Abstract: Methods for the enzymatic modification of saponins, products made thereby, uses of said products and also to other associated aspects. The saponins may be extracts of Quillaja species, such as extracts of Quillaja saponaria Molina.

Abstract: Methods and apparatus are described for improving fit checking at the bonding interface of a first component, such as a fan blade (1), and a second component, such as an edge guard (2) for the fan blade (1), to be bonded by adhesive. A bondline thickness profile over the area of the bonding interface is determined by interposing a compressible, flexible sensor layer between the components before they are bonded. The sensor layer contains an array of piezoelectric elements which indicate local bondline thickness by signalling pressure due to compression of the layer. The bondline thickness profile can be processed by a programmed control processor to produce an adhesive application schedule prescribing the shapes of pieces of adhesive film which, when applied over the bonding interface, will build up an adhesive layer corresponding in thickness to the bondline thickness. The sensor layer can be prepared as a kit of shaped panels or as a contoured preform (55) matching the form of the bonding interface.

Abstract: Methods and apparatus are described for improving fit checking at the bonding interface of a first component, such as a fan blade (1), and a second component, such as an edge guard (2) for the fan blade (1), to be bonded by adhesive. A bondline thickness profile over the area of the bonding interface is determined by interposing a compressible, flexible sensor layer between the components before they are bonded. The sensor layer contains an array of piezoelectric elements which indicate local bondline thickness by signalling pressure due to compression of the layer. The bondline thickness profile can be processed by a programmed control processor to produce an adhesive application schedule prescribing the shapes of pieces of adhesive film which, when applied over the bonding interface, will build up an adhesive layer corresponding in thickness to the bondline thickness. The sensor layer can be prepared as a kit of shaped panels or as a contoured preform (55) matching the form of the bonding interface.

Abstract: A measurement fixture has a plurality of optically-detectable elements, preferably infrared LEDs. In use, an object is attached in fixed spatial relationship to the fixture, and an optical measuring device detects the elements to provide relative tracking of the object relative to a reference. This allows for improved control and accuracy, particularly in machining operations and in the control of robots.

Abstract: A measurement fixture has a plurality of optically-detectable elements, preferably infrared LEDs. In use, an object is attached in fixed spatial relationship to the fixture, and an optical measuring device detects the elements to provide relative tracking of the object relative to a reference. This allows for improved control and accuracy, particularly in machining operations and in the control of robots.