of the die package to provide connection to the die that is coupled to the surface of the package substrate. Metal-insulator-metal layers inside the die package are coupled to the connection terminals.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: August 15, 2023
    Assignee: Intel Corporation
    Inventors: Andrew Collins, Sujit Sharan, Jianyong Xie
  • Patent number: 11729314
    Abstract: One example method of operation may include identifying a call from a caller and destined for a callee, receiving a data message associated with the call, forwarding the data message to a call processing server, processing the data message to identify one or more call parameters, comparing the one or more call parameters to an active call scam model applied by the call processing server, determining a scam score for the call based on the comparing of the one or more call parameters to the active call scam model applied by the call processing server, and determining whether to notify the callee that the call is a scam based on the scam score.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: August 15, 2023
    Assignee: FIRST ORION CORP.
    Inventors: Mark Hamilton Botner, Collin Michael Turney, Daniel Francis Kliebhan, Robert Francis Piscopo, Jr., Charles Donald Morgan, Jamelle Adnan Brown, Chee-Fung Choy, Samuel Kenton Welch, Nysia Inet George, Andrew Collin Shaddox
  • Publication number: 20230230181
    Abstract: Embodiments described herein are related to systems and methods for offering an upgrade for a transportation service. In one aspect, a computer can receive a reservation request for a transportation service including an itinerary indicating a first location, a second location, and a first service category of the transportation service. The computer can determine a plurality of reposition estimates for a plurality of service categories including the first service category and one or more potential service categories, each reposition estimate being determined based upon the first location, the second location, and a particular service category. The computer can identify, as a second service category, the potential service category having the reposition estimate lower than the reposition estimate of the first service category in the reservation request. The computer can transmit to the client device an upgrade notification indicating an eligibility to update the itinerary to include the second service category.
    Type: Application
    Filed: January 17, 2023
    Publication date: July 20, 2023
    Applicant: OneSky Flight LLC
    Inventors: Andrew Collins, Adam Hohulin, Michael Campobasso, Durga Ngalla, William Lanphear, David Syphers, Oleksandr Hendrik
  • Patent number: 11705398
    Abstract: Various embodiments relate to a semiconductor package. The semiconductor package includes a first die. The first die includes a first bridge interconnect region. The semiconductor package further includes a second die. The second die includes a second bridge interconnect region. The semiconductor package includes a bridge die. The bridge die includes a first contact area to connect to the first bridge interconnect region and a second contact area to connect to the second bridge interconnect region. In the semiconductor package, the first bridge interconnect region is larger than the second bridge interconnect region. Additionally, each of the first bridge interconnect region and the second bridge interconnect region include a plurality of conductive bumps. An average pitch between adjacent bumps of the first bridge interconnect region is larger than an average pitch between adjacent bumps of the second bridge interconnect region.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: July 18, 2023
    Assignee: Intel Corporation
    Inventors: Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath