Abstract: A system for managing and monitoring a sensor network that senses pest activity. A plurality of sensor stations may be controlled by the system, such sensor station configured for detecting the presence of pests at a baiting station, or for alerting users to the presence of a pest in a trap, as well as a related system of data collection and data management of pest activity data.

Abstract: A system for managing and monitoring a sensor network that senses pest activity. A plurality of sensor stations may be controlled by the system, such sensor station configured for detecting the presence of pests at a baiting station, or for alerting users to the presence of a pest in a trap, as well as a related system of data collection and data management of pest activity data.

Abstract: The present disclosure relates to a system for managing and monitoring a sensor network that senses pest activity. A plurality of sensor stations may be controlled by the system, such sensor station configured for detecting the presence of pests at a baiting station, or for alerting users to the presence of a pest in a trap, as well as a related system of data collection and data management of pest activity data.

Abstract: The present disclosure relates to a system for managing and monitoring a sensor network that senses pest activity. A plurality of sensor stations may be controlled by the system, such sensor station configured for detecting the presence of pests at a baiting station, or for alerting users to the presence of a pest in a trap, as well as a related system of data collection and data management of pest activity data.

Abstract: A structurally supportive backer panel formed to fit within the recesses of a form liner to support the form liner when casting textured surfaces into concrete. The backer panel has a series of protrusions which fit within the recesses of the form liner in order to prevent the concrete pressure from deflecting and buckling the form liner. When the wet concrete is poured into a form fitted with the backer panel and form liner, the concrete fills the form and contacts the form liner, wherein the backer panel ensures that the shape of the form liner is not affected by the pressure and weight of the concrete.

Abstract: A structurally supportive backer panel formed to fit within the recesses of a form liner to support the form liner when casting textured surfaces into concrete. The backer panel has a series of protrusions which fit within the recesses of the form liner in order to prevent the concrete pressure from deflecting and buckling the form liner. When the wet concrete is poured into a form fitted with the backer panel and form liner, the concrete fills the form and contacts the form liner, wherein the backer panel ensures that the shape of the form liner is not affected by the pressure and weight of the concrete.

Abstract: A structurally supportive backer panel formed to fit within the recesses of a form liner to support the form liner when casting textured surfaces into concrete. The backer panel has a series of protrusions which fit within the recesses of the form liner in order to prevent the concrete pressure from deflecting and buckling the form liner. When the wet concrete is poured into a form fitted with the backer panel and form liner, the concrete fills the form and contacts the form liner, wherein the backer panel ensures that the shape of the form liner is not affected by the pressure and weight of the concrete.

Abstract: A method for measuring an integrated circuit (IC) structure by measuring an imprint of the structure, a method for preparing a test site for the above measuring, and IC so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint of the removed bottom surface of the structure in a top surface of the substrate. The imprint can then be imaged using an atomic force microscope (AFM). The image can be used to measure the bottom surface of the structure.

Abstract: A method for measuring an integrated circuit (IC) structure by measuring an imprint of the structure, a method for preparing a test site for the above measuring, and IC so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint of the removed bottom surface of the structure in a top surface of the substrate. The imprint can then be imaged using an atomic force microscope (AFM). The image can be used to measure the bottom surface of the structure.

Abstract: A method for measuring an integrated circuit (IC) structure by measuring an imprint of the structure, a method for preparing a test site for the above measuring, and IC so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint of the removed bottom surface of the structure in a top surface of the substrate. The imprint can then be imaged using an atomic force microscope (AFM). The image can be used to measure the bottom surface of the structure.

Abstract: Apparatus for exposure and probing of features in a semiconductor workpiece includes a hollow concentrator for covering a portion of the workpiece connected by a gas conduit to a supply of etchant gas. A stage supports and positions the semiconductor workpiece. Control means moves the stage and the semiconductor workpiece to the series of positions sequentially. An energy beam source directs a focused energy beam through an aperture through the concentrator onto a region on the surface of the workpiece in the presence of the etchant gas. The control means moves the stage to a series of positions with respect to the concentrator and the energy beam to direct the energy beam in the presence of the etchant gas to expose a series of regions on the surface of the semiconductor workpiece positioned below the hollow interior space of the concentrator, sequentially.

Abstract: Apparatus for exposure and probing of features in a semiconductor workpiece includes a hollow concentrator for covering a portion of the workpiece connected by a gas conduit to a supply of etchant gas. A stage supports and positions the semiconductor workpiece. Control means moves the stage and the semiconductor workpiece to the series of positions sequentially. An energy beam source directs a focused energy beam through an aperture through the concentrator onto a region on the surface of the workpiece in the presence of the etchant gas. The control means moves the stage to a series of positions with respect to the concentrator and the energy beam to direct the energy beam in the presence of the etchant gas to expose a series of regions on the surface of the semiconductor workpiece positioned below the hollow interior space of the concentrator, sequentially.

Abstract: A method for measuring an integrated circuit (IC) structure by measuring an imprint of the structure, a method for preparing a test site for the above measuring, and IC so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint of the removed bottom surface of the structure in a top surface of the substrate. The imprint can then be imaged using an atomic force microscope (AFM). The image can be used to measure the bottom surface of the structure.