Abstract: A network device that includes a temperature sensor module is provided. The network device can include a host printed circuit board, one or more processors mounted on a surface of the host printed circuit board, a port protruding from the surface of the host printed circuit board, and a temperature sensor module that is raised over the surface of the host printed circuit board to provide thermal decoupling from the surface of the host printed circuit board. The temperature sensor module can include a sensor printed circuit board, a temperature sensor integrated circuit die disposed on a first side of the sensor printed circuit board, and an exposed conductive pad disposed on a second side of the sensor printed circuit board. The temperature sensor module can include multiple exposed contacts or a plug configured to mate with the protruding port.

Abstract: A method and an apparatus for an application thinning mechanism are described. The thinning mechanism can select a subset of components from a universal application to assemble an application variant to be distributed and installed to a specific type of devices. The universal application may include every component, such as asset, resource or executable, built/developed for targeted device attributes to install one common application to multiple devices. For example, the thinning mechanism can use a trait vector associated with a type of devices to iterate through the components and identify assets to be included or packaged into in each target device specific application or application variant.

Abstract: A method and an apparatus for an application thinning mechanism are described. The thinning mechanism can select a subset of components from a universal application to assemble an application variant to be distributed and installed to a specific type of devices. The universal application may include every component, such as asset, resource or executable, built/developed for targeted device attributes to install one common application to multiple devices. For example, the thinning mechanism can use a trait vector associated with a type of devices to iterate through the components and identify assets to be included or packaged into in each target device specific application or application variant.